TLE92623BQXXUMA2 - Mid-Range SBC PMIC, 5V LIN, CAN, VQFN-48 | Infineon
MPN: TLE92623BQXXUMA2 ✓ Hoạt độngTLE92623BQXXUMA2 Tóm tắt
A System Basis Chip (SBC) is a highly integrated multi-rail power management and communication IC used in automotive ECUs. The SBC hierarchy in the broader taxonomy is: SBC -> PMIC (Power Management IC) -> Power Management -> Automotive Semiconductor -> ASIC. By consolidating the 5V LDO, LIN/CAN transceivers, and watchdog logic into one IC, an SBC eliminates the need for a discrete MCU power tree and several companion transceivers, reducing PCB area, BOM count, and BOM cost.
Key specifications of the TLE92623BQXXUMA2 include a 5V/250mA LDO output, integrated CAN-FD transceiver (ISO 11898-1 compliant), LIN 2.x transceiver, integrated window watchdog, and SPI control interface. The device is AEC-Q100 qualified for automotive use and includes overtemperature, overcurrent, and undervoltage protection. Its wide supply range makes it suitable for 12V automotive systems that must survive 24V jump-start and 40V load-dump transients.
The TLE92623BQXXUMA2 uses a BCD (Bipolar-CMOS-DMOS) process that integrates power stages with logic on a single die. The CAN-FD transceiver supports data rates up to 5 Mbps, and the LIN transceiver is compliant with LIN 2.2A. The integrated window watchdog allows fail-safe operation in ISO 26262 ASIL-B capable systems when paired with an external MCU, and SPI allows the host MCU to control power modes and diagnostic registers.
Typical applications include automotive body control modules (BCMs), gateway ECUs, HVAC control units, seat control modules, lighting ECUs, and HVAC/temperature control units where a small SBC can replace discrete 5V LDO + CAN/LIN transceivers. The compact PG-VQFN-48-79 package (~7 mm x 7 mm body) with exposed pad supports high power dissipation.
When designing with this part, decouple the battery pin with a 100nF ceramic capacitor close to the IC, follow Infineon's PCB layout guidelines for the exposed thermal pad, and select the correct SPI watchdog window for the host MCU's startup time. Refer to the manufacturer datasheet for thermal resistance, ESD ratings, and detailed diagnostic register map.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in alternatives from the Infineon OPTIREG SBC family, and practical design notes not found in the manufacturer datasheet alone - a curated reference for automotive ECU hardware engineers evaluating or sourcing the TLE92623BQXXUMA2.
Bộ thay thế dễ dàng lắp đặt cho TLE92623BQXXUMA2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với TLE92623BQXXUMA2 (cùng hình factor và footprint) — khác nhau ở Package, AEC-Q100 Qualification, Watchdog.
TLE92623BQXV33XUMA2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
TLE92633BQXXUMA2
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →TLE92623BQXV33XUMA1
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
TLE9180D32QKXUMA1
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →TLE92623BQXUMA2
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
TLE92623BQXXUMA2 Tỷ lệ tối đa & tính chất điện
| Chức năng | System Basis Chip (SBC) - mid-range |
| Cấu trúc | 5V LDO + CAN-FD + LIN + Watchdog + SPI |
| Battery Supply Voltage (VBAT) | 5.5 V to 28 V (40 V load-dump tolerant) |
| 5V LDO Output Voltage (VCC) | 5.0 V (typ) +/-2% |
| 5V LDO Output Current | 250 mA (typ) |
| CAN-FD Data Rate | Up to 5 Mbps |
| CAN Compliance | ISO 11898-1 |
| LIN Compliance | LIN 2.x / SAE J2602 |
| LIN Data Rate | Up to 20 kbps |
| Watchdog | Integrated window watchdog (SPI-configurable) |
| Control Interface | 16-bit SPI |
| Operating Temperature Range (TJ) | -40 C to +150 C |
| Hộp | PG-VQFN-48-79 (VQFN-48 with exposed thermal pad) |
| Kiểu lắp đặt | Surface Mount |
| AEC-Q100 Qualification | Yes (automotive grade) |
| Trạng thái RoHS | Compliant |
| Cấp MSL | MSL3 |
Cấu hình chân TLE92623BQXXUMA2
| Chân 1 | VBAT — Battery supply input (5.5V to 28V, 40V load-dump tolerant) |
| Chân 2 | VBAT — Battery supply input (parallel pin for high current) |
| Chân 3 | GND — Ground |
| Chân 4 | VCC — 5V LDO output (250mA) |
| Chân 5 | GND — Ground |
| Chân 6 | CSN — SPI chip select (active low) |
| Chân 7 | SCLK — SPI clock |
| Chân 8 | SDI — SPI data input |
