EPF6024ATC144-3N - 24K Gates FLEX 6000 FPGA, 144-LQFP | Altera / Intel
MPN: EPF6024ATC144-3N ✗ Cuối đờiEPF6024ATC144-3N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines the architecture of gate arrays with user-programmable interconnect and logic resources. FPGAs sit at the top of the programmable logic hierarchy: simple PLD -> CPLD -> FPGA -> SoC FPGA. They are widely used for glue logic, custom state machines, bus interfacing, and pre-silicon prototyping where ASIC NRE costs are not justified. The FLEX 6000 series was Altera's low-cost, SRAM-based family optimized for high-volume, cost-sensitive designs such as consumer electronics, peripheral controllers, and industrial glue logic.
Key features of the EPF6024ATC144-3N include 196 LABs each containing 16 Logic Elements (LEs), dedicated carry chains for fast arithmetic, a Cascade Chain for wide fan-in logic, embedded SRAM via the Configurable Logic Array (CLA) architecture, and JTAG-based IEEE 1149.1 boundary-scan support. The device supports in-system configuration via the Passive Serial (PS), Passive Parallel Synchronous (PPS), and Passive Parallel Asynchronous (PPA) modes. MultiVolt I/O allows each I/O bank to be powered independently at 3.3 V or 5.0 V for mixed-voltage designs.
Architecturally, the FLEX 6000 family uses a continuous, SRAM-based routing fabric (FastTrack Interconnect) that delivers predictable timing across the device. The 0.42 µm four-metal-layer process, combined with the LUT-based logic element, makes the EPF6024ATC144-3N suitable for designs requiring up to ~16,000 usable gates. Configuration data is stored in an external serial or parallel PROM (EPC1, EPC2, EPC16) and loaded on power-up; the device can also be reconfigured in-system for design updates or field upgrades.
Typical applications include peripheral bus bridging (PCI, ISA, VME), custom peripheral controllers in telecom line cards, industrial glue logic, glue and bridging logic in legacy system designs, low-cost DSP co-processing front-ends, and prototyping platforms for ASIC emulation. The 144-LQFP footprint is friendly to standard SMT assembly lines and 4-layer FR-4 PCB designs, making it ideal for cost-driven production where fine-pitch BGA rework is undesirable.
When designing with the EPF6024ATC144-3N, pay attention to I/O bank voltage grouping. The VCCINT pins must connect to a tightly-decoupled 3.3 V rail, while VCCIO pins can be grouped per-bank at 3.3 V or 5.0 V. Unused I/O pins should be left floating or driven to a defined logic level after configuration. This device is now obsolete per Intel/Altera lifecycle; consider the MAX II or Cyclone series for new designs, but verify pin-by-pin compatibility before swapping.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers an actionable reference for sourcing the EPF6024ATC144-3N and qualifying alternates for obsolete-stock designs.
Bộ thay thế dễ dàng lắp đặt cho EPF6024ATC144-3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF6024ATC144-3N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Speed Grade, Configuration Memory.
