EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera
MPN: EP3C5E144C7N ✓ Hoạt độngEP3C5E144C7N Tóm tắt
A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based logic fabric with embedded memory blocks (M9K), embedded multipliers (18x18), and Phase-Locked Loops (PLLs) on a single die. In the broader taxonomy, the EP3C5E144C7N belongs to the SRAM-based programmable logic family, sitting alongside Cyclone IV (next-generation low-power FPGA), Cyclone V (28 nm successor), and MAX series CPLDs. The device is non-volatile-of-configuration: bitstreams are loaded from external flash or JTAG into on-chip SRAM configuration cells, enabling unlimited re-programmability for prototyping, NPI, and field-upgradable end products.
Key features include 5,136 logic elements organized into 290 logic array blocks (LABs), 46 embedded M9K memory blocks (414 Kbits), 46 embedded 18x18 multipliers, and up to 4 PLLs with 4 dedicated clock outputs. The device supports configuration schemes including Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG, and includes Cyclone III architectural primitives such as high-speed LVDS I/O, on-chip termination (OCT), and the Altera remote update IP for in-field bitstream swapping. The 144-pin EQFP package provides a thermal resistance of approximately 22 C/W with a properly soldered exposed pad.
The Cyclone III architecture targets cost-sensitive high-volume applications where the previous-generation Cyclone II could not deliver sufficient logic density, DSP bandwidth, or low static power. The 65 nm process enables typical static power in the milliamp range while retaining deterministic timing closure at 200+ MHz for common logic functions and 250 MHz for DSP blocks. I/O banks support LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling standards with per-bank voltage reference supplies, enabling direct interface to DDR/DDR2 SDRAM without external level shifters.
Typical applications include industrial motor control and PLC logic, video surveillance and image-processing front ends, portable medical instrumentation, low-cost software-defined radio (SDR) baseband, and consumer audio/video processing. The combination of low static power, moderate logic capacity, and a small footprint package makes the EP3C5E144C7N a strong fit for space-constrained, cost-driven designs that still need hardware-accelerated DSP or parallel sensor aggregation.
When designing with this device, allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs, and use the Quartus II / Quartus Prime design suite (13.0 or later recommended for final bitstream) with the Cyclone III device library installed. Decoupling must include 0.1 uF and 10 uF capacitors placed within 5 mm of every VCCIO/VCCINT ball pair, and the exposed thermal pad must be soldered to a 1 sq. inch copper pour to keep junction temperature within the C7 commercial rating.
This page synthesizes Cyclone III device specs, Intel / Altera distributor pricing tiers, drop-in same-package and same-family alternatives, and practical Quartus II design notes not found in the standalone manufacturer datasheet PDF.
Bộ thay thế dễ dàng lắp đặt cho EP3C5E144C7N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C5E144C7N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Family, Total Memory Bits.
