EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel
MPN: EP3C10E144C7N ✓ Hoạt độngEP3C10E144C7N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, signal processing, and interconnect functions through a configurable array of logic elements (LEs), embedded multipliers, block RAM (BRAM), and programmable I/O. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering higher density than CPLDs and far lower NRE cost than ASICs - making them ideal for low- to mid-volume designs, prototyping, and time-to-market-critical applications.
Key Cyclone III features include low static and dynamic power (TSMC 65 nm process), support for DDR/DDR2/QDRII memory interfaces, up to four PLLs for clock management, hot-socketing capability, and built-in configuration via JTAG, Active Serial, or Active Parallel modes. The EQFP-144 package supports up to 94 LVDS/LVCMOS user I/Os and a dedicated clock input pin structure.
Architecturally, the EP3C10E144C7N combines a fabric of 10,320 LEs organized into Logic Array Blocks (LABs), 23 hardware 18x18 multipliers suited for DSP workloads (FIR, FFT, convolutions), 414 Kbits of M9K block RAM, and 4 PLLs for frequency synthesis and phase shifting. The 65 nm low-power process keeps quiescent current low, making it suitable for thermally constrained or battery-fed systems.
Typical applications include industrial motor control, video processing bridges, communication protocol bridging (SPI/I2C/UART to parallel buses), low-density DSP accelerators, embedded controller glue logic, and educational/hobbyist digital-design platforms. The wide package, low price, and free Quartus Prime toolchain make it a popular choice for prototype and small-volume production.
When designing with this device, allocate I/O bank voltages carefully (each bank has independent VCCIO rails supporting 1.2V/1.5V/1.8V/2.5V/3.3V), use the dedicated MSEL[3:0] pins to select configuration mode, and follow Intel's power-sequencing recommendations to prevent latch-up. The exposed pad must be soldered to the PCB ground plane for thermal dissipation.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in replacement analysis from same-brand Cyclone III speed/pinout variants, and practical design notes not consolidated on any single manufacturer or distributor page.
Bộ thay thế dễ dàng lắp đặt cho EP3C10E144C7N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C10E144C7N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, RoHS Status, Family, Operating Temperature.
EP3C10E144C8N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C10E144I7N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C16E144C7N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3C5E144C7N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP4CE10E144C8N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3C10E144C7N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone® III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 4 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Maximum Internal Clock Frequency | 437.5 MHz |
| Hộp | 144-pin LQFP Exposed Pad (EQFP-144) |
| Process Technology | TSMC 65 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Nhiệt độ mối nối hoạt động | 0C to +85C (Commercial, C7 speed grade) |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) |
| Trạng thái RoHS | Compliant |
Cấu hình chân EP3C10E144C7N
| Chân 1 | I/O — User I/O (Bank 1) |
| Chân 2 | I/O — User I/O (Bank 1) |
| Chân 3 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 4 | I/O — User I/O (Bank 1) |
| Chân 5 | I/O — User I/O (Bank 1) |
| Chân 6 | GND — Ground |
| Chân 7 | I/O — User I/O (Bank 1) |
| Chân 8 | I/O — User I/O (Bank 1) |
| Chân 9 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 10 | I/O — User I/O (Bank 2) |
| Chân 11 | I/O — User I/O (Bank 2) |
| Chân 12 | GND — Ground |
| Chân 13 | I/O — User I/O (Bank 2) |
| Chân 14 | I/O — User I/O (Bank 2) |
| Chân 15 | VCCIO2 — I/O bank 2 supply voltage |
| Chân 16 | I/O — User I/O (Bank 2) |
| Chân 17 | I/O — User I/O (Bank 2) |
| Chân 18 | GND — Ground |
| Chân 19 | I/O — User I/O (Bank 2) |
