EP1C6T144I6ES - Cyclone FPGA, 5,980 LEs, TQFP-144 | Intel (Altera)
MPN: EP1C6T144I6ES ✗ Cuối đờiEP1C6T144I6ES Tóm tắt
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory blocks that the user can re-program after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs and ASICs, and offer the best balance of density, performance, and time-to-market for mid-complexity glue logic, bus interfacing, and signal-processing pipelines. The Cyclone family is positioned at the entry/low-power tier of the Altera (now Intel PSG) portfolio, above CPLDs and below the Cyclone II/III/IV/V and Stratix families.
Key features of the EP1C6T144I6ES include 5,980 LEs, approximately 92 Kbits of embedded RAM distributed across M4K blocks, two PLLs per device for clock multiplication and phase shifting, and support for LVDS, LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards through the 144-pin TQFP exposed-pad package. The TQFP-144 footprint is a 22 mm x 22 mm body with 0.5 mm pitch and gull-wing leads, fully lead-free and RoHS-compliant, with a maximum seated height of 1.6 mm.
Architecture-wise, the EP1C6 implements a 1.5 V core voltage with a 4-wire passive serial or JTAG configuration interface, supports configuration via Altera EPC configuration devices, and is fabricated on a 0.13 um SRAM process node. Logic is built from 4-input look-up tables (LUT4) grouped into Logic Array Blocks (LABs), each LAB containing ten LEs. Embedded multiplier support is not present in this generation (multipliers were introduced in Cyclone II), so DSP functions are typically implemented as soft logic.
Typical applications of the EP1C6T144I6ES include industrial control boards, glue-logic bridging between microprocessors and peripherals, video/display interface conversion (e.g., ITU-R BT.656 capture), serial-protocol bridging (UART/SPI/I2C expansion), low-volume prototyping for ASIC replacement, and educational platforms where a through-hole-friendly 0.5 mm-pitch TQFP simplifies manual rework.
Designers should note that the EP1C6 family supports vertical migration within the same TQFP-144 footprint across the EP1C3 and EP1C6 density points, enabling a single PCB layout to serve multiple logic-capacity SKUs. The 'I6' suffix denotes the industrial temperature range and the slowest speed grade in the family; faster 'I7' and 'I8' variants are available for timing-critical designs.
This page synthesizes verified distributor pricing, same-package drop-in alternatives, and practical Quartus II / Quartus Prime legacy toolchain notes not consolidated in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EP1C6T144I6ES — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1C6T144I6ES (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Operating Temperature, Configuration Modes.
EP1C6T144C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6T144I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6T144I-7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6T144C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C3T144I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6T144C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6T144I6ES Tỷ lệ tối đa & tính chất điện
| Family | Cyclone |
| Logic Elements (LEs) | 5,980 |
| Logic Array Blocks (LABs) | 598 (10 LEs per LAB) |
| Maximum Internal Frequency | 405 MHz |
| Total RAM Bits | 92,160 (approx 92 Kbits) |
| Embedded Multipliers | 0 (not supported in this generation) |
| PLLs | 2 |
| Hộp | TQFP-144 (22 x 22 mm, 0.5 mm pitch, gull-wing, lead-free) |
| Package Code (JEDEC) | LFQFP |
| Maximum Seated Height | 1.6 mm |
| Core Voltage | 1.5 V (typ) |
| Khoảng nhiệt độ hoạt động | -40C to +100C (industrial, 'I' suffix) |
| Speed Grade | I6 (industrial, slowest grade) |
| Configuration Interface | JTAG, Passive Serial (PS), EPC configuration devices |
| Process Node | 0.13 um SRAM |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant per Verified Web Data) |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, SSTL-2, SSTL-3 |
| Kiểu lắp đặt | Surface Mount |
Hướng dẫn cấu hình chân EP1C6T144I6ES lfqfp
Cấu hình chân cho EP1C6T144I6ES (lfqfp gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1C6T144I6ES.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1C6T144I6ES phù hợp cho 6 Áp dụngs: Industrial Control Glue Logic, Legacy ASIC Replacement & Bridge IC, Video/Display Interface Conversion (BT.656, VGA), Serial Protocol Bridging (UART/SPI/I2C Expansion), Educational FPGA Platform / Prototyping Board, Automotive Aftermarket & Telematics Legacy Modules.
