MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP
MPN: MPC8271ZQMIBA ✓ Hoạt độngMPC8271ZQMIBA Tóm tắt
A microprocessor (MPU) is a single-chip CPU that integrates core, cache, memory controller and peripheral interfaces into one package, sitting at the top of the embedded-system hierarchy above microcontrollers (MCUs). The PowerQUICC II family specifically addresses telecom and networking infrastructure where simultaneous high-throughput communication protocol handling and general-purpose control are required. The 'Power Architecture' instruction set is a superset of the original PowerPC ISA and is licensed across multiple vendors, giving the MPC8271 a robust toolchain ecosystem.
Key features of the MPC8271ZQMIBA include 16KB instruction and 16KB data Level-1 caches, a 32-bit 60x bus to external memory, dual 10/100 Ethernet MACs, dual Fast (H.110-like) serial communication controllers, USB, I2C, SPI, and a 32-bit PCI interface. The on-chip CPM offloads protocol processing (ATM, HDLC, Ethernet bridging) from the core, a defining PowerQUICC trait. The 516-PBGA package exposes the full peripheral set while remaining manageable for forced-air cooling at 266MHz.
Architecturally, the device uses a 0.13um HiP7 CMOS process and ties the G2_LE core to the CPM through an internal 32-bit bus; the CPM contains its own RISC controller, serial DMA channels and physical interfaces. Typical power dissipation at 266MHz with both Ethernet MACs active is in the 2.5W range, which is well within the PBGA thermal envelope.
Typical applications include legacy telecom line cards, industrial routers and protocol converters, HDLC/ATM termination boards, and embedded networking appliances that still rely on the PowerQUICC software base. Lead times on new designs are now measured in years because the part is mature.
When designing with this device, allocate PCB real estate for the 516-ball PBGA and follow NXP's power-sequencing recommendation: the 3.3V I/O rail must reach 70% of nominal before the 1.5V core rail is applied to prevent long-term reliability degradation. Use the on-chip PLL configuration and observe the 266MHz maximum frequency for industrial-grade variants.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho MPC8271ZQMIBA — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC8271ZQMIBA (cùng hình factor và footprint) — khác nhau ở Core Architecture, Operating Temperature, PCI Interface, Process Technology, Package.
MPC8271VRMIBA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8272ZQMIBA
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC8248VRMIBA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8247VRTIEA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8270VRMIBA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8271ZQMIBA Tỷ lệ tối đa & tính chất điện
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Processor Type | MPC82xx PowerQUICC II, PowerPC G2_LE |
| Core Architecture | 32-bit Power Architecture (PowerPC) |
| Core Count | 1 (plus CPM RISC engine) |
| Tần số xung maksimum | 266 MHz |
| Core Voltage | 1.5 V |
| I/O Voltage | 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| External Memory Bus | 32-bit 60x bus |
| Hộp | 516-BBGA (TEBGA2), 27x27 mm |
| Process Technology | 0.13 um HiP7 CMOS |
| Ethernet MACs | 2 x 10/100 Mbit/s |
| Serial Communication Controllers | 2 (Fast / H.110-style SCC) |
| PCI Interface | 32-bit PCI 2.3 |
| USB / I2C / SPI | USB 1.1, I2C, SPI |
| Lead Free Status | Contains Lead (SnPb ball variant) |
| Trạng thái RoHS | Non-Compliant (Pb-bearing PBGA) |
Hướng dẫn cấu hình chân MPC8271ZQMIBA 516-bbga (tebga2), 27x27 mm
Cấu hình chân cho MPC8271ZQMIBA (516-bbga (tebga2), 27x27 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC8271ZQMIBA.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC8271ZQMIBA phù hợp cho 6 Áp dụngs: Legacy Telecom Line Cards, Industrial Router / Protocol Converter, HDLC/ATM Termination Board, Embedded Networking Appliance (Firewall/VPN), Wireless Base Station Controller, Print/MFP Controller Board.