EPF6024ATC144-3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF6024ATC144-2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF6024ATC144-1N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPF6024ATC144
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EPF6016ATC144-3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPF6024ATC144-3N Tỷ lệ tối đa & tính chất điện
| Family | FLEX 6000 |
| Typical Gates | 24,000 |
| Logic Elements / Cells | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| User I/Os | 117 |
| Process Technology | 0.42 um CMOS, 4 metal layers |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 3.3 V or 5.0 V (per bank, MultiVolt) |
| Nhiệt độ hoạt động | 0 °C to 85 °C (TJ) |
| Internal Frequency (max) | 142.86 MHz |
| Hộp | 144-pin LQFP (TQFP, 1.4 mm height) |
| Kiểu lắp đặt | Surface Mount |
| Configuration Mode | Passive Serial / Passive Parallel Synchronous / Passive Parallel Asynchronous |
| JTAG Support | IEEE Std 1149.1 boundary-scan |
| Trạng thái vòng đời | Obsolete |
Cấu hình chân EPF6024ATC144-3N
| Chân 1 | GND — Ground |
| Chân 2 | I/O — User I/O pin |
| Chân 3 | I/O — User I/O pin |
| Chân 4 | I/O — User I/O pin |
| Chân 5 | I/O — User I/O pin |
| Chân 6 | I/O — User I/O pin |
| Chân 7 | I/O — User I/O pin |
| Chân 8 | I/O — User I/O pin |
| Chân 9 | I/O — User I/O pin |
| Chân 10 | I/O — User I/O pin |
| Chân 11 | I/O — User I/O pin |
| Chân 12 | I/O — User I/O pin |
| Chân 13 | GND — Ground |
| Chân 14 | I/O — User I/O pin |
| Chân 15 | I/O — User I/O pin |
| Chân 16 | I/O — User I/O pin |
| Chân 17 | VCCIO — I/O bank supply voltage (3.3 V or 5.0 V) |
| Chân 18 | I/O — User I/O pin |
| Chân 19 | I/O — User I/O pin |
| Chân 20 | I/O — User I/O pin |
| Chân 21 | I/O — User I/O pin |
| Chân 22 | I/O — User I/O pin |
| Chân 23 | I/O — User I/O pin |
| Chân 24 | I/O — User I/O pin |
| Chân 25 | I/O — User I/O pin |
| Chân 26 | I/O — User I/O pin |
| Chân 27 | GND — Ground |
| Chân 28 | I/O — User I/O pin |
| Chân 29 | I/O — User I/O pin |
| Chân 30 | I/O — User I/O pin |
| Chân 31 | I/O — User I/O pin |
| Chân 32 | I/O — User I/O pin |
| Chân 33 | I/O — User I/O pin |
| Chân 34 | I/O — User I/O pin |
| Chân 35 | I/O — User I/O pin |
| Chân 36 | VCCIO — I/O bank supply voltage (3.3 V or 5.0 V) |
| Chân 37 | I/O — User I/O pin |
| Chân 38 | I/O — User I/O pin |
| Chân 39 | I/O — User I/O pin |
| Chân 40 | I/O — User I/O pin |
| Chân 41 | GND — Ground |
| Chân 42 | I/O — User I/O pin |
| Chân 43 | I/O — User I/O pin |
| Chân 44 | I/O — User I/O pin |
| Chân 45 | I/O — User I/O pin |
| Chân 46 | I/O — User I/O pin |
| Chân 47 | I/O — User I/O pin |
| Chân 48 | I/O — User I/O pin |
| Chân 49 | I/O — User I/O pin |
| Chân 50 | I/O — User I/O pin |
| Chân 51 | I/O — User I/O pin |
| Chân 52 | VCCINT — Core supply voltage (3.3 V) |
| Chân 53 | I/O — User I/O pin |
| Chân 54 | I/O — User I/O pin |
| Chân 55 | I/O — User I/O pin |
| Chân 56 | I/O — User I/O pin |
| Chân 57 | I/O — User I/O pin |
| Chân 58 | GND — Ground |
| Chân 59 | I/O — User I/O pin |
| Chân 60 | I/O — User I/O pin |
| Chân 61 | I/O — User I/O pin |
| Chân 62 | I/O — User I/O pin |
| Chân 63 | I/O — User I/O pin |
| Chân 64 | I/O — User I/O pin |
| Chân 65 | I/O — User I/O pin |
| Chân 66 | I/O — User I/O pin |
| Chân 67 | I/O — User I/O pin |
| Chân 68 | I/O — User I/O pin |
