EPF10K130EFC672-2 - 130K Gates FLEX 10KE FPGA | Altera | 672-BGA
MPN: EPF10K130EFC672-2 ✗ Cuối đờiEPF10K130EFC672-2 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device belonging to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the integrated-circuit taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit. The FLEX 10KE family combines a fine-grained Look-Up Table (LUT)-based logic array with an embedded array block (EAB) that can be configured as memory, multipliers, or specialized logic, allowing a single chip to replace dozens of discrete 74-series logic parts.
Key features include 832 Logic Array Blocks (LABs), 413 maximum user I/Os, 65,536 RAM bits, dedicated carry and cascade chains for fast arithmetic, and built-in JTAG (IEEE 1149.1) boundary-scan support. The 672-ball FineLine BGA package exposes a large number of general-purpose I/Os that are 5 V-tolerant on input, simplifying interfacing with legacy TTL/CMOS peripherals without external level shifters. Operating temperature range is 0 °C to +70 °C (commercial grade), with the speed grade -2 placing the device in a balanced performance tier of the family.
Typical applications include high-density glue logic, telecommunications backplane interfaces, ASIC prototyping, image and video pre-processing pipelines, industrial control boards, and legacy system upgrades that require large numbers of I/O channels and configurable logic. The EPF10K130EFC672-2 is widely deployed in long-lifecycle industrial and defense systems where the proven FLEX 10KE tool flow (Quartus II or MAX+PLUS II) remains in active use.
When designing with this device, pay close attention to power-rail decoupling: each VCCINT and VCCIO bank should have its own 0.1 µF and 10 µF ceramic capacitor pair placed within 5 mm of the BGA balls. The 672-pin BGA package requires careful PCB stack-up planning to fan out all signals without exceeding manufacturability limits on via-in-pad and microvia density.
This page synthesizes distributor stock data, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet to support engineers maintaining FLEX 10KE designs.
Bộ thay thế dễ dàng lắp đặt cho EPF10K130EFC672-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF10K130EFC672-2 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Speed Grade, Core Supply Voltage.
EPF10K130EFC672-3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K130EFC672-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K130EFC672-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K130EFI672-2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPF10K200EFC672-2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF10K130EFC672-2 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 10KE |
| Logic Elements / Cells | 6,656 |
| Total Gates | ~130,000 |
| Logic Array Blocks (LABs) | 832 |
| Embedded Memory (RAM bits) | 65,536 |
| Maximum User I/Os | 413 |
| Number of I/O Pins | 672 (package pins) |
| Hộp | 672-ball FineLine BGA |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Propagation Delay (typ.) | 0.6 ns |
| Internal Operating Frequency (max) | 333.33 MHz |
| Nhiệt độ hoạt động | 0 °C to +70 °C (Commercial) |
| Speed Grade | -2 |
| Programming Method | SRAM-based, JTAG (IEEE 1149.1) |
| Kiểu lắp đặt | Surface Mount (BGA) |
Hướng dẫn cấu hình chân EPF10K130EFC672-2 672-ball fineline bga
Cấu hình chân cho EPF10K130EFC672-2 (672-ball fineline bga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EPF10K130EFC672-2.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EPF10K130EFC672-2 phù hợp cho 6 Áp dụngs: Telecommunications Backplane Interface, ASIC Prototyping Platform, Industrial Control and Machine Vision Pre-Processing, Legacy Defense and Avionics Upgrades, High-Density Glue Logic Replacement, Test and Measurement Instrumentation Backplane.
Telecommunications Backplane Interface
The EPF10K130EFC672-2 is well suited to legacy telecom backplane designs that require large numbers of I/O channels and configurable glue logic. With 413 user I/Os in a 672-BGA package, the FPGA can directly interface 8-bit or 16-bit parallel buses on multiple cards without external transceivers. Its 0.22 µm CMOS process and 2.5 V core provide low static power suitable for always-on central-office equipment, while the 333.33 MHz internal operating frequency comfortably handles TDM and LVDS signalling up to 155 Mbps. Compared to a discrete 74-series TTL implementation, this single FPGA replaces dozens of packages and shortens time-to-market for new line-card variants.
Được đề xuất
ASIC Prototyping Platform
Engineers use the EPF10K130EFC672-2 as an ASIC prototype vehicle for mid-complexity ASICs because of its 130K-gate capacity and embedded array blocks (EABs) that can implement dual-port RAM, FIFO, and small multipliers. The JTAG-supported SRAM programming model lets designers iterate logic quickly between simulations and real silicon. The 672-BGA package exposes enough user I/O to mimic 200+ signal ASIC pads, which covers most mid-range gate-array designs. Quartus II synthesis delivers repeatable timing closure across prototype and pilot runs.
