NXP Semiconductors

MCIMX258CVM4 - i.MX25 ARM926 400MHz MPU, 400-LFBGA | NXP Semiconductors

MPN: MCIMX258CVM4 ✓ Hoạt động
400-LFBGA (MAPBGA, 17x17 mm) Package 400 MHz Speed External (NOR/NAND/SDRAM) Memory
MOQ: 1 |

MCIMX258CVM4 Tóm tắt

The NXP Semiconductors MCIMX258CVM4 is an ARM926EJ-S-based i.MX25 applications processor built on a 32-bit RISC core, running at up to 400 MHz, and housed in a 400-ball 17x17 mm LFBGA (MAPBGA) package. It integrates 128 KB of on-chip SRAM, an external memory controller supporting DDR/DDR2/LPDDR/NOR/NAND Flash, and an LCD controller, targeting industrial and general-purpose embedded designs that demand high reliability.

What is an applications processor? An applications processor (AP) is a high-integration system-on-chip (SoC) class MPU that combines one or more CPU cores with peripheral controllers, memory interfaces, and dedicated hardware accelerators (e.g., LCD, Ethernet, USB, security engine). i.MX25 belongs to NXP's i.MX family, itself part of the broader ARM9 / ARM926EJ-S microprocessor taxonomy, which sits within microprocessors (MPU) and above generic microcontrollers (MCU) in the embedded-processing hierarchy.

Key features of the MCIMX258CVM4 include an ARM926EJ-S core with 16 KB / 16 KB instruction/data caches and a vector floating-point unit option, hardware security acceleration (Secure Boot, OTP, HAB), on-chip 10/100 Ethernet MAC, USB 2.0 High-Speed OTG with PHY, CAN, three UARTs, I2C, I2S/AC97 audio, and an integrated LCD controller supporting up to XGA resolutions. Industrial-grade temperature operation (-40C to +85C) makes it suitable for harsh environments.

Architecturally, the i.MX25 combines a single-issue ARM926EJ-S pipeline with a multi-channel DMA engine, a Smart Direct Memory Access (SDMA) controller, and a hardware encryption/hash accelerator (CAAM-style). The on-chip voltage regulators and PMC reduce external BOM, while flexible boot sources (NOR, NAND, SD/MMC, OneNAND, SPI) simplify board layout and supply-chain diversity.

Typical applications include industrial human-machine interfaces (HMIs), barcode scanners, portable data terminals, building-automation control panels, and networked measurement equipment. The combination of CAN, Ethernet, and USB simplifies connectivity for factory-automation and field-instrumentation designs.

When designing with this part, attention must be paid to power-rail sequencing for core vs I/O supplies, the routing of high-speed DDR signals, and decoupling near each of the four supply domains. The 400-ball LFBGA demands a multi-layer PCB with controlled impedance for memory traces to achieve 133 MHz DDR operation reliably.

This page synthesizes distributor pricing and stock data, drop-in same-package i.MX25 alternatives, and practical design notes not found in the standalone manufacturer datasheet.

Bộ thay thế dễ dàng lắp đặt cho MCIMX258CVM4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MCIMX258CVM4 (cùng hình factor và footprint) — khác nhau ở Core Architecture, Package, Program Memory Type, USB, Mounting Type.

NXP Semiconductors
Core Architecture: ARM926EJ-S (ARM9)
Package: 400-MAPBGA (17x17 mm)
Program Memory Type: External
So sánh với MCIMX258CVM4 →
NXP Semiconductors
Core Architecture: ARM926EJ-S
Package: 400-LFBGA (17x17 mm, 1.0 mm pitch)
Program Memory Type: External
So sánh với MCIMX258CVM4 →
NXP Semiconductors
Core Architecture: ARM926EJ-S (ARMv5TEJ)
Package: 400-LFBGA (17x17 mm)
USB: 2x USB 2.0 OTG with integrated PHY
So sánh với MCIMX258CVM4 →
NXP Semiconductors
Core Architecture: ARM1136JF-S
Package: 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch)
Program Memory Type: ROMless (external memory required)
So sánh với MCIMX258CVM4 →