| Chân 69 | VCCIO — I/O bank supply voltage (3.3 V or 5.0 V) |
| Chân 70 | I/O — User I/O pin |
| Chân 71 | I/O — User I/O pin |
| Chân 72 | GND — Ground |
| Chân 73 | I/O — User I/O pin |
| Chân 74 | I/O — User I/O pin |
| Chân 75 | I/O — User I/O pin |
| Chân 76 | I/O — User I/O pin |
| Chân 77 | I/O — User I/O pin |
| Chân 78 | I/O — User I/O pin |
| Chân 79 | I/O — User I/O pin |
| Chân 80 | I/O — User I/O pin |
| Chân 81 | I/O — User I/O pin |
| Chân 82 | I/O — User I/O pin |
| Chân 83 | I/O — User I/O pin |
| Chân 84 | I/O — User I/O pin |
| Chân 85 | I/O — User I/O pin |
| Chân 86 | I/O — User I/O pin |
| Chân 87 | VCCINT — Core supply voltage (3.3 V) |
| Chân 88 | I/O — User I/O pin |
| Chân 89 | I/O — User I/O pin |
| Chân 90 | GND — Ground |
| Chân 91 | I/O — User I/O pin |
| Chân 92 | I/O — User I/O pin |
| Chân 93 | I/O — User I/O pin |
| Chân 94 | I/O — User I/O pin |
| Chân 95 | I/O — User I/O pin |
| Chân 96 | I/O — User I/O pin |
| Chân 97 | I/O — User I/O pin |
| Chân 98 | I/O — User I/O pin |
| Chân 99 | I/O — User I/O pin |
| Chân 100 | I/O — User I/O pin |
| Chân 101 | VCCIO — I/O bank supply voltage (3.3 V or 5.0 V) |
| Chân 102 | I/O — User I/O pin |
| Chân 103 | I/O — User I/O pin |
| Chân 104 | I/O — User I/O pin |
| Chân 105 | I/O — User I/O pin |
| Chân 106 | GND — Ground |
| Chân 107 | I/O — User I/O pin |
| Chân 108 | I/O — User I/O pin |
| Chân 109 | I/O — User I/O pin |
| Chân 110 | I/O — User I/O pin |
| Chân 111 | I/O — User I/O pin |
| Chân 112 | I/O — User I/O pin |
| Chân 113 | I/O — User I/O pin |
| Chân 114 | I/O — User I/O pin |
| Chân 115 | I/O — User I/O pin |
| Chân 116 | I/O — User I/O pin |
| Chân 117 | VCCINT — Core supply voltage (3.3 V) |
| Chân 118 | I/O — User I/O pin |
| Chân 119 | I/O — User I/O pin |
| Chân 120 | GND — Ground |
| Chân 121 | CLK1 — Dedicated global clock input 1 |
| Chân 122 | CLK0 — Dedicated global clock input 0 |
| Chân 123 | MSEL2 — Configuration mode select bit 2 |
| Chân 124 | MSEL1 — Configuration mode select bit 1 |
| Chân 125 | MSEL0 — Configuration mode select bit 0 |
| Chân 126 | nCONFIG — Configuration start (active low) |
| Chân 127 | nSTATUS — Configuration status (active low) |
| Chân 128 | CONF_DONE — Configuration complete indicator |
| Chân 129 | TDI — JTAG Test Data In |
| Chân 130 | TMS — JTAG Test Mode Select |
| Chân 131 | TCK — JTAG Test Clock |
| Chân 132 | TDO — JTAG Test Data Out |
| Chân 133 | DEV_OE — Device-wide output enable (active low) |
| Chân 134 | DEV_CLRn — Device-wide register clear (active low) |
| Chân 135 | INIT — Configuration initialization indicator |
| Chân 136 | DATA0 — Configuration data input bit 0 |
| Chân 137 | DATA1 — Configuration data input bit 1 |
| Chân 138 | DATA2 — Configuration data input bit 2 |
| Chân 139 | DATA3 — Configuration data input bit 3 |
| Chân 140 | DATA4 — Configuration data input bit 4 |
| Chân 141 | DATA5 — Configuration data input bit 5 |
| Chân 142 | DATA6 — Configuration data input bit 6 |
| Chân 143 | DATA7 — Configuration data input bit 7 |
| Chân 144 | VCCIO — I/O bank supply voltage (3.3 V or 5.0 V) |
Ứng dụng tiêu biểu
EPF6024ATC144-3N phù hợp cho 6 Áp dụngs: Peripheral Bus Bridge / Glue Logic, Industrial Glue Logic and Control, Telecom Line Card Interface Logic, ASIC Prototyping and Emulation, Legacy System Refresh / Field Upgrade, Test & Measurement Front-End Logic.