| Chân 20 | I/O — User I/O (Bank 2) |
| Chân 21 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 22 | I/O — User I/O (Bank 3) |
| Chân 23 | I/O — User I/O (Bank 3) |
| Chân 24 | GND — Ground |
| Chân 25 | I/O — User I/O (Bank 3) |
| Chân 26 | I/O — User I/O (Bank 3) |
| Chân 27 | VCCIO3 — I/O bank 3 supply voltage |
| Chân 28 | I/O — User I/O (Bank 3) |
| Chân 29 | I/O — User I/O (Bank 3) |
| Chân 30 | GND — Ground |
| Chân 31 | I/O — User I/O (Bank 3) |
| Chân 32 | I/O — User I/O (Bank 3) |
| Chân 33 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 34 | I/O — User I/O (Bank 4) |
| Chân 35 | I/O — User I/O (Bank 4) |
| Chân 36 | GND — Ground |
| Chân 37 | I/O — User I/O (Bank 4) |
| Chân 38 | I/O — User I/O (Bank 4) |
| Chân 39 | VCCIO4 — I/O bank 4 supply voltage |
| Chân 40 | I/O — User I/O (Bank 4) |
| Chân 41 | I/O — User I/O (Bank 4) |
| Chân 42 | GND — Ground |
| Chân 43 | I/O — User I/O (Bank 4) |
| Chân 44 | I/O — User I/O (Bank 4) |
| Chân 45 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 46 | nCONFIG — Configuration start (active low) |
| Chân 47 | MSEL0 — Configuration mode select 0 |
| Chân 48 | MSEL1 — Configuration mode select 1 |
| Chân 49 | MSEL2 — Configuration mode select 2 |
| Chân 50 | GND — Ground |
| Chân 51 | MSEL3 — Configuration mode select 3 |
| Chân 52 | nCE — Chip enable (active low) |
| Chân 53 | nCEO — Chip enable output (active low) |
| Chân 54 | DCLK — Configuration clock input |
| Chân 55 | nSTATUS — Configuration status (active low) |
| Chân 56 | CONF_DONE — Configuration done (open drain) |
| Chân 57 | TCK — JTAG test clock |
| Chân 58 | TMS — JTAG test mode select |
| Chân 59 | TDO — JTAG test data out |
| Chân 60 | TDI — JTAG test data in |
| Chân 61 | TRST — JTAG test reset (active low) |
| Chân 62 | VCCIO5 — I/O bank 5 supply voltage |
| Chân 63 | GND — Ground |
| Chân 64 | I/O — User I/O (Bank 5) |
| Chân 65 | I/O — User I/O (Bank 5) |
| Chân 66 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 67 | I/O — User I/O (Bank 5) |
| Chân 68 | I/O — User I/O (Bank 5) |
| Chân 69 | GND — Ground |
| Chân 70 | I/O — User I/O (Bank 5) |
| Chân 71 | I/O — User I/O (Bank 5) |
| Chân 72 | VCCIO5 — I/O bank 5 supply voltage |
| Chân 73 | I/O — User I/O (Bank 5) |
| Chân 74 | I/O — User I/O (Bank 5) |
| Chân 75 | GND — Ground |
| Chân 76 | I/O — User I/O (Bank 6) |
| Chân 77 | I/O — User I/O (Bank 6) |
| Chân 78 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 79 | I/O — User I/O (Bank 6) |
| Chân 80 | I/O — User I/O (Bank 6) |
| Chân 81 | GND — Ground |
| Chân 82 | I/O — User I/O (Bank 6) |
| Chân 83 | I/O — User I/O (Bank 6) |
| Chân 84 | VCCIO6 — I/O bank 6 supply voltage |
| Chân 85 | I/O — User I/O (Bank 6) |
| Chân 86 | I/O — User I/O (Bank 6) |
| Chân 87 | GND — Ground |
| Chân 88 | I/O — User I/O (Bank 6) |
| Chân 89 | I/O — User I/O (Bank 6) |
| Chân 90 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 91 | I/O — User I/O (Bank 7) |
| Chân 92 | I/O — User I/O (Bank 7) |
| Chân 93 | GND — Ground |
| Chân 94 | I/O — User I/O (Bank 7) |
| Chân 95 | I/O — User I/O (Bank 7) |
| Chân 96 | VCCIO7 — I/O bank 7 supply voltage |
| Chân 97 | I/O — User I/O (Bank 7) |
| Chân 98 | I/O — User I/O (Bank 7) |
| Chân 99 | GND — Ground |
| Chân 100 | I/O — User I/O (Bank 7) |
| Chân 101 | I/O — User I/O (Bank 7) |
| Chân 102 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 103 | I/O — User I/O (Bank 8) |
| Chân 104 | I/O — User I/O (Bank 8) |
| Chân 105 | GND — Ground |
| Chân 106 | I/O — User I/O (Bank 8) |
| Chân 107 | I/O — User I/O (Bank 8) |
| Chân 108 | VCCIO8 — I/O bank 8 supply voltage |
| Chân 109 | I/O — User I/O (Bank 8) |
| Chân 110 | I/O — User I/O (Bank 8) |
| Chân 111 | GND — Ground |
| Chân 112 | I/O — User I/O (Bank 8) |
| Chân 113 | I/O — User I/O (Bank 8) |
| Chân 114 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 115 | CLK0 — Dedicated clock input 0 |
| Chân 116 | CLK1 — Dedicated clock input 1 |
| Chân 117 | GND — Ground |
| Chân 118 | CLK2 — Dedicated clock input 2 |
| Chân 119 | CLK3 — Dedicated clock input 3 |
| Chân 120 | VCCIO8 — I/O bank 8 supply voltage |