| Chân 9 | SDO — SPI data output |
| Chân 10 | RST — Reset output (active low) |
| Chân 11 | INT — Interrupt output (active low) |
| Chân 12 | WK — Wake input |
| Chân 13 | NC — Not connected (per datasheet) |
| Chân 14 | NC — Not connected (per datasheet) |
| Chân 15 | CANH — CAN high-side bus line |
| Chân 16 | CANL — CAN low-side bus line |
| Chân 17 | GND — Ground |
| Chân 18 | LIN — LIN bus line |
| Chân 19 | GND — Ground |
| Chân 20 | WK2 — Wake input 2 / GPIO |
| Chân 21 | GND — Ground |
| Chân 22 | GPIO1 — General purpose I/O 1 |
| Chân 23 | GPIO2 — General purpose I/O 2 |
| Chân 24 | MON — Battery voltage monitor output |
| Chân 25 | NC — Not connected (per datasheet) |
| Chân 26 | NC — Not connected (per datasheet) |
| Chân 27 | VSUP_SENSE — Battery sense input |
| Chân 28 | GND — Ground |
| Chân 29 | VCC — 5V LDO output (parallel pin) |
| Chân 30 | GND — Ground |
| Chân 31 | NC — Not connected (per datasheet) |
| Chân 32 | NC — Not connected (per datasheet) |
| Chân 33 | TEMP — Temperature sensor output |
| Chân 34 | GND — Ground |
| Chân 35 | VIO — Voltage I/O reference for SPI |
| Chân 36 | NC — Not connected (per datasheet) |
| Chân 37 | GND — Ground |
| Chân 38 | NC — Not connected (per datasheet) |
| Chân 39 | NC — Not connected (per datasheet) |
| Chân 40 | NC — Not connected (per datasheet) |
| Chân 41 | GND — Ground |
| Chân 42 | NC — Not connected (per datasheet) |
| Chân 43 | NC — Not connected (per datasheet) |
| Chân 44 | NC — Not connected (per datasheet) |
| Chân 45 | NC — Not connected (per datasheet) |
| Chân 46 | GND — Ground |
| Chân 47 | NC — Not connected (per datasheet) |
| Chân 48 | NC — Not connected (per datasheet) |
| Chân EP | EP — Exposed thermal pad (connect to GND for thermal dissipation) |
Ứng dụng tiêu biểu
TLE92623BQXXUMA2 phù hợp cho 6 Áp dụngs: Automotive Body Control Module (BCM), Automotive Gateway ECU, HVAC Control Module, Lighting ECU (Headlamp / Tail Lamp Controller), Seat Control Module, Door Module / Mirror Control.
Automotive Body Control Module (BCM)
The TLE92623BQXXUMA2 is well suited for body control modules because it integrates the 5V LDO that powers the host MCU, a CAN-FD transceiver for backbone communication, a LIN 2.x transceiver for seat/lighting slave nodes, and a window watchdog for ISO 26262 ASIL-B fail-safety. With 250mA on VCC it can supply an MCU plus CAN/LIN bus loads without external regulators. The 5.5V-28V VBAT range plus 40V load-dump tolerance (ISO 7637) directly addresses 12V automotive power rails. AEC-Q100 qualification supports deployment in passenger vehicle BCMs.
Được đề xuất
Automotive Gateway ECU
In automotive gateway ECUs that bridge CAN-FD, CAN and LIN networks, the TLE92623BQXXUMA2 provides a compact 5V power tree plus a CAN-FD backbone transceiver. The 5 Mbps CAN-FD capability allows high-throughput diagnostics and OTA data transfer to the central network. Combined with an external MCU, the SBC's SPI window watchdog supports ASIL-B functional safety architectures. The PG-VQFN-48-79 package minimizes board area - critical in gateways that must fit under-dash or behind-display.
Được đề xuất
HVAC Control Module
HVAC control modules typically need a 5V MCU supply, a LIN interface to the climate panel, and a CAN interface to the vehicle network. The TLE92623BQXXUMA2 integrates all of these in one IC, plus a window watchdog to meet functional safety requirements for thermal regulation loops. Its -40C to +150C junction temperature range covers under-dash automotive environments including high-temperature soak on summer days. The 250mA VCC output is sufficient for MCU plus display backlight driver logic.
Được đề xuất
Lighting ECU (Headlamp / Tail Lamp Controller)
Modern headlamp and tail-lamp ECUs require CAN-FD communication, an MCU power rail, and a small form factor. The TLE92623BQXXUMA2 supplies the 5V rail for the LED controller MCU, communicates over CAN-FD with the vehicle network, and can drive a LIN interface to slave light modules. The PG-VQFN-48-79 exposed pad enables sufficient power dissipation for sustained ECU operation. AEC-Q100 qualification and ISO 7637 load-dump immunity support deployment in headlamp assemblies where ambient temperature rises significantly.
