EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel
Référence : EP3C10E144C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $68.55 | $68,55 |
| 10 | $62.4 | $624,00 |
| 100 | $55.8 | $5 580,00 |
| 500 | $49.95 | $24 975,00 |
| 1 000 | $45.2 | $45 200,00 |
EP3C10E144C7N Présentation
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, signal processing, and interconnect functions through a configurable array of logic elements (LEs), embedded multipliers, block RAM (BRAM), and programmable I/O. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering higher density than CPLDs and far lower NRE cost than ASICs - making them ideal for low- to mid-volume designs, prototyping, and time-to-market-critical applications.
Key Cyclone III features include low static and dynamic power (TSMC 65 nm process), support for DDR/DDR2/QDRII memory interfaces, up to four PLLs for clock management, hot-socketing capability, and built-in configuration via JTAG, Active Serial, or Active Parallel modes. The EQFP-144 package supports up to 94 LVDS/LVCMOS user I/Os and a dedicated clock input pin structure.
Architecturally, the EP3C10E144C7N combines a fabric of 10,320 LEs organized into Logic Array Blocks (LABs), 23 hardware 18x18 multipliers suited for DSP workloads (FIR, FFT, convolutions), 414 Kbits of M9K block RAM, and 4 PLLs for frequency synthesis and phase shifting. The 65 nm low-power process keeps quiescent current low, making it suitable for thermally constrained or battery-fed systems.
Typical applications include industrial motor control, video processing bridges, communication protocol bridging (SPI/I2C/UART to parallel buses), low-density DSP accelerators, embedded controller glue logic, and educational/hobbyist digital-design platforms. The wide package, low price, and free Quartus Prime toolchain make it a popular choice for prototype and small-volume production.
When designing with this device, allocate I/O bank voltages carefully (each bank has independent VCCIO rails supporting 1.2V/1.5V/1.8V/2.5V/3.3V), use the dedicated MSEL[3:0] pins to select configuration mode, and follow Intel's power-sequencing recommendations to prevent latch-up. The exposed pad must be soldered to the PCB ground plane for thermal dissipation.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in replacement analysis from same-brand Cyclone III speed/pinout variants, and practical design notes not consolidated on any single manufacturer or distributor page.
Alternatives de remplacement direct pour EP3C10E144C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C10E144C7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, RoHS Status, Family, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C10E144C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15.2 / unité
Voir la fiche technique →EP3C10E144I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$39.92 / unité
Voir la fiche technique →EP3C16E144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C5E144C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.17 / unité
Voir la fiche technique →EP4CE10E144C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C10E144C7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone® III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 4 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Maximum Internal Clock Frequency | 437.5 MHz |
| Boîtier | 144-pin LQFP Exposed Pad (EQFP-144) |
| Process Technology | TSMC 65 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Température de jonction en fonctionnement | 0C to +85C (Commercial, C7 speed grade) |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) |
| Statut RoHS | Compliant |
Configuration des broches de EP3C10E144C7N
| Broche 1 | I/O — User I/O (Bank 1) |
| Broche 2 | I/O — User I/O (Bank 1) |
| Broche 3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 4 | I/O — User I/O (Bank 1) |
| Broche 5 | I/O — User I/O (Bank 1) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O (Bank 1) |
| Broche 8 | I/O — User I/O (Bank 1) |
| Broche 9 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 10 | I/O — User I/O (Bank 2) |
| Broche 11 | I/O — User I/O (Bank 2) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O (Bank 2) |
| Broche 14 | I/O — User I/O (Bank 2) |
| Broche 15 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 16 | I/O — User I/O (Bank 2) |
| Broche 17 | I/O — User I/O (Bank 2) |
| Broche 18 | GND — Ground |
| Broche 19 | I/O — User I/O (Bank 2) |
| Broche 20 | I/O — User I/O (Bank 2) |
| Broche 21 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 22 | I/O — User I/O (Bank 3) |
| Broche 23 | I/O — User I/O (Bank 3) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O (Bank 3) |
| Broche 26 | I/O — User I/O (Bank 3) |
| Broche 27 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 28 | I/O — User I/O (Bank 3) |
| Broche 29 | I/O — User I/O (Bank 3) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O (Bank 3) |
| Broche 32 | I/O — User I/O (Bank 3) |