EP3C5E144C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C5E144I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C10E144C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP4CE5E144C7N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP3C16Q240C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C25E144C7N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3C40E144C7N
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
EP3C5E144C7N Tỷ lệ tối đa & tính chất điện
| Device Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Logic Array Blocks (LAB) | 290 |
| Total Memory Bits | 423,936 |
| Embedded M9K Memory Blocks | 46 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 4 |
| User I/Os | 94 |
| Speed Grade | C7 (7 ns delay) |
| Process Technology | TSMC 65 nm low-power |
| Hộp | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch |
| Nhiệt độ mối nối hoạt động | 0C to +85C |
| Configuration Modes | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS, PCI/PCI-X |
| Trạng thái RoHS | Compliant |
Cấu hình chân EP3C5E144C7N
| Chân 1 | I/O — User I/O (Bank 1) |
| Chân 2 | I/O — User I/O (Bank 1) |
| Chân 3 | I/O — User I/O (Bank 1) |
| Chân 4 | I/O — User I/O (Bank 1) |
| Chân 5 | I/O — User I/O (Bank 1) |
| Chân 6 | VCCIO1 — I/O Bank 1 voltage supply |
| Chân 7 | I/O — User I/O (Bank 1) |
| Chân 8 | I/O — User I/O (Bank 1) |
| Chân 9 | I/O — User I/O (Bank 1) |
| Chân 10 | GND — Ground |
| Chân 11 | I/O — User I/O (Bank 1) |
| Chân 12 | I/O — User I/O (Bank 1) |
| Chân 13 | I/O — User I/O (Bank 1) |
| Chân 14 | I/O — User I/O (Bank 1) |
| Chân 15 | I/O — User I/O (Bank 1) |
| Chân 16 | VCCIO1 — I/O Bank 1 voltage supply |
| Chân 17 | I/O — User I/O (Bank 1) |
| Chân 18 | I/O — User I/O (Bank 1) |
| Chân 19 | I/O — User I/O (Bank 1) |
| Chân 20 | I/O — User I/O (Bank 1) |
| Chân 21 | I/O — User I/O (Bank 1) |
| Chân 22 | GND — Ground |
| Chân 23 | I/O — User I/O (Bank 1) |
| Chân 24 | I/O — User I/O (Bank 1) |
| Chân 25 | I/O — User I/O (Bank 1) |
| Chân 26 | I/O — User I/O (Bank 1) |
| Chân 27 | I/O — User I/O (Bank 1) |
| Chân 28 | VCCIO1 — I/O Bank 1 voltage supply |
| Chân 29 | I/O — User I/O (Bank 1) |
| Chân 30 | I/O — User I/O (Bank 1) |
| Chân 31 | I/O — User I/O (Bank 1) |
| Chân 32 | I/O — User I/O (Bank 1) |
| Chân 33 | I/O — User I/O (Bank 1) |
| Chân 34 | GND — Ground |
| Chân 35 | I/O — User I/O (Bank 1) |
| Chân 36 | I/O — User I/O (Bank 1) |
| Chân 37 | VCCINT — Core voltage supply (1.2 V) |
| Chân 38 | I/O — User I/O (Bank 2) |
| Chân 39 | I/O — User I/O (Bank 2) |
| Chân 40 | I/O — User I/O (Bank 2) |
| Chân 41 | I/O — User I/O (Bank 2) |
| Chân 42 | I/O — User I/O (Bank 2) |
| Chân 43 | VCCIO2 — I/O Bank 2 voltage supply |
| Chân 44 | I/O — User I/O (Bank 2) |
| Chân 45 | I/O — User I/O (Bank 2) |
| Chân 46 | I/O — User I/O (Bank 2) |
| Chân 47 | I/O — User I/O (Bank 2) |
| Chân 48 | I/O — User I/O (Bank 2) |
| Chân 49 | GND — Ground |
| Chân 50 | I/O — User I/O (Bank 2) |
| Chân 51 | I/O — User I/O (Bank 2) |
| Chân 52 | I/O — User I/O (Bank 2) |
| Chân 53 | I/O — User I/O (Bank 2) |
| Chân 54 | I/O — User I/O (Bank 2) |
| Chân 55 | VCCIO2 — I/O Bank 2 voltage supply |
| Chân 56 | I/O — User I/O (Bank 2) |
| Chân 57 | I/O — User I/O (Bank 2) |
| Chân 58 | I/O — User I/O (Bank 2) |
| Chân 59 | I/O — User I/O (Bank 2) |
| Chân 60 | I/O — User I/O (Bank 2) |
| Chân 61 | GND — Ground |
| Chân 62 | I/O — User I/O (Bank 2) |
| Chân 63 | I/O — User I/O (Bank 2) |
| Chân 64 | I/O — User I/O (Bank 2) |
| Chân 65 | I/O — User I/O (Bank 2) |
| Chân 66 | I/O — User I/O (Bank 2) |
