MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MPN: MSC8157TAG1000A ⚠ Lần mua cuốiMSC8157TAG1000A Tóm tắt
A digital signal processor (DSP) is a specialized microprocessor optimized for numeric-heavy, real-time signal-processing workloads such as baseband demodulation, audio/voice codecs, radar pulse processing, and video transforms. Within the broader semiconductor hierarchy, the MSC8157 belongs to the high-performance DSP family, sitting between general-purpose microcontrollers and full application processors. StarCore-based devices were widely adopted in 3G/4G wireless base stations, media gateways, and defense signal-processing platforms where deterministic per-core throughput matters more than OS-rich user-experience features.
Key features include six SC3850 cores running at 1 GHz, MAPLE-B2 acceleration for forward-error-correction, dual DDR2/DDR3 memory controllers with ECC, dual SRIO (Serial RapidIO) lanes, dual PCIe interfaces, dual GbE MACs, two CIPRI links for inter-DSP interconnect, an MMU, extended programmable interrupt controller (EPIC), and four general-purpose 32-bit timers. The FC-PBGA package offers a compact 29x29 mm footprint while exposing a 1.0 mm ball pitch suitable for high-density multi-layer PCB designs.
The architecture combines SIMD-friendly ALU pipelines with hardware multi-issue and dynamic power management (Wait/Stop/Debug), enabling the MSC8157 to deliver high aggregate MMACS while remaining suitable for thermally constrained chassis. MAPLE-B2 offloads turbo decoding so the SC3850 cores remain available for upper-layer signal processing.
Typical applications include 3G/4G LTE baseband processing, wireless base-station channel cards, media gateways, defense signal-intelligence platforms, and high-density voice/media transcoding appliances where deterministic six-core throughput is required. The dual GbE plus dual SRIO fabric also suits it to packet-processing line cards. NXP product pages flag the part with end-of-life documentation.
When designing with this device, allocate generous PCB layers for the FC-PBGA breakout (1.0 mm pitch requires microvia stack-ups), provision thermal copper under the die, and follow NXP hardware-design guides for DDR2/DDR3 trace-length matching. Expect to validate boot ROM, MAPLE firmware, and SC3850 tool-chain (CodeWarrior / StarCore toolchain) compatibility for any new deployment.
Bộ thay thế dễ dàng lắp đặt cho MSC8157TAG1000A — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MSC8157TAG1000A (cùng hình factor và footprint) — khác nhau ở Package, Mounting Type, Operating Temperature, Core Clock Frequency, RoHS Status.
MSC8156ESAG1000B
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MSC8156HAG1000B
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MSC8251SVT1000B
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MSC8157TAG1000A Thông số kỹ thuật
| Device Type | Six-core Digital Signal Processor (DSP) |
| DSP Architecture | StarCore SC3850 (6x cores) |
| Core Frequency | 1 GHz per core |
| L1 Instruction Cache | 32 KB per core |
| L1 Data Cache | 32 KB per core |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) |
| Accelerator | MAPLE-B2 baseband accelerator |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI |
| Hộp | 783-FCPBGA (29x29 mm) |
| Ball Pitch | 1.0 mm |
| Nhiệt độ hoạt động | -40C to +105C |
| MMU | Yes |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) |
| Timers | 2x 32-bit general-purpose per core |
Hướng dẫn cấu hình chân MSC8157TAG1000A 783-fcpbga (29x29 mm)
Cấu hình chân cho MSC8157TAG1000A (783-fcpbga (29x29 mm) gói). Số thứ tự chân, chức năng và sơ đồ kết nối được xác định trong tài liệu thông số kỹ thuật của nhà sản xuất. Tham khảo nó để biết footprint và hướng dẫn hàn chính xác.
Không có dữ liệu chân cụ thể sẵn có cho MSC8157TAG1000A.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MSC8157TAG1000A phù hợp cho 6 Áp dụngs: 3G/4G LTE Baseband Channel Card, Wireless Base Station Line Card, Media Gateway / Transcoding Appliance, Defense Signal-Intelligence Platform, Industrial Multi-Channel DSP Aggregator, Packet-Processing Line Card.
3G/4G LTE Baseband Channel Card
The MSC8157TAG1000A's six SC3850 cores at 1 GHz plus the MAPLE-B2 turbo/Viterbi accelerator make it a strong fit for LTE physical-layer channel cards where per-subframe FEC timing budgets demand hardware offload. Dual DDR2/DDR3 controllers with ECC keep large soft-bit buffers resident without saturating the bus, while the dual SRIO/CIPRI links allow multi-DSP scaling across the baseband card. The 783-ball FC-PBGA package breaks out the full peripheral set without internal muxing, simplifying PCB layout under heavy signal-integrity constraints. Estimated: aggregate throughput of ~24 GMACS at 1 GHz across six cores plus MAPLE-B2 FEC offload typically handles a 20 MHz LTE sector with margin.
Được đề xuất
Wireless Base Station Line Card
Base-station line cards combine multiple MSC8157DSPs with a host CPU and fronthaul/backhaul fabrics, and the MSC8157TAG1000A integrates 2x SRIO, 2x PCIe, and 2x GbE so it can serve as both compute element and packet engine on the same board. Operating from -40C to +105C, the device tolerates outdoor cabinet thermal swings, while the 1.0 mm FC-PBGA supports high-density stack-up designs that share antenna data with co-located radios. The dual CIPRI links enable direct DSP-to-DSP messaging without consuming host CPU cycles, critical for tight scheduling loops. Estimated: at typical 5-8 W per device the FC-PBGA thermal envelope is comfortable in a fan-cooled chassis.
