EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel
MPN: EP3C10E144C7N ✓ AktifEP3C10E144C7N Ringkasan
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, signal processing, and interconnect functions through a configurable array of logic elements (LEs), embedded multipliers, block RAM (BRAM), and programmable I/O. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering higher density than CPLDs and far lower NRE cost than ASICs - making them ideal for low- to mid-volume designs, prototyping, and time-to-market-critical applications.
Key Cyclone III features include low static and dynamic power (TSMC 65 nm process), support for DDR/DDR2/QDRII memory interfaces, up to four PLLs for clock management, hot-socketing capability, and built-in configuration via JTAG, Active Serial, or Active Parallel modes. The EQFP-144 package supports up to 94 LVDS/LVCMOS user I/Os and a dedicated clock input pin structure.
Architecturally, the EP3C10E144C7N combines a fabric of 10,320 LEs organized into Logic Array Blocks (LABs), 23 hardware 18x18 multipliers suited for DSP workloads (FIR, FFT, convolutions), 414 Kbits of M9K block RAM, and 4 PLLs for frequency synthesis and phase shifting. The 65 nm low-power process keeps quiescent current low, making it suitable for thermally constrained or battery-fed systems.
Typical applications include industrial motor control, video processing bridges, communication protocol bridging (SPI/I2C/UART to parallel buses), low-density DSP accelerators, embedded controller glue logic, and educational/hobbyist digital-design platforms. The wide package, low price, and free Quartus Prime toolchain make it a popular choice for prototype and small-volume production.
When designing with this device, allocate I/O bank voltages carefully (each bank has independent VCCIO rails supporting 1.2V/1.5V/1.8V/2.5V/3.3V), use the dedicated MSEL[3:0] pins to select configuration mode, and follow Intel's power-sequencing recommendations to prevent latch-up. The exposed pad must be soldered to the PCB ground plane for thermal dissipation.
This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in replacement analysis from same-brand Cyclone III speed/pinout variants, and practical design notes not consolidated on any single manufacturer or distributor page.
Alternatif penggantian untuk EP3C10E144C7N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP3C10E144C7N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, RoHS Status, Family, Operating Temperature.
EP3C10E144C8N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3C10E144I7N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP3C16E144C7N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP3C5E144C7N
✅ Drop-In ⚠️ Spesifikasi Tidak DisahkanKontak untuk harga
Lihat Datasheet →EP4CE10E144C8N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP3C10E144C7N Rating Maksimal & Karakteristik Listrik
| Family | Cyclone® III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 4 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| Maximum Internal Clock Frequency | 437.5 MHz |
| Paket | 144-pin LQFP Exposed Pad (EQFP-144) |
| Process Technology | TSMC 65 nm low-power CMOS |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| Suhu Hubung Kerja | 0C to +85C (Commercial, C7 speed grade) |
| I/O Standards Supported | LVDS, LVCMOS, SSTL, HSTL (per bank VCCIO) |
| Status RoHS | Compliant |
Konfigurasi Pin EP3C10E144C7N