Industrial Control Glue Logic
The EP1C6T144I6ES fits industrial control boards where a small FPGA must bridge between a microcontroller and legacy peripherals. Its 5,980 LEs and 92 Kbits of embedded RAM handle 32-bit register-mapped bus decode, address-latch demultiplexing, and custom timing-state machines that are awkward to implement in discrete 74-series logic. The industrial temperature range (-40C to +100C) per Verified Web Data matches IEC 60068-2-1/2-2 environmental profiles, and the 0.5 mm-pitch TQFP-144 supports hand-rework in low-volume production. Designers route the 1.5 V core from an LDO powered by the 24 V industrial bus and use the two on-chip PLLs to synthesize the 405 MHz fabric clock from a 50 MHz crystal, then implement Modbus RTU or CAN 2.0B soft MACs in the LUT fabric.
Được đề xuất
Legacy ASIC Replacement & Bridge IC
The EP1C6T144I6ES is commonly deployed as a one-off ASIC replacement where a discontinued gate-array IC must be replicated without a board respin. With 5,980 LEs and two PLLs, it can implement the equivalent of roughly 15-20K ASIC gates including a soft 16-bit processor core. The TQFP-144 land pattern is the same as the EP1C3 TQFP-144 footprint, allowing the PCB to be reworked to either density per the Cyclone vertical-migration specification. Engineers source configuration bitstreams into EPC2 or EPC4 PROMs through the Passive Serial interface, allowing in-field firmware updates via JTAG without removing the FPGA from the board.
Được đề xuất
Video/Display Interface Conversion (BT.656, VGA)
The EP1C6T144I6ES is well-suited to video-format conversion applications such as ITU-R BT.656 to parallel-RGB bridging or VGA timing generation for legacy LCD panels. Its two PLLs synthesize the 27 MHz video reference and pixel clock, while the 92 Kbits of embedded RAM (in 4-Kbit M4K blocks) buffer scan-line data and color-lookup tables without external memory. I/O standards supported include LVTTL, LVCMOS, and LVDS per Verified Web Data, allowing direct connection to BT.656 video decoder chips and LVDS display panels. The 405 MHz internal performance envelope provides sufficient timing margin for 720p60 timing generation.
Được đề xuất
Serial Protocol Bridging (UART/SPI/I2C Expansion)
The EP1C6T144I6ES serves as a multi-protocol bridge in test equipment and embedded systems where a host processor must fan out to many slow peripherals. With 5,980 LEs it can implement 8-12 soft UART cores, 4-6 SPI masters, or 2-3 I2C controllers concurrently, far more density than CPLDs at this price point. The TQFP-144 industrial-grade package supports the -40C to +100C range, and the 0.5 mm pitch is workable for prototype hand-soldering. Designers use M4K RAM blocks for FIFO buffering between the host DMA channel and the peripheral byte streams, and the two PLLs generate protocol-specific baud clocks from a single 50 MHz reference.
Được đề xuất
Educational FPGA Platform / Prototyping Board
The EP1C6T144I6ES is a common teaching-platform FPGA in university laboratories and low-volume prototyping kits because the TQFP-144 0.5 mm pitch is hand-reworkable with a fine-tip iron, unlike fine-pitch BGAs. Students learn Verilog/VHDL with 5,980 LEs of capacity, two PLLs, and 92 Kbits of RAM - enough to implement soft-CPU cores (Nios II, MicroBlaze MCS, RISC-V RV32I) and simple peripherals. Quartus II Web Edition v13.0sp1 supports this device for free. Verified Web Data from Microchip USA notes 405 MHz clock performance, providing headroom for pipelined student projects such as FFT cores or RISC-V SoCs.