| Chân 67 | VCCIO2 — I/O Bank 2 voltage supply |
| Chân 68 | I/O — User I/O (Bank 2) |
| Chân 69 | I/O — User I/O (Bank 2) |
| Chân 70 | VCCINT — Core voltage supply (1.2 V) |
| Chân 71 | I/O — User I/O (Bank 3) |
| Chân 72 | I/O — User I/O (Bank 3) |
| Chân 73 | I/O — User I/O (Bank 3) |
| Chân 74 | I/O — User I/O (Bank 3) |
| Chân 75 | I/O — User I/O (Bank 3) |
| Chân 76 | VCCIO3 — I/O Bank 3 voltage supply |
| Chân 77 | I/O — User I/O (Bank 3) |
| Chân 78 | I/O — User I/O (Bank 3) |
| Chân 79 | I/O — User I/O (Bank 3) |
| Chân 80 | I/O — User I/O (Bank 3) |
| Chân 81 | I/O — User I/O (Bank 3) |
| Chân 82 | GND — Ground |
| Chân 83 | I/O — User I/O (Bank 3) |
| Chân 84 | I/O — User I/O (Bank 3) |
| Chân 85 | I/O — User I/O (Bank 3) |
| Chân 86 | I/O — User I/O (Bank 3) |
| Chân 87 | I/O — User I/O (Bank 3) |
| Chân 88 | VCCIO3 — I/O Bank 3 voltage supply |
| Chân 89 | I/O — User I/O (Bank 3) |
| Chân 90 | I/O — User I/O (Bank 3) |
| Chân 91 | I/O — User I/O (Bank 3) |
| Chân 92 | I/O — User I/O (Bank 3) |
| Chân 93 | I/O — User I/O (Bank 3) |
| Chân 94 | GND — Ground |
| Chân 95 | I/O — User I/O (Bank 3) |
| Chân 96 | I/O — User I/O (Bank 3) |
| Chân 97 | I/O — User I/O (Bank 3) |
| Chân 98 | I/O — User I/O (Bank 3) |
| Chân 99 | I/O — User I/O (Bank 3) |
| Chân 100 | VCCIO3 — I/O Bank 3 voltage supply |
| Chân 101 | I/O — User I/O (Bank 3) |
| Chân 102 | I/O — User I/O (Bank 3) |
| Chân 103 | VCCINT — Core voltage supply (1.2 V) |
| Chân 104 | I/O — User I/O (Bank 4) |
| Chân 105 | I/O — User I/O (Bank 4) |
| Chân 106 | I/O — User I/O (Bank 4) |
| Chân 107 | I/O — User I/O (Bank 4) |
| Chân 108 | I/O — User I/O (Bank 4) |
| Chân 109 | VCCIO4 — I/O Bank 4 voltage supply |
| Chân 110 | I/O — User I/O (Bank 4) |
| Chân 111 | I/O — User I/O (Bank 4) |
| Chân 112 | I/O — User I/O (Bank 4) |
| Chân 113 | I/O — User I/O (Bank 4) |
| Chân 114 | I/O — User I/O (Bank 4) |
| Chân 115 | GND — Ground |
| Chân 116 | I/O — User I/O (Bank 4) |
| Chân 117 | I/O — User I/O (Bank 4) |
| Chân 118 | I/O — User I/O (Bank 4) |
| Chân 119 | I/O — User I/O (Bank 4) |
| Chân 120 | I/O — User I/O (Bank 4) |
| Chân 121 | VCCIO4 — I/O Bank 4 voltage supply |
| Chân 122 | I/O — User I/O (Bank 4) |
| Chân 123 | I/O — User I/O (Bank 4) |
| Chân 124 | I/O — User I/O (Bank 4) |
| Chân 125 | I/O — User I/O (Bank 4) |
| Chân 126 | I/O — User I/O (Bank 4) |
| Chân 127 | GND — Ground |
| Chân 128 | I/O — User I/O (Bank 4) |
| Chân 129 | I/O — User I/O (Bank 4) |
| Chân 130 | I/O — User I/O (Bank 4) |
| Chân 131 | I/O — User I/O (Bank 4) |
| Chân 132 | I/O — User I/O (Bank 4) |
| Chân 133 | VCCIO4 — I/O Bank 4 voltage supply |
| Chân 134 | I/O — User I/O (Bank 4) |
| Chân 135 | I/O — User I/O (Bank 4) |
| Chân 136 | VCCINT — Core voltage supply (1.2 V) |
| Chân 137 | TCK — JTAG test clock |
| Chân 138 | TMS — JTAG test mode select |
| Chân 139 | TDO — JTAG test data out |
| Chân 140 | TDI — JTAG test data in |
| Chân 141 | nCONFIG — Configuration control |
| Chân 142 | nSTATUS — Configuration status |
| Chân 143 | MSEL0 — Configuration mode select 0 |
| Chân 144 | MSEL1 — Configuration mode select 1 |
Ứng dụng tiêu biểu
EP3C5E144C7N phù hợp cho 6 Áp dụngs: Industrial Motor Control and PLC Logic, Video Surveillance and Image Processing Front End, Portable Medical Instrumentation, Low-Cost Software-Defined Radio (SDR) Baseband, Consumer Audio/Video Processing, Industrial Networking and Protocol Bridging.
