EP1K100FC256-1N - 100K Gates 49Kbit SRAM ACEX-1K FPGA | Altera | BGA-256
MPN: EP1K100FC256-1N ✗ Cuối đờiEP1K100FC256-1N Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the designer can reconfigure after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable logic hierarchy beneath CPLDs (which are simpler, non-volatile, and lower density) and above fixed-function ASICs, occupying the niche where fast time-to-market, in-system reprogrammability, and parallel hardware acceleration outweigh the per-unit cost advantage of masked ASICs.
Key features of the EP1K100FC256-1N include 624 logic array blocks (LABs) each containing 8 LEs, dedicated dual-port EAB (Embedded Array Block) memory supporting true dual-port RAM, ROM, and FIFO functions, built-in JTAG IEEE 1149.1 boundary-scan support, and 2.5 V core operation with multi-voltage I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces through configurable I/O standards including LVTTL, LVCMOS, PCI, and SSTL. The device is configured via Altera's serial or parallel configuration scheme using a passive serial (PS), passive parallel synchronous (PPS), or passive parallel asynchronous (PPA) configuration mode driven by an external PROM or microcontroller.
Typical applications include glue-logic replacement for multiple 74-series TTL parts, low-volume prototype-to-production bridge designs, peripheral bus controllers (PCI bridges, ISA-to-PCI converters), serial protocol bridges (UART, SPI, I2C), digital signal processing front-ends, industrial control logic, and education/training platforms where low cost and Quartus II software support are essential. Its 256-ball BGA package enables dense PCB layouts but requires careful fan-out routing on at least a 4-layer board.
When designing with the EP1K100FC256-1N, ensure adequate decoupling (0.1 µF per VCC pin plus 10 µF bulk), controlled-impedance routing for clock traces, and a robust configuration circuit because SRAM-based FPGAs lose their configuration on every power cycle and must be reconfigured at boot. Designers should also verify supply ramp time falls within the datasheet limits to avoid configuration latch-up.
This page synthesizes distributor pricing, ACEX-1K family drop-in alternatives, and practical BGA layout design notes not consolidated in any single manufacturer document.
Bộ thay thế dễ dàng lắp đặt cho EP1K100FC256-1N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1K100FC256-1N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Process Technology, Total RAM Bits, Operating Temperature.
EP1K100FC256-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K100FC256-2N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K100FC256-3N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K100FI256-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1K100FI256-2
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1K100FI256-1N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP1K100FC256-1N Tỷ lệ tối đa & tính chất điện
| Family | ACEX-1K |
| Logic Elements | 4,992 |
| Typical Gates | 100,000 |
| Maximum User I/O | 186 |
| Embedded SRAM | 49,152 bits |
| Logic Array Blocks (LABs) | 624 |
| Embedded Array Blocks (EABs) | 12 |
| Hộp | 256-ball FineLine BGA |
| Process Technology | 0.18 µm SRAM-based |
| Core Voltage | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, SSTL (1.5 V / 1.8 V / 2.5 V / 3.3 V) |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Speed Grade | -1 |
| Configuration Mode | Passive Serial / Passive Parallel (Synchronous & Asynchronous) |
| JTAG Support | IEEE 1149.1 Boundary-Scan |
| Lead-Free (N suffix) | Yes (Pb-free BGA) |
Hướng dẫn cấu hình chân EP1K100FC256-1N 256-ball fineline bga
Cấu hình chân cho EP1K100FC256-1N (256-ball fineline bga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1K100FC256-1N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1K100FC256-1N phù hợp cho 6 Áp dụngs: Glue-Logic Replacement, Industrial Control Logic, Peripheral Bus Bridge (PCI / ISA), Serial Protocol Bridge, Digital Signal Processing Front-End, Education and Training Platform.
Glue-Logic Replacement
The EP1K100FC256-1N replaces multiple discrete 74-series TTL/CMOS logic packages with a single reprogrammable device, simplifying PCB layout and BOM cost. Its 4,992 LEs and 624 LABs comfortably absorb the gate-equivalent of 20-30 SSI/MSI packages per chip. The SRAM-based architecture allows design changes via JTAG without board rework, ideal for evolving glue logic. With 186 user I/Os and multi-voltage I/O banks, the device bridges 3.3 V peripherals to 2.5 V or 1.8 V cores. Power consumption is typically 0.5-1.5 W depending on toggle rate, making it suitable for fanless industrial chassis.
Được đề xuất
Industrial Control Logic
The EP1K100FC256-1N implements state machines, PID controllers, and motor-control timing logic in industrial automation equipment. Its 49,152 bits of dual-port SRAM on-chip supports high-speed lookup tables and waveform storage without external memory. The 256-ball BGA allows dense I/O routing for encoder inputs, PWM outputs, and fieldbus interfaces. Designers favor this part for legacy PLC I/O expansion cards because the Quartus II toolchain remains free and well-supported. Industrial users should choose the EP1K100FI256-2 variant for the wider -40 C to +85 C temperature window.
Được đề xuất
Peripheral Bus Bridge (PCI / ISA)
The EP1K100FC256-1N was widely adopted as a PCI-to-ISA or PCI-to-local-bus bridge in legacy add-in cards and embedded motherboards. Its 624 LABs handle the 33 MHz PCI target or master state machine, while the 12 EABs implement FIFOs for bus posting and posted-write buffers. The device's 2.5 V core and 3.3 V-tolerant I/O banks interface directly to PCI 2.2 signaling without external level translators. The 186 user I/O count provides ample headroom for secondary buses such as IDE, USB 1.1, or parallel ATA. Engineers reading old PCI reference designs will find numerous Quartus II example projects targeting this exact part.
