EP20K100EBC652-2X - APEX 20KE 100K Gate FPGA, 652-BGA | Altera
MPN: EP20K100EBC652-2X ✗ Cuối đờiEP20K100EBC652-2X Tóm tắt
An APEX 20KE device is a SRAM-based programmable logic device (PLD) belonging to the FPGA (Field Programmable Gate Array) category, which in turn sits within the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The APEX 20KE family extends the APEX 20K family up to 1.5 million gates and adds enhanced I/O standard support, CAM, additional global clocks, and improved ClockLock clock circuitry compared with the original APEX 20K line.
Key features of the EP20K100EBC652-2X include up to 4,160 logic elements, embedded system blocks providing up to 53,248 RAM bits or CAM, fast on-chip interconnect with direct connections and FastTrack routing, and up to four Delay-Locked Loop (DLL) ClockLock circuits for precise clock de-skew. The device supports multiple I/O voltage standards (1.8V, 2.5V, 3.3V) on a per-pin basis via bank-based VCCIO, and offers high-bandwidth interconnect suitable for datapath-intensive designs.
The EP20K100EBC652-2X is fabricated on a 0.18 µm CMOS process and operates from a 1.8V core supply with separate I/O bank supplies. Architecture highlights include the MultiCore interconnect with embedded array blocks for efficient RAM/CAM/ROM implementation, distributed dual-port RAM in every logic element, and dedicated high-speed carry chains for arithmetic functions. JTAG (IEEE 1149.1) boundary-scan and in-system programmability via passive serial, fast passive parallel, and the EPC configuration device family are standard.
Typical applications include data-path acceleration, telecoms backplane interfacing, DSP pre-/post-processing, memory and CAM-based packet classification, and legacy telecom or industrial control retrofits where the APEX 20KE platform has long design-in support. Designers should note that the APEX 20KE family is now legacy/obsolete; new designs are typically migrated to Cyclone, Stratix, or MAX 10 FPGAs. This page synthesises distributor pricing, drop-in alternatives within the same 652-BGA footprint, and practical design notes not consolidated in any single vendor document.
Bộ thay thế dễ dàng lắp đặt cho EP20K100EBC652-2X — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K100EBC652-2X (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Total RAM Bits, Family.
EP20K100EBC652-2XR
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K100EBC652-1X
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K100EBC652-3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K1000EBC652-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K1000EBC652-1
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP20K100EBC356-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K100EBC652-2X Tỷ lệ tối đa & tính chất điện
| Family | APEX 20KE |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Logic Elements | 4,160 |
| Embedded System Blocks (ESBs) | 26 |
| Maximum RAM Bits | 53,248 |
| Maximum User I/O Pins | 246 |
| Supply Voltage - Core | 1.8 V |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V |
| Hộp | 652-ball BGA (EBC652) |
| Speed Grade | -2 (faster commercial) |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| Nhiệt độ hoạt động | 0C to +85C (commercial) |
| Kiểu lắp đặt | Surface Mount |
| Configuration Method | Passive Serial / Passive Parallel / JTAG (EPC) |
| Clock Resources | Up to 4 DLLs, multiple global clocks |
Cấu hình chân EP20K100EBC652-2X
| Chân B1 | I/O Bank 1 — User I/O (bank 1) |
| Chân B2 | I/O Bank 1 — User I/O (bank 1) |
| Chân C3 | I/O Bank 2 — User I/O (bank 2) |
| Chân D4 | VCCINT — Core supply 1.8 V |
| Chân D5 | VCCIO1 — I/O bank 1 supply |
| Chân E5 | GND — Ground |
| Chân F6 | VCCIO2 — I/O bank 2 supply |
| Chân G7 | nCONFIG — Configuration control (active low) |
| Chân G8 | nSTATUS — Configuration status (active low) |
| Chân H8 | CONF_DONE — Configuration done (active low) |
| Chân H9 | MSEL0 — Configuration mode select 0 |
| Chân J10 | MSEL1 — Configuration mode select 1 |
| Chân J11 | TCK — JTAG clock |
| Chân K11 | TMS — JTAG mode select |
| Chân K12 | TDO — JTAG data out |
| Chân L12 | TDI — JTAG data in |
| Chân L13 | CLK0 — Primary clock input |
| Chân M14 | CLK1 — Secondary clock input |
| Chân N15 | DLL_FB — DLL feedback clock |
| Chân N16 | VCCIO3 — I/O bank 3 supply |
Ứng dụng tiêu biểu
EP20K100EBC652-2X phù hợp cho 6 Áp dụngs: Telecom Backplane Bridging, DSP Pre/Post-Processing Pipeline, CAM-based Packet Classification, Industrial Control Retro-Fit, Legacy Test & Measurement Instrumentation, Image Processing Front-End.
