Altera

EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA

Name: EP4SGX530HH35C2NES - 531K LE Stratix IV GX FPGA, 1152-FCBGA
Brand: Altera
SKU: EP4SGX530HH35C2NES

MPN: EP4SGX530HH35C2NES ✗ Cuối đời

0.9 V Vdss 1152-ball FC-HFBGA (Flip-Chip), 42.5 x 42.5 mm Package 800 MHz Speed 28,033,024 Memory

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MOQ: 1 |

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EP4SGX530HH35C2NES Tóm tắt

The Altera (now Intel) EP4SGX530HH35C2NES is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 531,200 logic elements and 564 user I/O pins in a 1152-ball Flip-Chip FineLine BGA (FC-HFBGA) package measuring 42.5 mm x 42.5 mm. The device is supplied from a 0.9 V core rail and is rated for the commercial 0 C to 85 C operating range, with an internal clocking fabric rated up to 800 MHz per the manufacturer specification.

A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacture. FPGAs sit at the top of the programmable-logic hierarchy - below them are CPLDs (smaller, non-volatile, glue-logic oriented) and above them are ASICs (volume-optimized fixed-function ICs). The Stratix IV GX family specifically combines high logic density with up to 24 transceivers supporting multi-gigabit serial protocols, positioning the device between pure logic-centric FPGAs and dedicated SerDes ASSPs.

Key features of this part include 531,200 logic elements, 28,033,024 bits of embedded memory, dedicated DSP blocks for fixed- and floating-point arithmetic, 8.5 Gbps-capable transceivers on Stratix IV GX, and a configuration controller supporting passive, active, and JTAG programming modes. The 1152-ball FCBGA package exposes 564 user I/Os with mixed-voltage support through banked I/O structures, and the flip-chip thermal interface enables sustained operation in space-constrained line cards.

Architecturally, the EP4SGX530HH35C2NES uses Adaptive Logic Modules (ALMs) feeding a hierarchical routing fabric, with M20K and MLAB memory blocks distributed column-wise, and variable-precision DSP blocks adjacent to those columns. Compared with the preceding Stratix III family, Stratix IV adds 8.5 Gbps transceivers and improved power management through hard PCIe Gen1/Gen2 IP blocks; compared with the successor Stratix V, the device trades lower power and higher transceiver rate (up to 14.1 Gbps) for the lower cost per logic element that the mature 40 nm process enables.

Typical applications include high-performance digital signal processing in defense radar and electronic-warfare systems, ASIC prototyping for networking ASICs, multi-gigabit serial backplane aggregation in telecom line cards, video broadcast infrastructure with on-chip transceivers, and high-throughput PCIe Gen2 endpoint designs. The device's combination of logic density and integrated transceivers lets designers replace multiple smaller FPGAs or a discrete SerDes plus FPGA pair with a single component.

When designing with this device, ensure the PCB supports the FCBGA's 1.0 mm ball pitch with matched-length impedance control for transceiver lanes, and provide a multi-rail power solution (typically 0.9 V core, 1.1 V PLL, 2.5 V/3.3 V I/O banks) with proper sequencing. Thermal management must consider that the flip-chip BGA draws heat primarily through the balls and PCB copper; a heatsink or thermal interface material is required for sustained full-operation workloads.

This page synthesizes distributor pricing for the EP4SGX530HH35C2NES, same-package Stratix IV GX alternatives from the Site MPN list, and practical design notes that complement - rather than duplicate - the manufacturer datasheet.

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Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4SGX530HH35C2NES (cùng hình factor và footprint) — khác nhau ở Package, Family, Speed Grade, Mounting Type, Operating Temperature.

EP4SGX360HF35C2

Intel

Family: Stratix IV GX FPGA

Mounting Type: Surface Mount (Flip-Chip BGA)

Operating Temperature: 0C to +85C (commercial)