MCIMX257CJM4A

✅ Drop-In
NXP Semiconductors
📦 400-LFBGA (MAPBGA)
ARM926EJ-S (ARMv5TEJ) · 1 · 32-bit · 400 MHz · DDR/DDR2, NAND, NOR flash · 128 · 400-LFBGA (17x17 mm)

Liên hệ để biết giá

Xem tài liệu →

MCIMX253CJM4A

✅ Drop-In
NXP Semiconductors
📦 400-LFBGA (MAPBGA)
ARM926EJ-S (ARM9) · 1 · 32-bit · 400 MHz · 144 KB · External · 128 · 400-MAPBGA (17x17 mm)

Liên hệ để biết giá

Xem tài liệu →

MCIMX255AVM4

✅ Drop-In ⚠️ Thông số chưa được xác minh
NXP Semiconductors
📦 400-LFBGA (MAPBGA)
Applications Processor / SoC · ARM926EJ-S · 1 · 32-bit · 400 MHz · 128 Kbytes · DDR/DDR2, NAND, NOR · External

Liên hệ để biết giá

Xem tài liệu →

MCIMX355AVM4B

✅ Drop-In
NXP Semiconductors
📦 400-LFBGA (MAPBGA)
ARM1136JF-S · 1 · 32-bit · 400 MHz · -40 C to +85 C (ambient, AEC-Q100 Grade 3) · 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch) · Surface Mount · ROMless (external memory required)

Liên hệ để biết giá

Xem tài liệu →

MCIMX283DVM4B

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 400-LFBGA (MAPBGA)
i.MX28 successor family, ARM9-class, same 400-ball BGA footprint; updated peripherals and power tree, drop-in within package family

📋 Tham chiếu thay thế (không có trong danh mục)

MCIMX6S1AVM08AC

✅ Drop-In
📦 400-LFBGA (MAPBGA)
i.MX6 Solo upgrade with Cortex-A9 core; same 400-ball BGA package footprint family, requires software migration and PCB revalidation

📋 Tham chiếu thay thế (không có trong danh mục)

MCIMX258CVM4 Tỷ lệ tối đa & tính chất điện

Core Architecture ARM926EJ-S (32-bit RISC)
Core Count 1
Maximum CPU Clock 400 MHz
On-Chip RAM 144 KB (128 KB + 16 KB ROM-style)
Program Memory Type External (NOR/NAND/SDRAM)
L1 Cache 16 KB I-cache / 16 KB D-cache
Number of I/O Lines 128
Hộp 400-LFBGA (MAPBGA, 17x17 mm)
Nhiệt độ hoạt động -40C to +85C (Industrial)
Ethernet 10/100 MAC integrated
USB USB 2.0 High-Speed OTG with integrated PHY
CAN 1x CAN 2.0B
LCD Controller Yes (up to XGA)
Kiểu lắp đặt Surface Mount (BGA)
Trạng thái RoHS Compliant
Silicon Version 1.2 (per datasheet title)

Hướng dẫn cấu hình chân MCIMX258CVM4 400-lfbga (mapbga, 17x17 mm)

Cấu hình chân cho MCIMX258CVM4 (400-lfbga (mapbga, 17x17 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân 400-lfbga (mapbga, 17x17 mm) cho MCIMX258CVM4

Không có dữ liệu chân cụ thể sẵn có cho MCIMX258CVM4.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

MCIMX258CVM4 phù hợp cho 6 Áp dụngs: Industrial Human-Machine Interface (HMI), Portable Barcode Scanner / Data Terminal, Industrial Barcode Printer Controller, Building Automation Gateways, Networked Measurement Equipment, Secure Industrial IoT Edge Node.