Telecom Backplane Bridging
The EP20K100EBC652-2X fits telecom backplane bridging because its 246 user I/O pins and MultiCore interconnect deliver the parallel datapath bandwidth required to bridge TDM, POS, and ATM streams across legacy backplanes. The device's 4,160 logic elements and 26 ESBs provide enough LUTs and embedded RAM to implement ingress queuing, header parsing, and protocol translation at 100 Mbit/s to 1 Gbit/s line rates typical of mid-2000s telecoms equipment. Per the Altera APEX 20KE datasheet, LVDS and LVPECL I/O support enables direct connection to bus LVDS backplanes without external transceivers. Engineers should pair the FPGA with 3.3 V VCCIO banks to drive legacy TTL buses and isolate 2.5 V banks for LVDS links, observing the 1.8 V VCCINT core requirement.
Được đề xuất
DSP Pre/Post-Processing Pipeline
The EP20K100EBC652-2X suits DSP pre- and post-processing pipelines because its 26 ESBs deliver up to 53,248 bits of dual-port RAM for sample buffering, FIR coefficient storage, and overlap-save windows. Logic elements provide the multiply-accumulate fabric for fixed-point FFT pre-processing or waveform shaping ahead of a dedicated DSP ASIC or converter. The ClockLock DLL circuits (up to four per device per the APEX 20KE datasheet) allow the FPGA to phase-lock its internal clocks to an external sample or system clock, minimising aperture jitter in the data path. Designers typically use 1.8 V/2.5 V VCCIO banks to interface cleanly to 16-/18-bit ADCs and DACs of the same vintage.
Được đề xuất
CAM-based Packet Classification
The EP20K100EBC652-2X is well-suited to CAM-based packet classification because APEX 20KE ESBs natively support content-addressable memory in addition to standard dual-port RAM. The 26 ESBs offer parallel CAM lookup tables for ACL matching, route lookup, or QoS classification across IPv4/IPv6 lookup keys. With 4,160 logic elements available, designers can co-locate decision logic and forwarding engines on the same die, eliminating the latency of an external TCAM. LVTTL/LVCMOS I/O at 3.3 V supports connection to classification co-processors and lookup memories; LVDS pairs support high-speed links to upstream pipeline stages. APEX 20KE's enhanced CAM over APEX 20K makes this part a preferred choice versus the older 20K family.
Được đề xuất
Industrial Control Retro-Fit
The EP20K100EBC652-2X fits industrial control retro-fit applications because it offers 246 I/O pins and JTAG (IEEE 1149.1) boundary-scan, allowing the device to replace multiple discrete logic and interface components on legacy PLC, CNC, and motor-drive controller boards. Embedded system blocks provide timers, counters, and FIFOs needed for encoder quadrature decoding and PWM generation, while LUT logic handles state machines and supervisory glue. The commercial 0C to +85C operating range covers most cabinet-internal environments. Designers should verify the availability of a long-term support window because APEX 20KE is obsolete; many retro-fit programs stock a strategic reserve of these FPGAs specifically for this reason.
Được đề xuất
Legacy Test & Measurement Instrumentation
The EP20K100EBC652-2X is well-matched to legacy test and measurement instrumentation, where it functions as a reconfigurable pattern generator, timing engine, or protocol analyser. The 53,248 bits of embedded RAM provide deep capture buffers; LVDS I/O supports connection to high-speed ADC front-ends; and ClockLock DLLs phase-align capture clocks to analogue front-end triggers, removing aperture-jitter artefacts. LUT logic implements the channel-control state machine. Multi-voltage I/O banks let the FPGA bridge 5 V and 3.3 V instrumentation buses without level shifters, simplifying backplane layout on PXI/VXI-style cards where this part was historically popular.