| Chân 121 | I/O — User I/O (Bank 8) |
| Chân 122 | I/O — User I/O (Bank 8) |
| Chân 123 | GND — Ground |
| Chân 124 | PLL1_OUTp — PLL1 clock output positive |
| Chân 125 | PLL1_OUTn — PLL1 clock output negative |
| Chân 126 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 127 | I/O — User I/O (Bank 1) |
| Chân 128 | I/O — User I/O (Bank 1) |
| Chân 129 | GND — Ground |
| Chân 130 | I/O — User I/O (Bank 1) |
| Chân 131 | I/O — User I/O (Bank 1) |
| Chân 132 | VCCIO1 — I/O bank 1 supply voltage |
| Chân 133 | I/O — User I/O (Bank 1) |
| Chân 134 | I/O — User I/O (Bank 1) |
| Chân 135 | GND — Ground |
| Chân 136 | I/O — User I/O (Bank 1) |
| Chân 137 | I/O — User I/O (Bank 1) |
| Chân 138 | VCCINT — Core supply voltage 1.15-1.25V |
| Chân 139 | I/O — User I/O (Bank 2) |
| Chân 140 | I/O — User I/O (Bank 2) |
| Chân 141 | GND — Ground |
| Chân 142 | I/O — User I/O (Bank 2) |
| Chân 143 | I/O — User I/O (Bank 2) |
| Chân 144 | VCCIO2 — I/O bank 2 supply voltage |
Ứng dụng tiêu biểu
EP3C10E144C7N phù hợp cho 7 Áp dụngs: Industrial Motor Control, Video Processing Bridge, Communication Protocol Bridge, DSP Accelerator (FIR/FFT), Embedded Controller Glue Logic, Educational & Prototyping Platform, LED Display & Signage Control.
Industrial Motor Control
The EP3C10E144C7N is well suited for industrial motor control loops where deterministic timing and DSP throughput are required. Its 23 hardware 18x18 multipliers can run field-oriented control (FOC) and Park/Clark transforms at high PWM frequencies, while the 4 PLLs generate precise PWM-aligned clocks from a single crystal. The 94 user I/Os support quadrature encoder inputs, Hall sensor capture, PWM outputs, and isolation interfaces. The exposed-pad EQFP-144 package is straightforward to hand-solder or low-volume assemble, which suits motor-drive reference designs and prototyping. Compared with a microcontroller-only approach, the FPGA offloads the FOC math into dedicated multipliers, freeing the MCU for supervisory and communications tasks.
Được đề xuất
Video Processing Bridge
For video format conversion and bridging applications, the EP3C10E144C7N's M9K block RAM (414 Kbits) acts as line buffers, while 10K LEs handle the pixel pipeline. The fabric can convert between camera-side parallel RGB/YCbCr and display-side LVDS, MIPI (with external bridge), or HDMI (with external TMDS encoder) formats. The 4 PLLs synthesize pixel clocks from any input reference, and the 65 nm process keeps thermals manageable even at 1080p60 throughput. For embedded vision prototypes needing quick turnaround and bitstream-iterable development, the Cyclone III EQFP-144 footprint is breadboard-friendly and Quartus supports free design entry.
Được đề xuất
Communication Protocol Bridge
The EP3C10E144C7N is ideal as a multi-protocol glue logic bridge between SPI, I2C, UART, parallel buses, and custom interfaces. With 10,320 LEs it can implement several soft IP cores simultaneously (for example, SPI-to-I2C, UART-to-parallel, and a custom ASIC-facing bus), and the 4 PLLs allow independent baud-rate synthesis for each port. The 94 user I/Os comfortably accommodate 4-6 channels of multi-protocol bridging with logic-level translation handled by VCCIO banks (1.2V/1.5V/1.8V/2.5V/3.3V). Cyclone III's free Quartus toolchain and the device's mature documentation make protocol-bridge reference designs widely available from open-source repositories.
Được đề xuất
DSP Accelerator (FIR/FFT)
In low-to-mid complexity DSP acceleration roles, the EP3C10E144C7N's 23 hardware 18x18 multipliers sustain roughly 1.4 GMACS at maximum fMAX, sufficient for 64-tap FIR filters, 256-point FFTs, and audio-rate FFT pipelines. Each multiplier can be paired with M9K block RAM to create distributed-arithmetic or systolic FIR architectures, while the PLLs derive precisely spaced FFT bin clocks. Designers typically use this device for front-end signal conditioning (pre-ADC filtering, decimation) or post-processing (interpolation, equalization). Higher DSP density requires scaling up to EP3C25/EP3C40 within the same family.