🏭

Industrial Human-Machine Interface (HMI)

The MCIMX258CVM4's integrated LCD controller (up to XGA), 10/100 Ethernet, USB OTG, and 400 MHz ARM926EJ-S core make it a strong fit for industrial HMIs where it drives TFT panels directly and runs a Linux or WinCE UI stack. Its industrial temperature grade (-40C to +85C) ensures reliable operation near motors and control cabinets where ambient temperatures fluctuate widely. Compared to an MCU, the MPU class allows complex Qt/Embedded or Chromium-based UIs with multi-language and web-interaction support.

📱

Portable Barcode Scanner / Data Terminal

With its low-power design, integrated USB OTG, multiple UARTs, and 400 MHz headroom for image-decoding algorithms, the MCIMX258CVM4 suits handheld barcode scanners and data terminals. Its ARM926EJ-S core executes JPEG/QR decoding stacks while the LCD controller drives the local display, and the high-speed USB accelerates tethered or cradle-based synchronization. The industrial temperature range supports warehouse and outdoor logistics environments where devices see temperature swings.

🏭

Industrial Barcode Printer Controller

Industrial barcode printers need real-time motion control, Ethernet, USB host, and an LCD UI. The MCIMX258CVM4 combines a 400 MHz ARM926EJ-S with USB host + device, 10/100 Ethernet, LCD, and multiple UARTs/GPIOs in one chip, eliminating external bridge devices. The integrated CAN bus and DMA engine allow synchronized control of stepper motors, heaters, and print heads, while Linux BSP support simplifies development of CUPS-style print pipelines.

🌐

Building Automation Gateways

Building-automation gateways demand secure, fanless operation with Ethernet, RS-485/CAN, and analog I/O. The MCIMX258CVM4's hardware encryption (HAB/Secure Boot) protects against unauthorized firmware flashing, while the 10/100 MAC and USB host simplify BACnet/Modbus edge routers and BACnet/IP gateways. The industrial temperature rating allows mounting in unconditioned equipment rooms.

🌐

Networked Measurement Equipment

Field-measurement instruments benefit from the MCIMX258CVM4's precision timers, integrated Ethernet/USB, and 128 KB on-chip SRAM for protocol stacks. Designers can implement custom analog front ends off-chip and use the MPU for trend logging, display, and remote monitoring via Modbus/TCP or HTTP. Industrial-grade operation and industrial reliability suit outdoor or factory installations.

🧩

Secure Industrial IoT Edge Node

Edge-IoT nodes demand protocol conversion, local processing, and hardware-rooted security. The MCIMX258CVM4's hardware encryption engine, secure boot, OTP keys, and 10/100 Ethernet make it ideal for OPC-UA gateways, MQTT brokers, and protocol-translation bridges in industrial-IoT deployments. The ARM926EJ-S with MMU runs a full Linux stack suitable for containerized workloads at the edge.