Industrial Motor Control and PLC Logic
The EP3C5E144C7N's 5,136 logic elements and 46 embedded 18x18 multipliers fit single-axis to dual-axis motor control loops including field-oriented control (FOC), trapezoidal commutation, and PID compensation. The 94 user I/Os support encoder inputs (QEP), Hall sensor feedback, PWM outputs to gate drivers, and isolated communication interfaces (RS-485, CAN, Modbus). The C7 speed grade closes 200 MHz logic timing, sufficient for 50 kHz current loop rates. Compared to DSP-only solutions, the FPGA enables parallel sampling of multiple ADC channels synchronized to PWM edges, eliminating the sequential bottleneck of a single-core DSP.
Được đề xuất
Video Surveillance and Image Processing Front End
The EP3C5E144C7N's 46 M9K memory blocks (414 Kbits total) and LVDS I/O support enable direct interface to CMOS image sensors at up to 1080p60 resolution using LVDS or sub-LVDS signaling. The 5,136 logic elements implement real-time pipelines for demosaicing, color correction, edge detection, and H.264 baseline encoding pre-processing. The 4 PLLs generate the precise pixel clocks required by MIPI CSI-2 or parallel LVDS sensor interfaces. The 65 nm low-power process keeps total FPGA power below 1.5W at full utilization, enabling fanless surveillance camera designs.
Được đề xuất
Portable Medical Instrumentation
The EP3C5E144C7N's low static power (typically under 100 mW at idle) and small 22x22 mm EQFP-144 package make it suitable for battery-powered medical devices such as pulse oximeters, ECG monitors, and portable ultrasound front ends. The 5,136 logic elements implement digital filtering, FFT analysis, and adaptive baseline removal on multi-channel ADC streams. The 46 embedded 18x18 multipliers accelerate biquad filter chains and wavelet transforms. On-chip PLLs generate the clock trees needed for simultaneous-sampling ADC interfaces at 1-10 MSPS, while the 94 user I/Os connect to TFT displays, touch panels, and isolated serial ports.
Được đề xuất
Low-Cost Software-Defined Radio (SDR) Baseband
The EP3C5E144C7N's 46 embedded 18x18 multipliers and 423 Kbits of block RAM enable low-cost SDR baseband implementations for narrowband protocols such as LoRa, Sigfox, NB-IoT, and IEEE 802.15.4 (Zigbee/Thread). The 4 PLLs generate the quadrature sample-rate clocks needed for digital downconversion and channelization. The LVDS I/O pairs interface directly to high-speed ADCs and DACs at 50-100 MSPS. Compared to a microcontroller + DSP solution, the FPGA's parallel processing enables simultaneous demodulation of multiple channels and real-time FEC decoding without timing jitter.
Được đề xuất
Consumer Audio/Video Processing
The EP3C5E144C7N's logic density and embedded multipliers fit consumer audio processors for HDMI upscaling, audio format conversion (Dolby Digital, DTS), and HDMI CEC bridging. The 94 user I/Os support HDMI, S/PDIF, I2S, and LVDS display interfaces simultaneously. The C7 speed grade enables 1080p60 video processing with line buffers in M9K memory. Cyclone III's low static power keeps enclosure temperatures within consumer product safety limits, while the exposed pad package simplifies thermal management in slim AV receiver chassis.