Được đề xuất
Industrial Control and Machine Vision Pre-Processing
The 6,656 logic elements and 65,536 embedded RAM bits make the EPF10K130EFC672-2 effective for line-scan camera pre-processing, where pixel data must be buffered in dual-port RAM and reduced through a pipeline of histogram and threshold blocks before reaching a host CPU. Its commercial 0 °C to +70 °C temperature range covers most factory-floor enclosures, and the wide 3.3 V I/O tolerance enables direct connection to CMOS image sensors without level shifters. The 413 user I/Os simultaneously carry parallel camera data, encoder feedback, and isolated GPIO to motor drivers in a compact BGA footprint.
Được đề xuất
Legacy Defense and Avionics Upgrades
Long-lifecycle military platforms depend on the FLEX 10KE family because Altera/Intel continues to support tool flows (MAX+PLUS II, Quartus II) for the EPF10K130EFC672-2 well beyond commercial product life. The SRAM-programmable logic allows field upgrades via JTAG without removing cards, and the 672-BGA package provides sufficient I/O for MIL-STD-1553, ARINC 429, and discrete interfaces. With its 2.5 V core and 0.22 µm process, the device delivers predictable performance for safety-critical signal routing, although it is not AEC-Q100 qualified and is not used in automotive safety applications.
Được đề xuất
High-Density Glue Logic Replacement
Designers use the EPF10K130EFC672-2 to replace dozens of 74-series TTL, CMOS, and PAL/GAL devices with a single programmable device, shrinking board area and BOM cost. With 832 LABs and built-in carry chains, the device efficiently implements counters, address decoders, bus arbiters, and state machines that previously required multiple discrete packages. The 672-BGA FineLine package supports the high I/O fan-out typical of glue-logic consolidation, and Quartus II synthesis preserves the original 74-series pin naming conventions to simplify porting legacy schematics.
Được đề xuất
Test and Measurement Instrumentation Backplane
Test equipment such as logic analyzers, protocol exercisers, and ATE fixtures use the EPF10K130EFC672-2 as a flexible pattern-generator and pin-electronics controller. The 413 user I/Os map cleanly onto 32-bit data buses plus control and clock lines, and the 65,536-bit embedded memory serves as on-chip pattern buffer. JTAG programming allows rapid fixture reconfiguration for different device-under-test packages, while the 333.33 MHz internal rate supports pattern rates well into the hundred-MHz range required for high-speed digital test. The 672-BGA package keeps the backplane card compact inside the instrument chassis.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF10K130EFC672-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF10K130EFC672-3 | EPF10K130EFC672-1 | EPF10K130EFI672-2 | EPF10K200EFC672-2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 672-Ball FineLine BGA | 672-Ball FineLine BGA - same | 672-Ball FineLine BGA - same | 672-Ball FineLine BGA - same | 672-Ball FineLine BGA - same |
| Logic Elements | 6,656 | 6,656 | 6,656 | 6,656 | 9,984 (approx) |
| Total Gates | ~130,000 | ~130,000 | ~130,000 | ~130,000 | ~200,000 |
| User I/Os | 413 | 413 | 413 | 413 | 375 (approx, due to larger die) |
| Speed Grade | -2 | -3 (faster) | -1 (slower) | -2 | -2 |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
Bảo phân biệt quan trọng
- Highest I/O count in 672-BGA FLEX 10KE family (vsEPF10K200EFC672-2)
- Commercial-grade temperature rating at lowest cost (vsEPF10K130EFI672-2)
- Balanced speed grade -2 for cost-performance ratio (vsEPF10K130EFC672-3)
Ghi chú thiết kế
The FLEX 10KE EPF10K130E requires a clean 2.5 V VCCINT supply capable of delivering 1-2 A under typical operating conditions, plus a separate VCCIO rail configurable to 2.5 V or 3.3 V per I/O bank. Place one 0.1 µF and one 10 µF ceramic capacitor pair within 5 mm of each VCCINT ball cluster, and replicate the same decoupling on every VCCIO ball. The PLL analog supply VCCA must be tied to a quiet 1.5 V rail even if the PLL is unused - leaving it floating causes unstable operation.
The 672-ball FineLine BGA requires at least a 4-layer PCB stack-up with dedicated ground and power planes to fan out all signals on a 1.0 mm pitch. Microvia or via-in-pad technology is recommended for inner rows to break out the BGA. Maintain a continuous ground plane under the device to provide a low-impedance return path for the high-speed JTAG and clock signals, and keep all VCCIO banks routed as planes to minimize IR drop.
Estimated: configuration time after power-on can exceed 100 ms for a fully-utilized 130K-gate design; design reset circuits accordingly. Do not leave any VCCIO bank unconnected - unused banks must still be tied to a valid 2.5 V or 3.3 V rail so input buffers are not floating. JTAG chain integrity must be verified before production - a single open TDI or TMS pin will prevent programming. Finally, always load the correct FLEX 10KE BSDL file into the JTAG boundary-scan tool, because generic BSDL files do not match the 672-BGA variant.
Thông tin tuân thủ
RoHS and lead-free per Altera/Intel legacy product environmental data. Not AEC-Q100 qualified - automotive safety applications should use a different device. Halogen-free status not stated in available data; conflict-minerals compliance per Altera/Intel statement.