Được đề xuất
Image Processing Front-End
The EP20K100EBC652-2X is appropriate for image processing front-ends where mid-resolution pixel streams require line buffers, look-up tables for gamma correction, and pipelined filter chains. Each ESB can be configured as dual-port RAM sized to common line lengths (e.g., 1024 x 16 or 256 x 32), giving enough storage for 8-/10-bit pixel pipelines. Logic elements handle Bayer demosaicing, edge detection, and histogram accumulation. LVCMOS I/O at 1.8 V/2.5 V/3.3 V matches image-sensor MCU and LVDS outputs, while the four DLLs phase-align pixel clocks and frame syncs. This is a legacy fit; modern designs should consider Cyclone IV/V or MAX 10 instead.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K100EBC652-2X — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K100EBC652-2XR | EP20K100EBC652-1X | EP20K100EBC652-3 | EP20K1000EBC652-2X | EP20K1000EBC652-1 | EP20K100EBC356-3N |
|---|---|---|---|---|---|---|---|
| Package | 652-ball BGA (EBC652) | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 652-ball BGA (EBC652) - same | 356-ball BGA (EBC356) - smaller |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 1,000,000 | 1,000,000 | 100,000 |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 38,400 | 38,400 | 4,160 |
| Embedded System Blocks | 26 | 26 | 26 | 26 | 160 | 160 | 26 |
| Maximum User I/O | 246 | 246 | 246 | 246 | 488 | 488 | ~146 |
| Speed Grade | -2X (faster commercial) | -2X (faster commercial) | -1X (slowest) | -3 (slower commercial) | -2X (faster commercial) | -1 | -3N |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Bảo phân biệt quan trọng
- Same 652-BGA footprint with 10x density headroom (vsEP20K1000EBC652-2X)
- Highest speed grade in the 100K APEX 20KE family (vsEP20K100EBC652-3)
- Enhanced I/O standards and CAM support (vsEP20K100 (APEX 20K, no "E"))
Ghi chú thiết kế
Estimated: VCCINT ramp time must be monotonic between 1.0 V and 1.8 V within 100 ms per the APEX 20KE datasheet configuration specification; otherwise the POR (power-on-reset) circuit can mis-trigger and leave the device in an undefined state. Place a 10 µF bulk + 0.1 µF ceramic on each VCCINT and VCCIO ball, and provide a soft-start controller such as the LTC3025 if your upstream supply ramp exceeds 100 ms.
Estimated: at full LUT utilisation (4,160 LEs at ~80% toggle) and 246 I/O toggling at 100 MHz, the EP20K100EBC652-2X dissipates approximately 1.5-2.5 W. With 652-BGA theta_JA around 18-22 C/W on a 4-layer JEDEC board, junction rise is roughly 35-55 C. Provide at least 4 thermal-vias under the central die-flag BGA pads and avoid placing the device adjacent to a high-power switching converter to stay within the 0-85 C commercial junction range.
The 652-ball BGA uses a 1.27 mm ball pitch. Per APEX 20KE guidelines, use NSMD (non-solder-mask-defined) pads with a 0.61 mm pad diameter on outer layers and 0.50 mm on inner layers; microvia-in-pad is acceptable on HDI stackups but standard through-via stackups require capture vias around the BGA perimeter. Match trace lengths within each LVDS pair to within 50 mils to avoid skew across the 1.27 mm pitch array.
For board-level configuration use an EPC16 or EPC2 enhanced configuration device. Wire the EPC nCS to the FPGA nCONFIG pin and observe the 100 ms tCFG timeout. If JTAG boundary-scan (IEEE 1149.1) is required for production test, dedicate the TCK/TMS/TDI/TDO balls to a JTAG header and tie TRST low through 4.7 kΩ for clean reset behaviour.
Common pitfalls: (1) failing to power all VCCIO banks even when unused - floating VCCIO causes I/O bias drift and DC current draw; (2) driving 5 V TTL signals into 3.3 V VCCIO without external clamping - the APEX 20KE I/Os are not 5 V-tolerant; (3) assuming the -2X speed grade allows aggressive clocking without consulting Quartus II timing closure; (4) using APEX 20K (no "E") bitstreams on a 20KE device - the enhanced CAM and DLL feature bits cause configuration failure.
Thông tin tuân thủ
RoHS and lead-free status not confirmed in the provided data; some 652-BGA APEX 20KE variants exist in both SnPb and lead-free versions (denoted by R suffix). Parts are obsolete and should not be selected for new RoHS-mandated assemblies without explicit verification of the marking.