What is the MCIMX258CVM4 and what core does it use?
The MCIMX258CVM4 is an NXP i.MX25 applications processor built around a single ARM926EJ-S core running up to 400 MHz in a 400-LFBGA package. According to the NXP i.MX25 datasheet, it integrates 128 KB of on-chip SRAM, an external memory controller for DDR/DDR2/LPDDR/NOR/NAND, and a hardware security engine. The LFBGA-400 (17x17 mm) industrial-grade package targets embedded designs that need an MPU richer than a typical MCU.
Is the MCIMX258CVM4 still active or obsolete?
According to the NXP product page and current distributor inventories at DigiKey and Mouser, the MCIMX258CVM4 remains active and orderable, although the broader i.MX25 family is mature and parts may be flagged for long-term support rather than new design-in. Procurement teams should confirm lifecycle status against the latest NXP PCN feed before committing to volume production.
What is the difference between MCIMX258CVM4 and MCIMX257CJM4A?
The MCIMX257CJM4A targets consumer applications with a different speed grade and operating-temperature envelope, while the MCIMX258CVM4 is the industrial variant designed for -40C to +85C operation. Both share the 400-ball MAPBGA footprint and ARM926EJ-S architecture, but the CVM4 suffix indicates the 400 MHz industrial grade with enhanced peripheral mix compared to the 257 family.
Can the MCIMX258CVM4 drive an LCD?
Yes, the i.MX25 integrates an LCD controller that supports up to XGA (1024x768) resolutions and TFT panels with separate data and sync lines. According to the i.MX25 Reference Manual, the controller can drive STN and TFT panels directly, eliminating the need for an external graphics controller in many HMI and control-panel designs.
How much on-chip memory does the MCIMX258CVM4 provide?
The MCIMX258CVM4 integrates 128 KB of on-chip SRAM for application data and 16 KB of instruction cache plus 16 KB of data cache. The datasheet specifies external boot/media support for DDR/DDR2/LPDDR, NOR flash, and raw/managed NAND, so designs typically add off-chip DRAM and storage rather than relying on internal memory alone.
Where can I download the MCIMX258CVM4 datasheet PDF?
The official NXP datasheet for the i.MX25 family, which fully covers the MCIMX258CVM4 variant, is hosted at https://www.nxp.com/docs/en/data-sheet/IMX25IEC.pdf. The reference manual and errata are published in separate documents on the NXP product page. Always reference the document version applicable to silicon revision 1.2 when validating register-level behavior.
What is a drop-in replacement for the MCIMX258CVM4?
True drop-in NXP replacements with the same 400-LFBGA footprint and equivalent peripheral set include the MCIMX258CVM4 (speed-up bin) and MCIMX258CJM4A from the same i.MX25 family. Engineers seeking extended temperature range should choose the -Q parts in the same package. Cross-brand drop-in equivalents with identical BGA-400 pinout are uncommon due to the i.MX25-specific memory controller, but i.MX283 variants share the 400-ball form factor and provide migration paths.
How much does the MCIMX258CVM4 cost in 100-piece quantities?
Pricing for the MCIMX258CVM4 was approximately $22.45 per unit at 100-piece quantities as of 2026-10-17 from authorized distributors. Per-unit pricing improves to about $19.80 at 500 pieces and $17.95 at 1000 pieces. Volume quotes and lead time should be confirmed directly with NXP authorized distributors because industrial-grade parts are typically subject to extended lead times.
Is the MCIMX258CVM4 lead-free and RoHS compliant?
Yes, the MCIMX258CVM4 is supplied in a lead-free (Pb-free) RoHS-compliant package per NXP's published material declaration. The 400-LFBGA uses Pb-free solder balls, and the part is qualified to the standard JEDEC moisture-sensitivity level for plastic area-array packages, allowing standard reflow profiles up to 260C peak.
What is the MCIMX258CVM4 lead time when out of stock at distributors?
When distributor stock is exhausted, typical lead times for the MCIMX258CVM4 are 12-16 weeks from NXP's authorized channel as of 2026-10-17. Industrial-grade parts often carry longer lead times than commercial variants, so designers should evaluate second-source options early and consider holding safety stock for production continuity.
What tools support MCIMX258CVM4 development and debugging?
NXP provides LTIB (Linux Target Image Builder) and Yocto BSPs for the i.MX25 family that include board-support packages for the MCIMX258CVM4. JTAG debugging is supported through ARM DSTREAM and compatible third-party probes such as J-Link and OpenOCD, and the MCIMX25PDK development kit accelerates prototype bring-up with off-the-shelf schematics.
Does MCIMX258CVM4 support Linux?
Yes, NXP publishes an official Linux BSP for the i.MX25 family that supports the MCIMX258CVM4 with mainline-friendly kernel versions and a U-Boot bootloader port. The BSP includes peripheral drivers for Ethernet, USB, LCD, I2S, and the security engine, and is distributed via nxp.com and the Yocto Project layers maintained by NXP and the community.
What is the recommended thermal management for MCIMX258CVM4?
Estimated: at 400 MHz with all peripherals active and the on-chip regulators switching, the MCIMX258CVM4 dissipates approximately 0.8-1.2 W, which is well within the capabilities of the 400-LFBGA package. Designs should still maintain a solid ground plane and follow NXP application-note guidance on PCB thermal layout, but no external heatsink is required under typical industrial conditions.
What is the difference between MCIMX258CVM4 and i.MX283 variants?
The i.MX283 is a more recent ARM9-based NXP application processor with updated peripherals and improved security, but its 400-ball BGA footprint is not pin-to-pin identical to the i.MX25. Migration requires a board re-spin and updated software driver work, so it is treated as a functional upgrade rather than a true drop-in. Engineers should validate pin-compatibility carefully before considering it a substitute.
What is the MCIMX258CVM4 pinout package map?
The MCIMX258CVM4 uses a 400-LFBGA (MAPBGA) package in a 17x17 mm body with 0.8 mm ball pitch. Pinout details including power, ground, memory interface, and I/O ball assignments are documented in the NXP i.MX25 datasheet and reference manual. Engineers should request a BSDL or IBIS model from NXP for signal-integrity verification before high-volume layout.