Được đề xuất
Automotive Aftermarket & Telematics Legacy Modules
Although the EP1C6T144I6ES is not AEC-Q100 qualified, it is widely deployed in aftermarket automotive modules (telematics loggers, fleet-management retrofits, OBD-II diagnostic bridges) where the OEM specification was written before AEC-Q100 mandates. Its industrial -40C to +100C temperature range covers cabin and trunk environments, and the TQFP-144 footprint is robust to the vibration profile of in-vehicle mounting. The 5,980 LEs handle CAN bus sniffing, GPS NMEA parsing, and 2G/3G modem command framing in a single device. Designers pair it with a small automotive MCU and EPC configuration PROMs for field upgradability.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1C6T144I6ES — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1C6T144C8N | EP1C6T144I7N | EP1C6T144C6N | EP1C3T144I7N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-144 (22x22 mm, 0.5 mm pitch) | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs | 2,910 LEs (-51%) |
| Embedded RAM | 92,160 bits | 92,160 bits | 92,160 bits | 92,160 bits | 58,496 bits (-37%) |
| PLLs | 2 | 2 | 2 | 2 | 1 (-50%) |
| Speed Grade | I6 (industrial slowest) | C8 (commercial fastest) | I7 (industrial faster) | C6 (commercial slow) | I7 (industrial faster) |
| Temperature Range | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Industrial -40C to +100C temperature range with I6 speed grade in TQFP-144 (vsEP1C6T144C8N)
- Vertical-migration compatibility with EP1C3 TQFP-144 (vsEP1C3T144I7N)
- Two on-chip PLLs for clock synthesis (vsEP1C6T144C6N)
Ghi chú thiết kế
Estimated: at full I/O toggle on all pins at 3.3 V LVTTL, the EP1C6T144I6ES core dissipation is roughly 200-400 mW depending on toggle rate. The TQFP-144 package has no exposed thermal pad, so all heat must exit through the gull-wing leads into the PCB. Use a copper pour of at least 1 square inch under and around the device on top and inner PCB layers to keep junction temperature below 100C at industrial ambient. Avoid placing the FPGA adjacent to high-power switching regulators - the 0.13 um process is sensitive to local hot-spot coupling.
Route the 1.5 V core supply from a low-noise LDO (e.g., TI TPS7A4533 or LT1764A) with a 22 uF tantalum + 100 nF X7R ceramic bulk-filter network placed within 5 mm of the VCCINT pins. Decouple every VCCIO bank with 0.1 uF X7R per pin plus a shared 10 uF bulk capacitor per bank. TQFP-144 routing requires 4-layer PCB minimum with 0.20 mm traces and 0.20 mm clearances to break out the 0.5 mm-pitch leads; 6 layers are recommended for high-speed LVDS designs. The JTAG TCK pin must be pulled to a known state with a 10 kohm resistor to prevent spurious configuration.
Do not confuse speed grades: 'I6' is the slowest industrial grade, not the fastest. Quartus II timing analysis will fail closed timing if a design optimized for I7/I8 is downloaded to an I6 device without re-running the fitter. Similarly, do not assume JTAG IDs are unique across the Cyclone family - always read the silicon ID via the EPC-compatible ByteBlaster II before assuming the device has been correctly recognized. The MSL rating is not specified in the public datasheet, so treat the part as MSL3 and bake 24 hours at 125C before assembly if the sealed package has been open more than 168 hours.
Thông tin tuân thủ
RoHS compliant and lead-free per Verified Web Data (Kynix: 'LEAD FREE', LFQFP package code). AEC-Q100 not qualified - not suitable for new automotive designs without qualification. Halogen-free status and conflict-mineral compliance not explicitly stated in verified data.