| Pin produk 1 | I/O — User I/O (Bank 1) |
| Pin produk 2 | I/O — User I/O (Bank 1) |
| Pin produk 3 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 4 | I/O — User I/O (Bank 1) |
| Pin produk 5 | I/O — User I/O (Bank 1) |
| Pin produk 6 | GND — Ground |
| Pin produk 7 | I/O — User I/O (Bank 1) |
| Pin produk 8 | I/O — User I/O (Bank 1) |
| Pin produk 9 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 10 | I/O — User I/O (Bank 2) |
| Pin produk 11 | I/O — User I/O (Bank 2) |
| Pin produk 12 | GND — Ground |
| Pin produk 13 | I/O — User I/O (Bank 2) |
| Pin produk 14 | I/O — User I/O (Bank 2) |
| Pin produk 15 | VCCIO2 — I/O bank 2 supply voltage |
| Pin produk 16 | I/O — User I/O (Bank 2) |
| Pin produk 17 | I/O — User I/O (Bank 2) |
| Pin produk 18 | GND — Ground |
| Pin produk 19 | I/O — User I/O (Bank 2) |
| Pin produk 20 | I/O — User I/O (Bank 2) |
| Pin produk 21 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 22 | I/O — User I/O (Bank 3) |
| Pin produk 23 | I/O — User I/O (Bank 3) |
| Pin produk 24 | GND — Ground |
| Pin produk 25 | I/O — User I/O (Bank 3) |
| Pin produk 26 | I/O — User I/O (Bank 3) |
| Pin produk 27 | VCCIO3 — I/O bank 3 supply voltage |
| Pin produk 28 | I/O — User I/O (Bank 3) |
| Pin produk 29 | I/O — User I/O (Bank 3) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O (Bank 3) |
| Pin produk 32 | I/O — User I/O (Bank 3) |
| Pin produk 33 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 34 | I/O — User I/O (Bank 4) |
| Pin produk 35 | I/O — User I/O (Bank 4) |
| Pin produk 36 | GND — Ground |
| Pin produk 37 | I/O — User I/O (Bank 4) |
| Pin produk 38 | I/O — User I/O (Bank 4) |
| Pin produk 39 | VCCIO4 — I/O bank 4 supply voltage |
| Pin produk 40 | I/O — User I/O (Bank 4) |
| Pin produk 41 | I/O — User I/O (Bank 4) |
| Pin produk 42 | GND — Ground |
| Pin produk 43 | I/O — User I/O (Bank 4) |
| Pin produk 44 | I/O — User I/O (Bank 4) |
| Pin produk 45 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 46 | nCONFIG — Configuration start (active low) |
| Pin produk 47 | MSEL0 — Configuration mode select 0 |
| Pin produk 48 | MSEL1 — Configuration mode select 1 |
| Pin produk 49 | MSEL2 — Configuration mode select 2 |
| Pin produk 50 | GND — Ground |
| Pin produk 51 | MSEL3 — Configuration mode select 3 |
| Pin produk 52 | nCE — Chip enable (active low) |
| Pin produk 53 | nCEO — Chip enable output (active low) |
| Pin produk 54 | DCLK — Configuration clock input |
| Pin produk 55 | nSTATUS — Configuration status (active low) |
| Pin produk 56 | CONF_DONE — Configuration done (open drain) |
| Pin produk 57 | TCK — JTAG test clock |
| Pin produk 58 | TMS — JTAG test mode select |
| Pin produk 59 | TDO — JTAG test data out |
| Pin produk 60 | TDI — JTAG test data in |
| Pin produk 61 | TRST — JTAG test reset (active low) |
| Pin produk 62 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk 63 | GND — Ground |
| Pin produk 64 | I/O — User I/O (Bank 5) |
| Pin produk 65 | I/O — User I/O (Bank 5) |
| Pin produk 66 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 67 | I/O — User I/O (Bank 5) |
| Pin produk 68 | I/O — User I/O (Bank 5) |
| Pin produk 69 | GND — Ground |
| Pin produk 70 | I/O — User I/O (Bank 5) |
| Pin produk 71 | I/O — User I/O (Bank 5) |
| Pin produk 72 | VCCIO5 — I/O bank 5 supply voltage |
| Pin produk 73 | I/O — User I/O (Bank 5) |
| Pin produk 74 | I/O — User I/O (Bank 5) |
| Pin produk 75 | GND — Ground |