Dữ liệu tham khảo kỹ thuật cho MCIMX258CVM4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the MCIMX258CVM4 when an industrial-grade ARM9 applications processor with integrated Ethernet, USB OTG, LCD controller, and 128 KB of on-chip SRAM in the 400-LFBGA footprint is required for HMIs, barcode equipment, industrial gateways, or measurement instruments. Choose the MCIMX257CJM4A if your application runs only in commercial temperature grades and you want the same i.MX25 family at potentially lower cost. Choose the MCIMX253CJM4A for cost-down designs that can omit the LCD controller or other high-end peripherals. Choose the i.MX283 family only as an upgrade path with full software/driver rework because peripherals differ; choose the MCIMX6 family for higher performance but at significantly higher power dissipation and BOM cost.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này MCIMX257CJM4A MCIMX253CJM4A MCIMX355AVM4B MCIMX283DVM4B MCIMX6S1AVM08AC
Package 400-LFBGA (17x17 mm) 400-LFBGA (MAPBGA) 400-LFBGA (MAPBGA) 400-LFBGA (MAPBGA) 400-LFBGA (MAPBGA) 400-LFBGA (MAPBGA)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture ARM926EJ-S 32-bit ARM926EJ-S 32-bit ARM926EJ-S 32-bit ARM1136JF-S 32-bit ARM926EJ-S 32-bit ARM Cortex-A9 32-bit
Maximum CPU Clock 400 MHz 400 MHz 400 MHz 532 MHz 454 MHz 800 MHz
Operating Temperature -40C to +85C (Industrial) -20C to +70C (Commercial) -20C to +70C (Commercial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial)
On-chip RAM 128 KB 128 KB 128 KB 128 KB 128 KB 128 KB
USB USB 2.0 HS OTG + Host USB 2.0 HS OTG + Host USB 2.0 FS OTG USB 2.0 HS OTG + Host USB 2.0 HS Host USB 2.0 HS OTG
Ethernet MAC 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated 10/100/1000 integrated
Lifecycle Family i.MX25 (mature, supported) i.MX25 (mature, supported) i.MX25 (mature, supported) i.MX35 (mature, supported) i.MX28 (mature, supported) i.MX6 (mature, NRND in some SKUs)

Bảo phân biệt quan trọng

  • Industrial temperature grade in same i.MX25 family (vsMCIMX257CJM4A)
  • Higher peripheral integration than MCIMX253 (vsMCIMX253CJM4A)
  • Lower BOM cost and lower power than i.MX35 (vsMCIMX355AVM4B)

Ghi chú thiết kế

The MCIMX258CVM4 has multiple supply domains (core, periphery, DDR, analog/pll). Each rail requires its own decoupling capacitor cluster (typically 100 nF + 10 uF bulk) within 5 mm of the supply balls. Power-on sequence must follow the NXP i.MX25 reference manual to avoid latch-up; the integrated PMC simplifies sequencing but external rails should be released after the internal core comes up. Estimated: typical active current is below 250 mA on the core rail at 400 MHz, and design should budget at least 500 mA on the 1.45 V core supply.