Được đề xuất
Serial Protocol Bridge
The EP1K100FC256-1N implements UART, SPI, I2C, and CAN bridges between microcontrollers and legacy peripherals in test equipment and instrumentation. Its 49 Kbit dual-port SRAM acts as a hardware FIFO for high-speed UARTs up to 10 Mbaud or CAN 2.0B streams. Multi-voltage I/O banks allow direct connection to 1.8 V MCUs and 5 V peripherals without level shifters, provided the VCCIO banks are configured correctly. Engineers can implement a 4-channel UART bridge (16C554-compatible) in approximately 1,200 LEs, leaving the remainder for custom protocol conversion. The part's JTAG support simplifies in-field firmware updates via Quartus II Programmer.
Được đề xuất
Digital Signal Processing Front-End
The EP1K100FC256-1N is suitable for DSP front-end tasks such as FIR filtering, FFT preprocessing, and data acquisition gating in moderate-bandwidth (under 50 MSPS) applications. Its 12 EABs can be cascaded to build shift-register-based FIR filters up to 64 taps with 8-bit coefficients. The 49 Kbit dual-port SRAM stores time-domain sample windows for spectral analysis. For audio-rate DSP (44.1 kSPS to 192 kSPS), the device easily implements custom sample-rate converters and digital crossovers. Higher-speed DSP tasks (above 100 MSPS) require modern Cyclone IV or Stratix families; the ACEX-1K is best for cost-sensitive legacy audio and instrumentation.
Được đề xuất
Education and Training Platform
Universities and technical institutes continue to use the EP1K100FC256-1N on legacy Altera development boards (e.g., Nios development kits, University Program boards) for teaching digital logic and embedded design. The free Quartus II Web Edition supports the entire ACEX-1K family, making the part attractive for cost-sensitive classroom deployments. Students learn VHDL/Verilog, finite-state-machine design, and timing analysis on a real 100K-gate device rather than a simulator-only environment. The 256-ball BGA exposes students to high-density PCB layout techniques and signal-integrity considerations. Although Altera recommends Cyclone IV for new curricula, the EP1K100FC256-1N remains in service on hundreds of donated lab kits.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1K100FC256-1N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1K100FC256-1 | EP1K100FC256-2N | EP1K100FC256-3N | EP1K100FI256-2N | EP1K100FI256-1N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -1 | -1 | -2 (faster) | -3 (slowest, lowest power) | -2 (faster) | -1 |
| Temperature Grade | Commercial (0 C to +70 C) | Commercial | Commercial | Commercial | Industrial (-40 C to +85 C) | Industrial (-40 C to +85 C) |
| Embedded SRAM | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| Maximum User I/O | 186 | 186 | 186 | 186 | 186 | 186 |
| BGA Ball Finish | Lead-free (N suffix) | SnPb (leaded) | Lead-free | Lead-free | Lead-free | Lead-free |
Bảo phân biệt quan trọng
- Lead-free ball finish (RoHS compliant) (vsEP1K100FC256-1)
- Fastest speed grade in the family (vsEP1K100FC256-3N)
- Commercial temperature window for cost-sensitive designs (vsEP1K100FI256-2N)
Ghi chú thiết kế
Estimated: The 256-ball FineLine BGA has a 1.0 mm ball pitch, which requires a 4-layer PCB minimum with laser-drilled microvias or 6-layer stack-up with conventional 0.2 mm vias for reliable fan-out. Per the ACEX-1K datasheet, route all VCCINT and VCCIO pins to power planes, not traces, and place one 0.1 µF 0402 ceramic decoupling capacitor within 2 mm of every VCC pin. Add 10 µF X5R bulk capacitors per power rail near the package perimeter. Maintain a continuous ground plane beneath the BGA to control return-current paths for the 186 user I/Os.
Because the EP1K100FC256-1N is SRAM-based, it loses its configuration on every power-down and must be reconfigured at boot via an external EPC2-series configuration PROM or a microcontroller. Per the Altera ACEX-1K datasheet, the nCONFIG pin must be held low until VCCINT and VCCIO rails reach their minimum thresholds (2.375 V and 1.35 V respectively), then pulsed high to initiate configuration. A poorly designed reset sequence can leave the device in an undefined state where outputs drive random patterns - always sequence the reset after the configuration PROM is ready (nSTATUS high, CONF_DONE low).
Estimated: For BGA-256 fan-out, use a dog-bone or via-in-pad pattern with 0.5 mm via pads and 0.2 mm drill. Keep signal trace length matching to within 1 mm for clock and global signal pairs. Place the configuration EPC2 or EPCS device within 50 mm of the FPGA DATA/DCLK pins to minimize skew. If your design uses JTAG for boundary-scan test, place 10 kΩ pull-ups on TCK, TMS, TDI and leave TDO unterminated per IEEE 1149.1. The 49 Kbit embedded SRAM should be backed by read-only parity or ECC for safety-critical applications.
Estimated: Power dissipation scales with toggle rate and output loading; typical commercial designs at 50 MHz toggle rate and 50 pF loads dissipate 0.8-1.5 W. The FineLine BGA has a theta-JA of approximately 18 °C/W with a standard 4-layer JEDEC test board, so a 1.5 W load produces a 27 °C temperature rise above ambient - well within the 70 °C commercial limit. For industrial designs using the EP1K100FI256-2 variant, ensure worst-case junction temperature stays below 100 °C to maintain timing margins.
Thông tin tuân thủ
RoHS compliance confirmed by 'N' suffix on MPN denoting Pb-free BGA ball finish. AEC-Q100 not applicable - this is an FPGA, not a power semiconductor. Halogen-free and conflict-minerals declarations not stated in the verified web data; set to 'unknown'.