Peripheral Bus Bridge / Glue Logic
The EPF6024ATC144-3N's 1,960 logic elements and 117 user I/Os make it well-suited for legacy peripheral bus bridging (PCI-to-ISA, VME, ISA-to-Local Bus) where ASIC NRE is unjustified. The MultiVolt I/O banks allow direct 3.3 V and 5.0 V interfacing without external level shifters, simplifying mixed-voltage bridges. Designers typically instantiate address decode, wait-state generation, and interrupt steering inside the FPGA, offloading these functions from the host CPU. The 142.86 MHz Fmax on speed grade -3 supports bus frequencies up to ~33 MHz with comfortable timing margin. Estimated: at 50% LE utilization, routing congestion is moderate and fmax holds at >100 MHz. This part obsoletes cleanly into the Cyclone series for new designs but remains useful for legacy field upgrades.
Được đề xuất
Industrial Glue Logic and Control
Factory automation controllers often require custom state machines, encoder interfaces, and motor-control timing that do not fit standard CPLDs. The EPF6024ATC144-3N provides 1,960 LEs across 196 LABs with dedicated carry chains for fast up/down counters, plus the 144-LQFP footprint that is friendly to 4-layer FR-4 PCB assembly. The 0.42 µm CMOS process and 3.3 V core are robust in industrial temperature ranges when derated, though the commercial 0-85 °C TJ spec limits deployment to controlled-cabinet environments. Estimated: typical glue-logic designs run at 25-50% LE utilization with clock rates below 50 MHz, well within the part's capability. For new designs, the MAX II CPLD EPM240 offers lower power in a smaller footprint.
Được đề xuất
Telecom Line Card Interface Logic
Telecom line cards historically used FLEX 6000 FPGAs for TDM bus multiplexing, framer interfacing, and alarm/status aggregation. The EPF6024ATC144-3N's 117 user I/Os provide ample connections for multiple E1/T1 framers, HDLC controllers, and backplane serial links in one device. The 144-LQFP package's 0.5 mm lead pitch is compatible with conventional wave and reflow soldering, simplifying line-card assembly lines that pre-date fine-pitch BGAs. The FLEX 6000 SRAM-based configuration allows field upgrades via JTAG without removing the line card, a key operational benefit. Estimated: a typical line-card interface design uses ~1,500 LEs with 60-80 MHz clock rates; the -3 speed grade delivers comfortable timing margin. The part is obsolete today but remains in legacy telecom deployments.
Được đề xuất
ASIC Prototyping and Emulation
Before committing to a mask-set ASIC, design teams often prototype their RTL on FLEX 6000 FPGAs to validate functionality and timing in real silicon. The EPF6024ATC144-3N provides 24,000 gates / 1,960 LEs that can host medium-complexity subsystems such as a custom DMA engine, peripheral controller, or DSP datapath. Configuration via Passive Serial mode allows fast design-iteration cycles when paired with an EPC2 or EPC16 configuration PROM. Estimated: a typical ASIC prototype fits within 70% LE utilization if synthesis tools target the FLEX 6000 architecture properly; Fmax typically reaches 70-80% of the datasheet number after place-and-route. Multiple EPF6024 devices can be cascaded for larger designs via dedicated carry/cascade chains.
Được đề xuất
Legacy System Refresh / Field Upgrade
Long-lifecycle industrial, military, and aerospace systems often need functional drop-in replacements for obsolete FPGAs to extend service life. The EPF6024ATC144-3N and its same-package variants (EPF6024ATC144-2N, EPF6024ATC144-1N) enable direct board-level replacement without PCB rework. The 'N' suffix indicates lead-free RoHS-compliant terminal finish, matching modern assembly requirements, while the non-N variant supports older SnPb processes. Designers must verify configuration bitstream compatibility across speed grades when substituting. Estimated: configuration bitstream for speed grade -3 typically works on -2 and -1 silicon with timing-only performance differences. This same-package family of alternatives simplifies end-of-life component sourcing.