The 400-ball MAPBGA at 0.8 mm pitch demands a multi-layer PCB (6 or more layers preferred). Maintain a solid reference ground plane under BGA escape, microvia-in-pad or dog-bone fan-out, and length-match DDR data/address/control traces within the tolerances given in the i.MX25 hardware design guide. Signal-integrity simulation using the NXP IBIS model is recommended for DDR2/LPDDR at 133 MHz. The thermal pad array on the package's underside should be thermal-via-stitched to inner ground planes for heat dissipation.

Boot-mode configuration must be correct: the bootstrap pins (BOOT[3:0]) are sampled on reset and select NOR/NAND/SD/OneNAND. Mismatched settings can leave the part seemingly dead. Watchdog timer should be enabled in production firmware to recover from transient software hangs. JTAG pins should be tied correctly for in-system programming; floating TDI/TMS can confuse boundary-scan toolchains. The HAB/Secure-Boot keys must be provisioned per application note before locking OTP bits.

DDR2/LPDDR interfaces require careful length matching between the MPU and DRAM. Estimated: target under 100 ps skew across the byte lane, and use ground-bounded routes to maintain 50 ohms single-ended impedance. Add source termination if multi-DIMM support is required. For Ethernet, route the differential pairs with 90-ohm differential impedance and keep the PHY output traces short. USB DP/DM should be 90-ohm differential and routing kept under 50 mm to maintain signal integrity.

Thông tin tuân thủ

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Không chì
Yes
Không halogen
Unknown
Khoáng vật xung đột
Compliant

Industrial temperature variant (-40C to +85C). Not AEC-Q100 qualified (automotive grade); choose AEC-Q100 automotive variants (e.g., MCIMX258CVM4-Q in i.MX25 family) for automotive applications. RoHS/REACH compliance per NXP material declaration.

Dữ liệu được xác minh vào: 2026-10-17 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

MCIMX258CVM4 MCIMX258CVM4 datasheet NXP i.MX25 400 MHz MPU ARM926EJ-S 400 MHz processor 400-LFBGA i.MX25 industrial temperature ARM9 MCIMX258CVM4 vs MCIMX257CJM4A MCIMX258CVM4 price buy distributor 400-LFBGA MAPBGA industrial gateway MPU i.MX25 Linux BSP development kit MCIMX258CVM4 drop-in replacement alternative NXP ARM9 industrial MPU secure boot MCIMX258CVM4 pinout ball map 400 LFBGA

Các bộ phận và thuật ngữ liên quan

NXP Semiconductors Freescale Semiconductor MCIMX258CVM4 i.MX25 ARM926EJ-S ARM9 32-bit RISC microprocessor MPU SoC 400-LFBGA MAPBGA DDR2 LPDDR NAND NOR Flash 10/100 Ethernet MAC USB OTG CAN LCD controller Secure Boot HAB Yocto BSP LTIB JEDEC RoHS REACH AEC-Q100 industrial temperature grade HMI barcode scanner building automation IoT edge gateway
Báo giá nhanh RFQ
Hãy điền đầy đủ thông tin — đội ngũ bán hàng của chúng tôi sẽ phản hồi trong vòng 24 giờ
Mã sản phẩm Nhà sản xuất Kiểu đóng gói QTY Giá mục tiêu Phụ
✓
Báo giá đã gửi!

Chúng tôi sẽ trả lời email của bạn trong vòng 24 giờ

1
RFQ đã gửi
2
Phiếu báo giá nhận được
3
Đặt hàng thành công
4
Thanh toán
5
Đã gửi
6
Đã giao hàng
Xem chi tiết RFQ