| Pin produk 76 | I/O — User I/O (Bank 6) |
| Pin produk 77 | I/O — User I/O (Bank 6) |
| Pin produk 78 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 79 | I/O — User I/O (Bank 6) |
| Pin produk 80 | I/O — User I/O (Bank 6) |
| Pin produk 81 | GND — Ground |
| Pin produk 82 | I/O — User I/O (Bank 6) |
| Pin produk 83 | I/O — User I/O (Bank 6) |
| Pin produk 84 | VCCIO6 — I/O bank 6 supply voltage |
| Pin produk 85 | I/O — User I/O (Bank 6) |
| Pin produk 86 | I/O — User I/O (Bank 6) |
| Pin produk 87 | GND — Ground |
| Pin produk 88 | I/O — User I/O (Bank 6) |
| Pin produk 89 | I/O — User I/O (Bank 6) |
| Pin produk 90 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 91 | I/O — User I/O (Bank 7) |
| Pin produk 92 | I/O — User I/O (Bank 7) |
| Pin produk 93 | GND — Ground |
| Pin produk 94 | I/O — User I/O (Bank 7) |
| Pin produk 95 | I/O — User I/O (Bank 7) |
| Pin produk 96 | VCCIO7 — I/O bank 7 supply voltage |
| Pin produk 97 | I/O — User I/O (Bank 7) |
| Pin produk 98 | I/O — User I/O (Bank 7) |
| Pin produk 99 | GND — Ground |
| Pin produk 100 | I/O — User I/O (Bank 7) |
| Pin produk 101 | I/O — User I/O (Bank 7) |
| Pin produk 102 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 103 | I/O — User I/O (Bank 8) |
| Pin produk 104 | I/O — User I/O (Bank 8) |
| Pin produk 105 | GND — Ground |
| Pin produk 106 | I/O — User I/O (Bank 8) |
| Pin produk 107 | I/O — User I/O (Bank 8) |
| Pin produk 108 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 109 | I/O — User I/O (Bank 8) |
| Pin produk 110 | I/O — User I/O (Bank 8) |
| Pin produk 111 | GND — Ground |
| Pin produk 112 | I/O — User I/O (Bank 8) |
| Pin produk 113 | I/O — User I/O (Bank 8) |
| Pin produk 114 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 115 | CLK0 — Dedicated clock input 0 |
| Pin produk 116 | CLK1 — Dedicated clock input 1 |
| Pin produk 117 | GND — Ground |
| Pin produk 118 | CLK2 — Dedicated clock input 2 |
| Pin produk 119 | CLK3 — Dedicated clock input 3 |
| Pin produk 120 | VCCIO8 — I/O bank 8 supply voltage |
| Pin produk 121 | I/O — User I/O (Bank 8) |
| Pin produk 122 | I/O — User I/O (Bank 8) |
| Pin produk 123 | GND — Ground |
| Pin produk 124 | PLL1_OUTp — PLL1 clock output positive |
| Pin produk 125 | PLL1_OUTn — PLL1 clock output negative |
| Pin produk 126 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 127 | I/O — User I/O (Bank 1) |
| Pin produk 128 | I/O — User I/O (Bank 1) |
| Pin produk 129 | GND — Ground |
| Pin produk 130 | I/O — User I/O (Bank 1) |
| Pin produk 131 | I/O — User I/O (Bank 1) |
| Pin produk 132 | VCCIO1 — I/O bank 1 supply voltage |
| Pin produk 133 | I/O — User I/O (Bank 1) |
| Pin produk 134 | I/O — User I/O (Bank 1) |
| Pin produk 135 | GND — Ground |
| Pin produk 136 | I/O — User I/O (Bank 1) |
| Pin produk 137 | I/O — User I/O (Bank 1) |
| Pin produk 138 | VCCINT — Core supply voltage 1.15-1.25V |
| Pin produk 139 | I/O — User I/O (Bank 2) |
| Pin produk 140 | I/O — User I/O (Bank 2) |
| Pin produk 141 | GND — Ground |
| Pin produk 142 | I/O — User I/O (Bank 2) |
| Pin produk 143 | I/O — User I/O (Bank 2) |
| Pin produk 144 | VCCIO2 — I/O bank 2 supply voltage |
Aplikasi Umum
EP3C10E144C7N cocok untuk 7 aplikasis: Industrial Motor Control, Video Processing Bridge, Communication Protocol Bridge, DSP Accelerator (FIR/FFT), Embedded Controller Glue Logic, Educational & Prototyping Platform, LED Display & Signage Control.