Được đề xuất
Media Gateway / Transcoding Appliance
Media gateways performing high-density voice (VoIP) and video transcoding benefit from the MSC8157TAG1000A's six SC3850 cores, each capable of independent real-time DSP pipelines. The MAPLE-B2 baseband accelerator is repurposed for FEC-protected media transport in some designs, and the dual GbE MACs allow direct connection to packet fabric without an external switch. DDR2/DDR3 with ECC keeps transcoded frame buffers consistent across long sessions. The 783-ball FC-PBGA footprint is reusable across product variants, simplifying platform engineering. Estimated: six SC3850 cores at 1 GHz handle ~600-1000 simultaneous VoIP transcodes with margin depending on codec complexity.
Được đề xuất
Defense Signal-Intelligence Platform
Defense SIGINT and ELINT systems demand deterministic DSP throughput for wideband captures, and the MSC8157TAG1000A's six SC3850 cores deliver the predictable per-core performance needed for bulk demodulation, decryption front-ends, and pattern-matching pipelines. The -40C to +105C qualification supports field-deployed chassis, while the FC-PBGA package's high pin count exposes SRIO for chaining multiple MSC8157 cards into a single SIGINT rack. MAPLE-B2 acceleration reduces CPU burden for convolutional-code workflows common in SIGINT. The part's EOL status means defense programs typically establish long-term Rochester Electronics supply agreements to guarantee multi-year field life.
Được đề xuất
Industrial Multi-Channel DSP Aggregator
Industrial monitoring, vibration analysis, and machine-learning front-ends use the MSC8157TAG1000A to aggregate many analog channels into one DSP farm, exploiting the six cores to run parallel FFT, filter, and feature-extraction pipelines. The wide operating-temperature range tolerates factory-floor enclosures, and the dual GbE ports carry aggregated results upstream to a host controller. MAPLE-B2 provides additional FEC for noisy industrial links. The 783-ball FC-PBGA at 1.0 mm pitch requires microvia PCB stack-up but is well within standard high-density industrial designs.
Được đề xuất
Packet-Processing Line Card
Although primarily a DSP, the MSC8157TAG1000A's 2x SRIO, 2x PCIe, and 2x GbE plus six SC3850 cores make it useful in custom packet-processing line cards where programmable per-packet logic is required. SC3850 cores run microcode for header parsing, classification, and policy enforcement, while the FC-PBGA's high pin count exposes a clean multi-fabric interface. ECC-protected DDR2/DDR3 maintains table consistency under heavy update churn. Estimated: 1 GHz per core supports line-rate processing for ~1-2 Gbps aggregate traffic per device, scaling linearly across multiple MSC8157s on the card.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MSC8157TAG1000A — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MSC8156ESAG1000B | MSC8156HAG1000B | MSC8251SVT1000B |
|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) | 783-FCBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP USA Inc. |
| Core Count | 6x SC3850 | 4x SC3850 | 4x SC3850 | 1x SC3850 |
| Core Frequency | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| Accelerator | MAPLE-B2 (turbo/Viterbi) | MAPLE-B2 | MAPLE-B2 | MAPLE (no -B2) |
| Memory Interface | Dual DDR2/DDR3 w/ ECC | Dual DDR2/DDR3 w/ ECC | Dual DDR2/DDR3 w/ ECC | DDR3 |
| Lifecycle Status | Last-time-buy (EOL announced) | Last-time-buy (per NXP EOL) | Active (per Xecor) | Last-time-buy (last buy 2017) |
Bảo phân biệt quan trọng
- Highest core count in MSC815x family (vsMSC8156ESAG1000B)
- MAPLE-B2 with dual SRIO/CIPRI for multi-DSP scaling (vsMSC8251SVT1000B)
- Industrial-grade thermal envelope (vsTypical commercial DSP competitors)
Ghi chú thiết kế
The 783-ball FC-PBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvias (laser-drilled 1:1 stack-ups preferred). Plan at least 8-10 PCB layers to break out the dual DDR2/DDR3 buses, dual SRIO, dual PCIe, dual GbE, and dual CIPRI without exceeding 2 signal layers per ball row. Follow NXP's hardware-design guide for via-in-pad and pad diameter recommendations; the FC-PBGA is flip-chip, so direct attach to PCB balls mandates precise paste-mask and reflow profiles.
Estimated: at full load with six SC3850 cores at 1 GHz and MAPLE-B2 active, the MSC8157TAG1000A dissipates roughly 5-8 W depending on workload and voltage. The 29x29 mm FC-PBGA spreads heat adequately for fan-cooled enclosures, but the PCB thermal via array under the die must be sized for ~0.5-1.0 W/cm^2 continuous dissipation. Use NXP's thermal model to compute junction-to-ambient theta_JA for your specific stack-up; derate for -40C to +105C industrial operation.
DDR2/DDR3 memory interfaces require strict trace-length matching per byte lane plus matched impedance to 50 ohm single-ended / 100 ohm differential. SRIO and PCIe links need AC-coupling capacitors and reference-clock routing with skew under 50 ps; SerDes layout should follow NXP's reference designators with ground shielding on both sides of the differential pairs. Estimated: at 1.0 mm ball pitch the breakout escape is feasible with 0.1 mm trace-and-space on outer layers.
Boot ROM configuration must match the actual boot interface (SRIO, PCIe, or serial flash) - misconfiguring boot mode bricks the device until JTAG recovery. MAPLE-B2 firmware version must match the SC3850 core revision; mixing firmware loads from older MSC8156 builds can cause MAPLE fault states. Ensure SC3850 toolchain (CodeWarrior / StarCore) matches the silicon revision; consult NXP errata documents before sign-off.
Thông tin tuân thủ
Compliance flags were not present in the verified web data; consult NXP product page environmental documentation for definitive RoHS/REACH status.