Được đề xuất
Embedded Controller Glue Logic
The EP3C10E144C7N is commonly used as glue logic alongside a microprocessor or DSP, replacing dozens of 74-series parts with a single programmable device. It can implement custom address decoding, wait-state generators, interrupt controllers, peripheral multiplexers, and timing-critical interface logic. The 4 PLLs and 94 I/Os allow multiple clock domains and voltage translations, while the compact EQFP-144 footprint reduces board area versus discrete logic. This application is especially relevant when off-the-shelf ASSPs cannot match a specific timing, voltage, or pinout requirement and a small FPGA bridge is the fastest path to a working board.
Được đề xuất
Educational & Prototyping Platform
The EP3C10E144C7N's free Quartus toolchain support, breadboard-friendly EQFP-144 package, and abundant reference designs make it a popular choice for university FPGA courses, hobbyist projects, and prototype evaluation kits. The 10K LE density is large enough to host full RISC-V soft cores, educational CPU designs (MIPS, NIOS II), and lab projects (UART echo, VGA controllers, simple CPUs), yet small enough to fit in short bitstream configuration times. Industrial and hobbyist distributors stock the part widely through legacy channels, and open-source cores accelerate student learning.
Được đề xuất
LED Display & Signage Control
For LED video walls and digital signage, the EP3C10E144C7N drives high refresh-rate LED panels with deterministic timing and per-pixel control. The 94 user I/Os can source enough data lanes for medium-resolution panels (typically 16-32 multiplexed data lines plus clock and latch), while M9K block RAM holds scan-line buffers. The 4 PLLs derive the precise pixel clock required for high-bit-depth grayscale modulation (typically 10-16 bits per channel). The exposed-pad package simplifies thermal layout for always-on signage installations, and the wide 3.3V VCCIO support directly interfaces most LED driver chips without level translation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C10E144C7N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C10E144C8N | EP3C10E144I7N | EP3C16E144C7N | EP3C5E144C7N | EP4CE10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 15,408 | 5,136 | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits | 414 Kbits | 414 Kbits | 504 Kbits | 414 Kbits | 414 Kbits |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 56 | 23 | 23 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Speed Grade | C7 (Commercial, fastest) | C8 (Commercial, slower) | I7 (Industrial) | C7 (Commercial, fastest) | C7 (Commercial, fastest) | C8 (Cyclone IV E) |
| Operating Junction Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
Bảo phân biệt quan trọng
- Direct upgrade path to EP3C16 in same package (vsEP3C5E144C7N)
- Fastest commercial speed grade available (vsEP3C10E144C8N)
- Lowest-cost modernized cross-generational alternative (vsEP4CE10E144C8N)
Ghi chú thiết kế
The Cyclone III EP3C10E144C7N requires three separate supply rails: VCCINT (1.15-1.25 V core), VCCIO[1-8] (1.2/1.5/1.8/2.5/3.3 V per bank), and an analog VCC_PLL for the PLL blocks. Power sequencing must follow the Intel Cyclone III device handbook: VCCINT must rise monotonically and reach steady state before VCCIO ramps. Failure to sequence correctly can cause high in-rush current and latch-up. Use a dedicated LDO (e.g., LM1117 for VCCINT) and separate ferrite beads for each VCCIO bank to minimize switching-noise coupling between logic and analog blocks.
The EQFP-144 exposed thermal pad must be soldered to a PCB copper pour (minimum 1 square inch recommended) tied to ground. Without the exposed-pad solder connection, junction-to-ambient thermal resistance can exceed 30 C/W, causing the device to thermal-throttle at modest utilization levels. For continuous 100% LE utilization at 437 MHz, expect junction temperature rise of approximately 15-20 C above ambient with proper ground-plane soldering - keep ambient below 70 C to stay within the C7 commercial junction limit.
Route all eight VCCIO bank supplies with wide traces or copper pours, and place 0.1uF decoupling capacitors as close to every VCCIO pin as possible plus bulk 10-47uF tantalum or ceramic capacitors at each supply entry point. Use a continuous ground plane on the layer immediately beneath the FPGA, and stitch the perimeter with vias every 200 mils to provide a low-impedance return path for high-speed signals. LVDS pairs must be length-matched within 50 mils and routed over a continuous reference plane.
Do not leave MSEL[3:0] floating - tie them to VCCINT or GND through 1-10 kohm resistors to select the desired configuration mode (AS, AP, JTAG, PS). Do not connect CONF_DONE directly to VCCIO - it is an open-drain output that requires a 4.7 kohm pull-up to VCCIO for proper operation. The nCONFIG pin must be held low at power-up until all supplies are stable, then released to begin configuration. Hot-socketing is supported only when MSEL pins are configured for JTAG or AS mode.
Thông tin tuân thủ
RoHS compliant per Altera/Intel product page; lead-free and halogen-free per Cyclone III device family specifications. Not AEC-Q100 qualified - select automotive-grade Cyclone III variants or other families for automotive applications.