Legacy Telecom Line Cards
The MPC8271ZQMIBA's dual Fast serial communication controllers (SCCs) support H.110-like TDM buses used in legacy line cards where it can terminate 64+ time slots per SCC for E1/T1/J1 aggregation. The 266MHz G2_LE core runs the control-plane Linux/RTOS while the CPM offloads HDLC and framing, freeing the core for SS7, SIGTRAN or VoIP signaling. The 1.5V core / 3.3V I/O split matches the 5V-tolerant telecom backplane ASICs typically found on these boards. With dual 10/100 Ethernet MACs it also serves as a LAN-edge aggregation point on the same card, eliminating a companion Ethernet switch IC and shortening BOM cost on long-lifecycle telecom hardware.
Được đề xuất
Industrial Router / Protocol Converter
Industrial routers bridging legacy fieldbus (Profibus, Modbus, CAN) to Ethernet/Internet benefit from the MPC8271ZQMIBA's dual Ethernet MACs and dual SCCs. The CPM offloads protocol handling so the G2_LE core can run an embedded Linux distribution (Linux 2.6/3.x BSPs are still maintained in the LTIB tree) with VPN, firewall and routing stacks. At 266MHz the device delivers wire-speed 100 Mbit/s routing with NAT for small-to-medium branch-office routers. The wide operating-temperature grade and the 27x27 mm PBGA package with 0.8mm ball pitch fit standard 8-layer industrial-grade PCBs with reinforced thermal vias.
Được đề xuất
HDLC/ATM Termination Board
ATM and HDLC termination boards rely on the MPC8271ZQMIBA's on-chip Fast SCCs and the CPM's dedicated serial DMA channels to handle TDM streams up to 50 Mbit/s per channel without CPU intervention. The 16KB instruction and 16KB data L1 caches sustain the G2_LE core at wire-speed for control-plane processing of AAL2, AAL5, and PPP/ML-PPP framing. The 32-bit PCI interface enables the board to plug into standard CompactPCI or VME backplanes used in central-office equipment. The 1.5V core / 3.3V I/O voltage split matches legacy ATM SAR ASICs and reduces level-shifters on the board.
Được đề xuất
Embedded Networking Appliance (Firewall/VPN)
The MPC8271ZQMIBA at 266MHz is sufficient for small/branch-office firewalls, IPSec VPN endpoints, and IPv4/IPv6 routing gateways when paired with a hardware crypto accelerator over PCI. The CPM handles 100 Mbit/s Ethernet PHY connectivity and the G2_LE core runs an embedded firewall distribution (e.g. Linux with iptables/nftables or VxWorks with IPSec). The dual Ethernet MACs enable DMZ/WAN/LAN segmentation without an external switch IC. The 516-PBGA package and 0.13um HiP7 process keep typical power dissipation around 2.5W, manageable with a small heatsink in a fanless 1U appliance chassis.
Được đề xuất
Wireless Base Station Controller
2G/3G wireless base station controllers use the MPC8271ZQMIBA for Abis-interface termination and BTS-side control-plane processing. The dual Fast SCCs map cleanly to the E1/T1 Abis links while the G2_LE core runs Layer 2/3 protocols (LAPD, OML/RSL) on embedded Linux or a proprietary RTOS. The 32-bit PCI interface connects to companion DSP cards that handle the physical-layer baseband. The 266MHz performance sustains several hundred Erlangs of voice traffic per board, and the long-term availability of the PowerQUICC II family keeps deployed networks serviceable for 10+ years.