| Broche 33 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 34 | I/O — User I/O (Bank 4) |
| Broche 35 | I/O — User I/O (Bank 4) |
| Broche 36 | GND — Ground |
| Broche 37 | I/O — User I/O (Bank 4) |
| Broche 38 | I/O — User I/O (Bank 4) |
| Broche 39 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 40 | I/O — User I/O (Bank 4) |
| Broche 41 | I/O — User I/O (Bank 4) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (Bank 4) |
| Broche 44 | I/O — User I/O (Bank 4) |
| Broche 45 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 46 | nCONFIG — Configuration start (active low) |
| Broche 47 | MSEL0 — Configuration mode select 0 |
| Broche 48 | MSEL1 — Configuration mode select 1 |
| Broche 49 | MSEL2 — Configuration mode select 2 |
| Broche 50 | GND — Ground |
| Broche 51 | MSEL3 — Configuration mode select 3 |
| Broche 52 | nCE — Chip enable (active low) |
| Broche 53 | nCEO — Chip enable output (active low) |
| Broche 54 | DCLK — Configuration clock input |
| Broche 55 | nSTATUS — Configuration status (active low) |
| Broche 56 | CONF_DONE — Configuration done (open drain) |
| Broche 57 | TCK — JTAG test clock |
| Broche 58 | TMS — JTAG test mode select |
| Broche 59 | TDO — JTAG test data out |
| Broche 60 | TDI — JTAG test data in |
| Broche 61 | TRST — JTAG test reset (active low) |
| Broche 62 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O (Bank 5) |
| Broche 65 | I/O — User I/O (Bank 5) |
| Broche 66 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 67 | I/O — User I/O (Bank 5) |
| Broche 68 | I/O — User I/O (Bank 5) |
| Broche 69 | GND — Ground |
| Broche 70 | I/O — User I/O (Bank 5) |
| Broche 71 | I/O — User I/O (Bank 5) |
| Broche 72 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 73 | I/O — User I/O (Bank 5) |
| Broche 74 | I/O — User I/O (Bank 5) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O (Bank 6) |
| Broche 77 | I/O — User I/O (Bank 6) |
| Broche 78 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 79 | I/O — User I/O (Bank 6) |
| Broche 80 | I/O — User I/O (Bank 6) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O (Bank 6) |
| Broche 83 | I/O — User I/O (Bank 6) |
| Broche 84 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 85 | I/O — User I/O (Bank 6) |
| Broche 86 | I/O — User I/O (Bank 6) |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O (Bank 6) |
| Broche 89 | I/O — User I/O (Bank 6) |
| Broche 90 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 91 | I/O — User I/O (Bank 7) |
| Broche 92 | I/O — User I/O (Bank 7) |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O (Bank 7) |
| Broche 95 | I/O — User I/O (Bank 7) |
| Broche 96 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 97 | I/O — User I/O (Bank 7) |
| Broche 98 | I/O — User I/O (Bank 7) |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O (Bank 7) |
| Broche 101 | I/O — User I/O (Bank 7) |
| Broche 102 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 103 | I/O — User I/O (Bank 8) |
| Broche 104 | I/O — User I/O (Bank 8) |
| Broche 105 | GND — Ground |
| Broche 106 | I/O — User I/O (Bank 8) |
| Broche 107 | I/O — User I/O (Bank 8) |
| Broche 108 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 109 | I/O — User I/O (Bank 8) |
| Broche 110 | I/O — User I/O (Bank 8) |
| Broche 111 | GND — Ground |
| Broche 112 | I/O — User I/O (Bank 8) |
| Broche 113 | I/O — User I/O (Bank 8) |
| Broche 114 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 115 | CLK0 — Dedicated clock input 0 |
| Broche 116 | CLK1 — Dedicated clock input 1 |
| Broche 117 | GND — Ground |
| Broche 118 | CLK2 — Dedicated clock input 2 |
| Broche 119 | CLK3 — Dedicated clock input 3 |
| Broche 120 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 121 | I/O — User I/O (Bank 8) |
| Broche 122 | I/O — User I/O (Bank 8) |
| Broche 123 | GND — Ground |
| Broche 124 | PLL1_OUTp — PLL1 clock output positive |
| Broche 125 | PLL1_OUTn — PLL1 clock output negative |
| Broche 126 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 127 | I/O — User I/O (Bank 1) |
| Broche 128 | I/O — User I/O (Bank 1) |
| Broche 129 | GND — Ground |
| Broche 130 | I/O — User I/O (Bank 1) |
| Broche 131 | I/O — User I/O (Bank 1) |
| Broche 132 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 133 | I/O — User I/O (Bank 1) |
| Broche 134 | I/O — User I/O (Bank 1) |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O (Bank 1) |
| Broche 137 | I/O — User I/O (Bank 1) |
| Broche 138 | VCCINT — Core supply voltage 1.15-1.25V |
| Broche 139 | I/O — User I/O (Bank 2) |
| Broche 140 | I/O — User I/O (Bank 2) |
| Broche 141 | GND — Ground |
| Broche 142 | I/O — User I/O (Bank 2) |
| Broche 143 | I/O — User I/O (Bank 2) |
| Broche 144 | VCCIO2 — I/O bank 2 supply voltage |
Applications typiques
EP3C10E144C7N convient pour 7 applications: Industrial Motor Control, Video Processing Bridge, Communication Protocol Bridge, DSP Accelerator (FIR/FFT), Embedded Controller Glue Logic, Educational & Prototyping Platform, LED Display & Signage Control.
