Intel

EP3SE110F1152C4L - Stratix III E FPGA 107500 LEs 1152-FBGA | Intel

Name: EP3SE110F1152C4L - Stratix III E FPGA 107500 LEs 1152-FBGA | Intel
Brand: Intel
SKU: EP3SE110F1152C4L

MPN: EP3SE110F1152C4L ✗ Cuối đời

0.9 V Vdss 1152-ball FCBGA (BBGA-1152) Package 800 MHz (max) Speed 8936448 bits (8.9 Mbit) Memory

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EP3SE110F1152C4L Tóm tắt

The Intel EP3SE110F1152C4L is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) integrating 107500 logic elements and 8936448 bits of embedded memory in a 1152-ball Fine-pitch Ball Grid Array (FBGA) package. Operating at up to 800 MHz internal frequency with a 0.9 V core supply, it is engineered for high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path designs. The device exposes 744 user I/O pins to support parallel chip-to-chip interconnects.

A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic through configurable logic blocks (CLBs), routing interconnect, and hard IP blocks such as transceivers and memory controllers. FPGAs sit in the broader hierarchy of programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared to ASICs, FPGAs offer in-system reprogrammability and faster time-to-market; compared to CPLDs, they deliver orders-of-magnitude higher logic capacity and richer DSP/embedded-memory resources.

Key features of the EP3SE110F1152C4L include 107500 logic elements for high gate-count designs, 8936448 bits (about 8.9 Mbit) of embedded RAM for packet buffering and data caching, 744 maximum user I/Os for wide external buses, and 800 MHz maximum internal operation for high-throughput datapaths. The 1152-ball FCBGA package supports controlled-impedance signal routing required by LVDS and DDR memory interfaces typical of Stratix III designs.

Architecturally, the Stratix III E series uses an enhanced adaptive logic module (ALM) fabric and MultiTrack interconnect for predictable timing closure. Hard IP blocks include high-speed transceivers, dedicated DSP blocks, and embedded TriMatrix memory that can be configured as single-port, simple dual-port, or true dual-port with separate read/write clocks.

Typical applications include ASIC prototyping, high-speed networking line cards, DSP accelerator cards, video broadcast equipment, and test and measurement platforms. The combination of high logic density, abundant I/O, and 8.9 Mbit embedded RAM makes it suitable for designs previously requiring multiple smaller FPGAs.

When designing with this device, ensure PCB layout supports the FCBGA ball pitch with microvia stack-ups, and that the Quartus II toolchain version matches the device silicon revision (C4 speed grade 4, commercial temperature 0C-85C). Plan power sequencing for the 0.9 V core rail with sufficient decoupling.

This page synthesizes distributor inventory, same-family drop-in variants, and Stratix III design notes not consolidated on any single manufacturer or distributor page.

Bộ thay thế dễ dàng lắp đặt cho EP3SE110F1152C4L — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SE110F1152C4L (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Family, Speed Grade, Process Technology.

EP3SE110F1152C2

Intel

Package: 1152-ball FC-BGA

Family: Stratix III E (Enhanced)

Process Technology: 65 nm