Industrial Motor Control
The EP3C10E144C7N is well suited for industrial motor control loops where deterministic timing and DSP throughput are required. Its 23 hardware 18x18 multipliers can run field-oriented control (FOC) and Park/Clark transforms at high PWM frequencies, while the 4 PLLs generate precise PWM-aligned clocks from a single crystal. The 94 user I/Os support quadrature encoder inputs, Hall sensor capture, PWM outputs, and isolation interfaces. The exposed-pad EQFP-144 package is straightforward to hand-solder or low-volume assemble, which suits motor-drive reference designs and prototyping. Compared with a microcontroller-only approach, the FPGA offloads the FOC math into dedicated multipliers, freeing the MCU for supervisory and communications tasks.
Direkomendasikan
Video Processing Bridge
For video format conversion and bridging applications, the EP3C10E144C7N's M9K block RAM (414 Kbits) acts as line buffers, while 10K LEs handle the pixel pipeline. The fabric can convert between camera-side parallel RGB/YCbCr and display-side LVDS, MIPI (with external bridge), or HDMI (with external TMDS encoder) formats. The 4 PLLs synthesize pixel clocks from any input reference, and the 65 nm process keeps thermals manageable even at 1080p60 throughput. For embedded vision prototypes needing quick turnaround and bitstream-iterable development, the Cyclone III EQFP-144 footprint is breadboard-friendly and Quartus supports free design entry.
Direkomendasikan
Communication Protocol Bridge
The EP3C10E144C7N is ideal as a multi-protocol glue logic bridge between SPI, I2C, UART, parallel buses, and custom interfaces. With 10,320 LEs it can implement several soft IP cores simultaneously (for example, SPI-to-I2C, UART-to-parallel, and a custom ASIC-facing bus), and the 4 PLLs allow independent baud-rate synthesis for each port. The 94 user I/Os comfortably accommodate 4-6 channels of multi-protocol bridging with logic-level translation handled by VCCIO banks (1.2V/1.5V/1.8V/2.5V/3.3V). Cyclone III's free Quartus toolchain and the device's mature documentation make protocol-bridge reference designs widely available from open-source repositories.
Direkomendasikan
DSP Accelerator (FIR/FFT)
In low-to-mid complexity DSP acceleration roles, the EP3C10E144C7N's 23 hardware 18x18 multipliers sustain roughly 1.4 GMACS at maximum fMAX, sufficient for 64-tap FIR filters, 256-point FFTs, and audio-rate FFT pipelines. Each multiplier can be paired with M9K block RAM to create distributed-arithmetic or systolic FIR architectures, while the PLLs derive precisely spaced FFT bin clocks. Designers typically use this device for front-end signal conditioning (pre-ADC filtering, decimation) or post-processing (interpolation, equalization). Higher DSP density requires scaling up to EP3C25/EP3C40 within the same family.
Direkomendasikan
Embedded Controller Glue Logic
The EP3C10E144C7N is commonly used as glue logic alongside a microprocessor or DSP, replacing dozens of 74-series parts with a single programmable device. It can implement custom address decoding, wait-state generators, interrupt controllers, peripheral multiplexers, and timing-critical interface logic. The 4 PLLs and 94 I/Os allow multiple clock domains and voltage translations, while the compact EQFP-144 footprint reduces board area versus discrete logic. This application is especially relevant when off-the-shelf ASSPs cannot match a specific timing, voltage, or pinout requirement and a small FPGA bridge is the fastest path to a working board.
Direkomendasikan
Educational & Prototyping Platform
The EP3C10E144C7N's free Quartus toolchain support, breadboard-friendly EQFP-144 package, and abundant reference designs make it a popular choice for university FPGA courses, hobbyist projects, and prototype evaluation kits. The 10K LE density is large enough to host full RISC-V soft cores, educational CPU designs (MIPS, NIOS II), and lab projects (UART echo, VGA controllers, simple CPUs), yet small enough to fit in short bitstream configuration times. Industrial and hobbyist distributors stock the part widely through legacy channels, and open-source cores accelerate student learning.