Industrial Motor Control
The EP3C10E144C7N is well suited for industrial motor control loops where deterministic timing and DSP throughput are required. Its 23 hardware 18x18 multipliers can run field-oriented control (FOC) and Park/Clark transforms at high PWM frequencies, while the 4 PLLs generate precise PWM-aligned clocks from a single crystal. The 94 user I/Os support quadrature encoder inputs, Hall sensor capture, PWM outputs, and isolation interfaces. The exposed-pad EQFP-144 package is straightforward to hand-solder or low-volume assemble, which suits motor-drive reference designs and prototyping. Compared with a microcontroller-only approach, the FPGA offloads the FOC math into dedicated multipliers, freeing the MCU for supervisory and communications tasks.
Recommandé
Video Processing Bridge
For video format conversion and bridging applications, the EP3C10E144C7N's M9K block RAM (414 Kbits) acts as line buffers, while 10K LEs handle the pixel pipeline. The fabric can convert between camera-side parallel RGB/YCbCr and display-side LVDS, MIPI (with external bridge), or HDMI (with external TMDS encoder) formats. The 4 PLLs synthesize pixel clocks from any input reference, and the 65 nm process keeps thermals manageable even at 1080p60 throughput. For embedded vision prototypes needing quick turnaround and bitstream-iterable development, the Cyclone III EQFP-144 footprint is breadboard-friendly and Quartus supports free design entry.
Recommandé
Communication Protocol Bridge
The EP3C10E144C7N is ideal as a multi-protocol glue logic bridge between SPI, I2C, UART, parallel buses, and custom interfaces. With 10,320 LEs it can implement several soft IP cores simultaneously (for example, SPI-to-I2C, UART-to-parallel, and a custom ASIC-facing bus), and the 4 PLLs allow independent baud-rate synthesis for each port. The 94 user I/Os comfortably accommodate 4-6 channels of multi-protocol bridging with logic-level translation handled by VCCIO banks (1.2V/1.5V/1.8V/2.5V/3.3V). Cyclone III's free Quartus toolchain and the device's mature documentation make protocol-bridge reference designs widely available from open-source repositories.
Recommandé
DSP Accelerator (FIR/FFT)
In low-to-mid complexity DSP acceleration roles, the EP3C10E144C7N's 23 hardware 18x18 multipliers sustain roughly 1.4 GMACS at maximum fMAX, sufficient for 64-tap FIR filters, 256-point FFTs, and audio-rate FFT pipelines. Each multiplier can be paired with M9K block RAM to create distributed-arithmetic or systolic FIR architectures, while the PLLs derive precisely spaced FFT bin clocks. Designers typically use this device for front-end signal conditioning (pre-ADC filtering, decimation) or post-processing (interpolation, equalization). Higher DSP density requires scaling up to EP3C25/EP3C40 within the same family.
Recommandé
Embedded Controller Glue Logic
The EP3C10E144C7N is commonly used as glue logic alongside a microprocessor or DSP, replacing dozens of 74-series parts with a single programmable device. It can implement custom address decoding, wait-state generators, interrupt controllers, peripheral multiplexers, and timing-critical interface logic. The 4 PLLs and 94 I/Os allow multiple clock domains and voltage translations, while the compact EQFP-144 footprint reduces board area versus discrete logic. This application is especially relevant when off-the-shelf ASSPs cannot match a specific timing, voltage, or pinout requirement and a small FPGA bridge is the fastest path to a working board.