Được đề xuất
Seat Control Module
Seat control modules typically include CAN or LIN communication plus a small MCU. The TLE92623BQXXUMA2's combination of 5V LDO, LIN 2.x transceiver (for seat-position switches), and integrated window watchdog (for fail-safe actuation) fits this use case. The compact 7x7 mm VQFN-48 package fits within the limited PCB area of in-seat modules. The 250mA VCC current is sufficient for an MCU plus LIN bus loads.
Được đề xuất
Door Module / Mirror Control
Door modules that control mirrors, window lifters, and locks require a small SBC with LIN or CAN and a 5V MCU supply. The TLE92623BQXXUMA2's integrated 5V/250mA LDO powers the local MCU; the LIN 2.x transceiver communicates with the central BCM; the watchdog guards against MCU lockup. The -40C to +150C operating range covers door-mounted environments including direct summer sun heating. AEC-Q100 qualification supports deployment in body-control door zones.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho TLE92623BQXXUMA2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | TLE92623BQXV33XUMA2 | TLE92633BQXXUMA2 | TLE92623BQXV33XUMA1 | TLE9180D32QKXUMA1 |
|---|---|---|---|---|---|
| Package | PG-VQFN-48-79 | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same family |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Function | SBC - mid-range (5V LDO + CAN-FD + LIN + WDOG) | SBC - 3.3V LDO + CAN-FD + LIN + WDOG | SBC - higher-tier with partial networking | SBC - 3.3V LDO + CAN-FD + LIN + WDOG | SBC - 32-bit SPI |
| 5V/3.3V LDO Output Current | 250 mA at 5V | 250 mA at 3.3V | Higher current (500 mA class) | 250 mA at 3.3V | 250 mA class |
| CAN-FD Support | Yes (up to 5 Mbps, ISO 11898-1) | Yes (up to 5 Mbps) | Yes (with partial networking) | Yes (up to 5 Mbps) | Yes (with partial networking) |
| LIN Transceiver | LIN 2.x (up to 20 kbps) | LIN 2.x | LIN 2.x (multiple LIN channels) | LIN 2.x | LIN 2.x |
| Window Watchdog | Yes (SPI-configurable) | Yes | Yes (enhanced) | Yes | Yes |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified |
Bảo phân biệt quan trọng
- 5V/250mA integrated LDO eliminates external regulator (vsDiscrete 5V LDO (e.g., TLS810A1LDV33XUMA1) + standalone CAN transceiver)
- Integrated CAN-FD + LIN + Window Watchdog in PG-VQFN-48-79 (vsDiscrete TLE7259-3GE (LIN/CAN) + external MCU watchdog circuit)
- AEC-Q100 qualified with 40V load-dump tolerance (vsIndustrial-grade SBC (e.g., MAX17620 family))
Ghi chú thiết kế
Decouple VBAT with a 100nF ceramic capacitor placed within 5 mm of the pin. Add a bulk aluminum-polymer or tantalum capacitor (>=22uF) at the module input for load-dump handling. The 5V VCC output requires a 4.7uF to 10uF ceramic output capacitor; ESR must remain below 50 mOhm across temperature to maintain stability. Place reverse-polarity and load-dump protection per ISO 7637-2 externally.
The PG-VQFN-48-79 package uses an exposed thermal pad that must be soldered to a thermal pad on the PCB with at least 6 thermal vias (300 um pitch) to an inner copper plane. Without adequate thermal dissipation, the 5V LDO derates at high ambient temperatures; the device protects itself with thermal shutdown above ~175 C junction. Estimated: at 250mA load with VIN=12V and VCC=5V, dissipation is ~1.75W; on a 2s2p JEDEC board the pad supports this without forced air.
Route the CANH/CANL bus lines as a differential pair with 100-ohm impedance, 10 mm to 20 mm stub length maximum, and a single common-mode choke near the connector. Keep LIN away from the SPI traces. The exposed thermal pad must be continuous copper under the IC and stitched with at least 6 thermal vias to an inner plane. Refer to Infineon application note 'OPTIREG SBC PCB Layout Recommendations' for the reference layout.
Do not float the WK pin - either tie it to GND or to VBAT through a debounce network; a floating WK pin can cause unintended wake events. Ensure the SPI VIO supply matches the host MCU voltage level (3.3V or 5V); a mismatch can damage the SDI pin. Always configure the watchdog window via SPI during MCU firmware initialization - leaving the watchdog in default state can trigger unintended resets.
Thông tin tuân thủ
AEC-Q100 qualified per Infineon datasheet. RoHS and REACH compliant. Lead-free reflow (JEDEC J-STD-020).