Direkomendasikan
LED Display & Signage Control
For LED video walls and digital signage, the EP3C10E144C7N drives high refresh-rate LED panels with deterministic timing and per-pixel control. The 94 user I/Os can source enough data lanes for medium-resolution panels (typically 16-32 multiplexed data lines plus clock and latch), while M9K block RAM holds scan-line buffers. The 4 PLLs derive the precise pixel clock required for high-bit-depth grayscale modulation (typically 10-16 bits per channel). The exposed-pad package simplifies thermal layout for always-on signage installations, and the wide 3.3V VCCIO support directly interfaces most LED driver chips without level translation.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP3C10E144C7N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP3C10E144C8N | EP3C10E144I7N | EP3C16E144C7N | EP3C5E144C7N | EP4CE10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin LQFP Exposed Pad (EQFP-144) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) | EQFP-144 (same) |
| Logic Elements | 10,320 | 10,320 | 10,320 | 15,408 | 5,136 | 10,320 |
| Embedded Memory (M9K BRAM) | 414 Kbits | 414 Kbits | 414 Kbits | 504 Kbits | 414 Kbits | 414 Kbits |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 56 | 23 | 23 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Speed Grade | C7 (Commercial, fastest) | C8 (Commercial, slower) | I7 (Industrial) | C7 (Commercial, fastest) | C7 (Commercial, fastest) | C8 (Cyclone IV E) |
| Operating Junction Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
Diferensiator Kunci
- Direct upgrade path to EP3C16 in same package (vsEP3C5E144C7N)
- Fastest commercial speed grade available (vsEP3C10E144C8N)
- Lowest-cost modernized cross-generational alternative (vsEP4CE10E144C8N)
Catatan Desain
The Cyclone III EP3C10E144C7N requires three separate supply rails: VCCINT (1.15-1.25 V core), VCCIO[1-8] (1.2/1.5/1.8/2.5/3.3 V per bank), and an analog VCC_PLL for the PLL blocks. Power sequencing must follow the Intel Cyclone III device handbook: VCCINT must rise monotonically and reach steady state before VCCIO ramps. Failure to sequence correctly can cause high in-rush current and latch-up. Use a dedicated LDO (e.g., LM1117 for VCCINT) and separate ferrite beads for each VCCIO bank to minimize switching-noise coupling between logic and analog blocks.
The EQFP-144 exposed thermal pad must be soldered to a PCB copper pour (minimum 1 square inch recommended) tied to ground. Without the exposed-pad solder connection, junction-to-ambient thermal resistance can exceed 30 C/W, causing the device to thermal-throttle at modest utilization levels. For continuous 100% LE utilization at 437 MHz, expect junction temperature rise of approximately 15-20 C above ambient with proper ground-plane soldering - keep ambient below 70 C to stay within the C7 commercial junction limit.
Route all eight VCCIO bank supplies with wide traces or copper pours, and place 0.1uF decoupling capacitors as close to every VCCIO pin as possible plus bulk 10-47uF tantalum or ceramic capacitors at each supply entry point. Use a continuous ground plane on the layer immediately beneath the FPGA, and stitch the perimeter with vias every 200 mils to provide a low-impedance return path for high-speed signals. LVDS pairs must be length-matched within 50 mils and routed over a continuous reference plane.
Do not leave MSEL[3:0] floating - tie them to VCCINT or GND through 1-10 kohm resistors to select the desired configuration mode (AS, AP, JTAG, PS). Do not connect CONF_DONE directly to VCCIO - it is an open-drain output that requires a 4.7 kohm pull-up to VCCIO for proper operation. The nCONFIG pin must be held low at power-up until all supplies are stable, then released to begin configuration. Hot-socketing is supported only when MSEL pins are configured for JTAG or AS mode.
Informasi Konformitas
RoHS compliant per Altera/Intel product page; lead-free and halogen-free per Cyclone III device family specifications. Not AEC-Q100 qualified - select automotive-grade Cyclone III variants or other families for automotive applications.