Recommandé
Educational & Prototyping Platform
The EP3C10E144C7N's free Quartus toolchain support, breadboard-friendly EQFP-144 package, and abundant reference designs make it a popular choice for university FPGA courses, hobbyist projects, and prototype evaluation kits. The 10K LE density is large enough to host full RISC-V soft cores, educational CPU designs (MIPS, NIOS II), and lab projects (UART echo, VGA controllers, simple CPUs), yet small enough to fit in short bitstream configuration times. Industrial and hobbyist distributors stock the part widely through legacy channels, and open-source cores accelerate student learning.
Recommandé
LED Display & Signage Control
For LED video walls and digital signage, the EP3C10E144C7N drives high refresh-rate LED panels with deterministic timing and per-pixel control. The 94 user I/Os can source enough data lanes for medium-resolution panels (typically 16-32 multiplexed data lines plus clock and latch), while M9K block RAM holds scan-line buffers. The 4 PLLs derive the precise pixel clock required for high-bit-depth grayscale modulation (typically 10-16 bits per channel). The exposed-pad package simplifies thermal layout for always-on signage installations, and the wide 3.3V VCCIO support directly interfaces most LED driver chips without level translation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C10E144C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C10E144C8N | EP3C10E144I7N | EP3C16E144C7N | EP3C5E144C7N | EP4CE10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 15,408 | 5,136 | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits | 414 Kbits | 414 Kbits | 504 Kbits | 414 Kbits | 414 Kbits |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 56 | 23 | 23 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Speed Grade | C7 (Commercial, fastest) | C8 (Commercial, slower) | I7 (Industrial) | C7 (Commercial, fastest) | C7 (Commercial, fastest) | C8 (Cyclone IV E) |
| Operating Junction Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
Principaux différenciateurs
- Direct upgrade path to EP3C16 in same package (vs EP3C5E144C7N)
- Fastest commercial speed grade available (vs EP3C10E144C8N)
- Lowest-cost modernized cross-generational alternative (vs EP4CE10E144C8N)
Notes de conception
The Cyclone III EP3C10E144C7N requires three separate supply rails: VCCINT (1.15-1.25 V core), VCCIO[1-8] (1.2/1.5/1.8/2.5/3.3 V per bank), and an analog VCC_PLL for the PLL blocks. Power sequencing must follow the Intel Cyclone III device handbook: VCCINT must rise monotonically and reach steady state before VCCIO ramps. Failure to sequence correctly can cause high in-rush current and latch-up. Use a dedicated LDO (e.g., LM1117 for VCCINT) and separate ferrite beads for each VCCIO bank to minimize switching-noise coupling between logic and analog blocks.
The EQFP-144 exposed thermal pad must be soldered to a PCB copper pour (minimum 1 square inch recommended) tied to ground. Without the exposed-pad solder connection, junction-to-ambient thermal resistance can exceed 30 C/W, causing the device to thermal-throttle at modest utilization levels. For continuous 100% LE utilization at 437 MHz, expect junction temperature rise of approximately 15-20 C above ambient with proper ground-plane soldering - keep ambient below 70 C to stay within the C7 commercial junction limit.
Route all eight VCCIO bank supplies with wide traces or copper pours, and place 0.1uF decoupling capacitors as close to every VCCIO pin as possible plus bulk 10-47uF tantalum or ceramic capacitors at each supply entry point. Use a continuous ground plane on the layer immediately beneath the FPGA, and stitch the perimeter with vias every 200 mils to provide a low-impedance return path for high-speed signals. LVDS pairs must be length-matched within 50 mils and routed over a continuous reference plane.
Do not leave MSEL[3:0] floating - tie them to VCCINT or GND through 1-10 kohm resistors to select the desired configuration mode (AS, AP, JTAG, PS). Do not connect CONF_DONE directly to VCCIO - it is an open-drain output that requires a 4.7 kohm pull-up to VCCIO for proper operation. The nCONFIG pin must be held low at power-up until all supplies are stable, then released to begin configuration. Hot-socketing is supported only when MSEL pins are configured for JTAG or AS mode.
Informations de conformité
RoHS compliant per Altera/Intel product page; lead-free and halogen-free per Cyclone III device family specifications. Not AEC-Q100 qualified - select automotive-grade Cyclone III variants or other families for automotive applications.