Được đề xuất
Test & Measurement Front-End Logic
Test equipment front-ends use FPGAs to implement custom trigger logic, pattern generators, and data formatters before the ADC stage. The EPF6024ATC144-3N's 117 user I/Os interface directly to multiple parallel ADC/DAC channels and trigger comparators, while the 1,960 LEs host state-machine sequencing and pattern memory addressing. MultiVolt I/O allows direct interfacing to 5.0 V analog front-ends without level translation. Estimated: a typical pattern-generator design uses ~1,200 LEs with 100 MHz internal clocks; the -3 speed grade supports the 100 MHz target with comfortable margin. The 144-LQFP package is hand-solderable for low-volume prototype builds, a benefit in lab environments where BGA rework stations are unavailable.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF6024ATC144-3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF6024ATC144-3 | EPF6024ATC144-2N | EPF6024ATC144-1N | EPF6024ATC144 | EPF6016ATC144-3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Family | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 | FLEX 6000 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 |
| LABs | 196 | 196 | 196 | 196 | 196 | 132 |
| User I/Os | 117 | 117 | 117 | 117 | 117 | 117 |
| Speed Grade | -3 (142.86 MHz) | -3 (142.86 MHz) | -2 (lower Fmax) | -1 (lowest Fmax) | unspecified | -3 (142.86 MHz) |
| RoHS (N suffix = Pb-free) | Yes (N suffix) | No (SnPb) | Yes | Yes | unknown | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- RoHS-compliant (Pb-free) terminal finish (vsEPF6024ATC144-3)
- Highest speed grade in family (-3) (vsEPF6024ATC144-2N)
- Higher logic density (1,960 LEs) (vsEPF6016ATC144-3N)
Ghi chú thiết kế
The EPF6024ATC144-3N requires a tightly-regulated 3.3 V core supply on VCCINT pins (multiple pins distributed around the package for low-impedance power distribution). Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 3 mm of the pin, plus one bulk 33 µF tantalum per device. VCCIO pins support either 3.3 V or 5.0 V per bank; group I/O by voltage in your PCB schematic and place one decoupling cap per VCCIO pin. Estimated: total quiescent current ICCINT for a fully utilized EPF6024 is in the 50-150 mA range; verify with Quartus II PowerPlay early in the design cycle.
Use a 4-layer PCB stackup with continuous ground and power planes for the 144-LQFP footprint. Route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL0-2, DATA0-7) as short, parallel traces to the EPC configuration PROM. Keep JTAG chain signals away from switching I/O to avoid boundary-scan false triggers. The 0.5 mm lead pitch of LQFP requires 0.25 mm/0.20 mm trace/space design rules; larger packages like BGA-256 variants of this family would need 0.15 mm rules. Estimated: a 144-LQFP routes cleanly on 4-layer FR-4 with 4 mil traces and 4 mil spaces.
Three common pitfalls: (1) VCCIO bank mixing - all I/Os in a bank must share the same VCCIO voltage; mixing 3.3 V and 5.0 V outputs in the same bank damages the output drivers. (2) Configuration mode selection - MSEL0-2 pins must match the configuration mode (PS, PPS, PPA) hard-coded or driven at power-up; wrong MSEL settings leave the device unconfigured. (3) Speed-grade bitstream portability - bitstreams compiled for speed grade -3 generally work on -2 and -1 silicon but at reduced timing performance; never recompile if you only need to substitute speed grades. Estimated: configuration time from EPC2 PROM is ~50 ms typical for the EPF6024.
The EPF6024ATC144-3N in 144-LQFP is rated 0 °C to 85 °C junction temperature in the commercial grade. The LQFP package has a thermal resistance theta-JA around 35-45 °C/W (without airflow); with 1 W dissipation the junction rises ~40 °C above ambient. Estimated: a fully-utilized 1,960 LE design switching at 100 MHz dissipates 0.5-1.5 W depending on toggle rate; design margin should assume 2 W worst case for thermal verification. For designs approaching 2 W, use industrial-grade silicon where available or add 100 LFM airflow.
Thông tin tuân thủ
Lead-free / Pb-free terminal finish per the 'N' suffix (JEDEC J-STD-609). RoHS compliance inferred from N-suffix designation per Altera/Intel product marking convention. AEC-Q100 qualification not applicable for commercial-grade FPGA. REACH, halogen-free, and conflict-mineral declarations not present in verified data and marked unknown.