Được đề xuất
Print/MFP Controller Board
High-end multifunction printer (MFP) controllers historically used the MPC8271ZQMIBA for scan/print/copy pipeline management. The dual Ethernet MACs provide LAN connectivity plus a dedicated scan-to-email port, while the dual SCCs drive the scanner CCD/contact-image-sensor interface. The USB 1.1 port handles direct-from-USB print jobs, and the 32-bit PCI bus connects to image-processing ASICs. The 266MHz G2_LE core runs PostScript/PDF rendering and JPEG compression pipelines for commercial MFP controllers that must sustain 30+ pages per minute.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC8271ZQMIBA — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC8271VRMIBA | MPC8272ZQMIBA | MPC8248VRMIBA | MPC8247VRTIEA | MPC8270VRMIBA |
|---|---|---|---|---|---|---|
| Package | 516-PBGA (27x27 mm, TEBGA2) | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same | 516-PBGA (27x27 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Voltage | 1.5 V | 1.5 V (VR grade) | 1.5 V | 1.5 V (VR grade) | 1.5 V (VR grade) | 1.5 V (VR grade) |
| Ethernet MACs | 2 x 10/100 | 2 x 10/100 | 3 x 10/100 | 2 x 10/100 | 2 x 10/100 | 1 x 10/100 |
| SCC Count | 2 | 2 | 3 | 2 | 2 | 2 |
| PCI Interface | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 | 32-bit PCI 2.3 |
| Lead-Free / RoHS | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) | Contains Lead (non-RoHS) |
Bảo phân biệt quan trọng
- Standard ZQ voltage grade at 1.5V core / 3.3V I/O (vsMPC8271VRMIBA)
- Three Fast SCCs for telecom TDM aggregation (vsMPC8272ZQMIBA)
- Dual 10/100 Ethernet MACs for LAN-edge aggregation (vsMPC8270VRMIBA)
- 266MHz maximum frequency in standard ZQ grade (vsMPC8247VRTIEA)
Ghi chú thiết kế
Power sequencing is mandatory for the MPC8271ZQMIBA: the 3.3V I/O rail must reach 70% of its nominal value (approximately 2.31V) BEFORE the 1.5V core rail is applied. Reverse sequencing or simultaneous ramp-up can cause long-term reliability degradation and latch-up. A supervisor IC such as the TPS3823 or a discrete MOSFET-based sequencer is recommended. Hold the HRESET pin asserted until both rails are stable and the PLL has locked. Decouple each of the 32+ VDD pins with a 0.1uF X7R ceramic plus a 10uF bulk capacitor per the Freescale hardware specifications manual.
At 266MHz with both Ethernet MACs and the 32-bit PCI bus active, typical power dissipation is around 2.5W. With a 516-PBGA thermal pad, theta_JA is approximately 18 C/W on a 4-layer JEDEC test board, giving a junction-to-ambient rise of ~45C at full load. For industrial temperature (85C) operation, a small heatsink or thermal-via array under the exposed die pad is recommended. Do not rely on convection alone in a sealed enclosure.
The 516-PBGA uses a 0.8mm ball pitch on a 27x27 mm substrate, with 26 rows of balls plus an outer row. Route the 60x external memory bus with matched-length traces (typically +/-50 mils) and 50-ohm controlled impedance. The PLL power supply pins (AVDD1/AVDD2) require isolated filtering with a ferrite bead and 10uF + 0.1uF local decoupling. The differential clock pair (PCI_SYNC, PCI_CLK) must be length-matched to within 100 mils. The DDR memory controller signals - if used in the 8248/8272 variants - require Vref and VTT plane considerations not applicable to the SDRAM-only 8271.
Common design pitfalls include: (1) omitting the HRESET pull-up resistor, which prevents the bootloader from starting; (2) using the wrong MODCK[1:3] reset configuration word for the system PLL, which can result in a non-functional core; (3) forgetting the 4.7Kohm pull-up on the TRST pin of the JTAG chain, which prevents boundary-scan access; (4) connecting the Ethernet MACs to PHYs without the required 50MHz reference clock source; (5) using a non-1.5V-tolerant flash/SRAM on the 60x bus. Always prototype with NXP's reference design board (MPC8272ADS) before custom layout.
The 60x external memory bus runs at up to 66MHz with 32-bit data width; SI analysis is required for traces longer than 2 inches. Place the SDRAM chips on the same board layer as the MPC8271 with a maximum trace length of 4 inches. Series-stubs on the address/control bus should be avoided. The dual Ethernet MII/RMII signals must be length-matched within 0.5 inches and isolated from the 60x bus with a ground guard trace. The PCI bus signals require 50-65 ohm routing and a 10Kohm pull-up on each shared signal per the PCI 2.3 specification.
Thông tin tuân thủ
Per distributor data: 'Lead Free Status: Contains Lead'. The MPC8271ZQMIBA uses SnPb (lead-bearing) solder balls and is therefore NOT RoHS-compliant. For RoHS-compliant designs in the same footprint, no direct drop-in exists; consider the MPC8271CVRMIBA RoHS variant if available in your supply chain, or plan for PCB rework. REACH compliance is per the manufacturer's declaration. AEC-Q100 is not applicable - this is a non-automotive-grade processor.