Được đề xuất
Industrial Networking and Protocol Bridging
The EP3C5E144C7N's 94 user I/Os and 5,136 logic elements support multi-protocol industrial gateway designs bridging EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP on a single device. The M9K memory blocks implement packet buffers and protocol state machines, while the LVDS I/O pairs enable MII/RGMII PHY interfacing at 1 Gbps. The C7 speed grade closes 200 MHz logic timing sufficient for line-rate protocol processing. Compared to discrete microcontrollers, the FPGA enables hardware-accelerated CRC, checksum, and protocol state management without CPU bottlenecks.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C5E144C7N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C5E144C8N | EP3C5E144I7N | EP3C10E144C7N | EP4CE5E144C7N | EP3C16Q240C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 5,136 | 15,408 |
| Speed Grade | C7 (7 ns) | C8 (8 ns) | I7 (7 ns, industrial temp) | C7 (7 ns) | C7 (7 ns) | C8 (8 ns) |
| Operating Junction Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 270 | 504 |
| 18x18 Multipliers | 46 | 46 | 46 | 46 | 25 | 56 |
| Bitstream Compatibility | Cyclone III baseline | Compatible (same family) | Compatible (same family) | Compatible (same family) | Not compatible (Cyclone IV E) | Compatible (same family) |
Bảo phân biệt quan trọng
- Lowest-density Cyclone III in 144-EQFP with full feature set (vsEPM570GT100C3N (MAX II CPLD))
- Pin-compatible logic upgrade within same family (vsEP3C5E144C8N (C8 speed grade))
- Industrial temperature variant available in same package (vsEP3C5E144I7N (industrial temp))
Ghi chú thiết kế
The EP3C5E144C7N requires separate VCCINT (1.2 V core) and VCCIO (1.5V/1.8V/2.5V/3.3V I/O bank) rails. Per the Cyclone III device datasheet, VCCINT tolerance is +/-5% and each VCCIO bank can be independently configured. Place 0.1 uF and 10 uF decoupling capacitors within 5 mm of every VCCINT/VCCIO pin pair. A ferrite bead or pi-filter on each rail is recommended for designs with high-speed LVDS or external SDRAM interfaces.
Estimated: At full utilization (5,136 LE, 46 multipliers, 250 MHz logic), the EP3C5E144C7N dissipates approximately 0.8-1.2 W. The exposed thermal pad must be soldered to a continuous ground copper pour of at least 1 square inch to maintain the C7 commercial 85C junction temperature. Without the exposed pad soldered, junction temperature can exceed 100C at moderate utilization, triggering thermal slowdown. Use 4-thermal-via array (0.3 mm drill) on the exposed pad for optimal heat transfer.
Allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs. Per the Cyclone III device handbook, LVDS traces must be 100 ohm differential with intra-pair skew under 5 ps. Route configuration signals (TCK/TMS/TDO/TDI/nCONFIG/nSTATUS) away from high-speed switching nodes. Place the configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA's active serial pins for reliable AS configuration.
Pin assignments should be planned using the Quartus II / Quartus Prime Pin Planner before PCB layout. Group high-speed I/O (LVDS, DDR/DDR2) in adjacent banks to minimize routing congestion. Per the Cyclone III device handbook, each I/O bank has dedicated VREF pins for SSTL/HSTL reference voltages - place VREF bypass capacitors (0.1 uF + 10 uF) within 3 mm of each VREF pin. Avoid routing clock signals across I/O bank boundaries to prevent skew issues.
Do not leave MSEL0/MSEL1 pins floating - they must be tied to VCCINT or GND to select the configuration mode (AS/PS/FPP/JTAG). Per the Cyclone III device handbook, floating MSEL pins cause configuration failures. The nCONFIG pin must be pulled to VCCINT through a 10 kohm resistor. Cyclone III bitstreams are NOT compatible with Cyclone IV or Cyclone V - recompile in Quartus Prime when migrating to newer families.
Thông tin tuân thủ
RoHS compliant per Intel / Altera product page. Lead-free (Pb-free) reflow compatible. Not AEC-Q100 qualified - Cyclone III is not an automotive-grade family. For automotive applications, consider Cyclone IV E or Cyclone V with AEC-Q100 documentation.
