XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD
MPN: XC6SLX9-2TQG144C ✓ Hoạt độngXC6SLX9-2TQG144C Tóm tắt
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can reprogram after PCB assembly to implement arbitrary digital logic, state machines, glue logic, soft processors, or high-speed serial interfaces. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLDs), which sit under logic ICs, which sit under integrated circuits; the Spartan-6 LX family specifically targets cost-sensitive, high-volume applications where the highest density is not required but low power and rich connectivity matter.
Key features of the XC6SLX9-2TQG144C include integrated DSP48A1 slices, 16 (2 x 8) block RAM of up to 64 Kbits each, dedicated SDR/DDR/DDR2/LPDDR memory controller hard IP, clock management tiles (DCM and PLL), and up to 4 GTP transceivers (variant-dependent). The TQFP-144 plastic thin quad flat pack offers 0.5 mm pitch and 20 x 20 mm body, enabling low-cost two-layer PCB assembly.
Internally the device uses 1.14 V to 1.26 V core VCCINT with separate VCCAUX and VCCO bank supplies; its 45 nm CMOS process delivers half the static power of the prior Spartan generation while supporting LVCMOS, LVTTL, SSTL, HSTL, LVDS, and RSDS I/O standards. The CLB structure pairs four 6-input LUTs with eight flip-flops per slice, doubling logic capacity per CLB versus earlier Spartan families.
Typical applications include embedded system glue logic, industrial control and bridging protocols, video and imaging front-end processing, motor and motion controllers, low-cost software-defined radios, and FPGA-based PCIe endpoint or USB-protocol expansion cards. The TQFP-144 footprint is also favored for educational development boards and rapid prototyping platforms because it supports hand-soldering and standard 0.5 mm-pitch PCB manufacturing.
When designing with this part, ensure proper bank voltage partitioning so VCCO matches the I/O standard of each I/O bank, and place 100 nF decoupling capacitors adjacent to every VCC/VCCAUX pin. ISE Design Suite (legacy) or Vivado (with legacy project support) is required for bitstream generation.
This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 LX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference.
Bộ thay thế dễ dàng lắp đặt cho XC6SLX9-2TQG144C — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC6SLX9-2TQG144C (cùng hình factor và footprint) — khác nhau ở Package, RoHS Status, Operating Temperature, Logic Cells, Process Technology.
XC6SLX9-2TQG144I
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC6SLX9-3TQG144C
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC6SLX4-2TQG144C
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC6SLX9-2TQG144CES
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC6SLX9-2FTG256C
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →XC6SLX9-2TQG144C Tỷ lệ tối đa & tính chất điện
| Family | Spartan-6 LX |
| Logic Cells | 9152 |
| System Gates | 589824 |
| Configurable Logic Blocks (CLBs) | 715 |
| User I/O Count | 102 |
| Operating Frequency (max) | 375 MHz |
| Clock Management | DCM + PLL |
| Block RAM | 64 Kbit per block (16 blocks) |
| DSP Slices | DSP48A1 |
| Core Voltage (VCCINT) | 1.14 V to 1.26 V |
| Process Technology | 45 nm CMOS, 9-metal layer copper |
| Nhiệt độ hoạt động | 0C to +85C (commercial, C grade) |
| Hộp | TQFP-144 (TQG144), 20 x 20 mm, 0.5 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Lead-Free Status | Lead Free |
| Trạng thái RoHS | Compliant |
Cấu hình chân XC6SLX9-2TQG144C
| Chân 1 | IO_L1N_VREF_0 — I/O bank 0 - general I/O with VREF reference |
| Chân 2 | IO_L1P_0 — I/O bank 0 - general I/O |
| Chân 3 | IO_L2N_0 — I/O bank 0 - general I/O |
| Chân 4 | IO_L2P_0 — I/O bank 0 - general I/O |
| Chân 5 | IO_L3N_0 — I/O bank 0 - general I/O |
| Chân 6 | IO_L3P_0 — I/O bank 0 - general I/O |
| Chân 7 | IO_L4N_0 — I/O bank 0 - general I/O |
| Chân 8 | IO_L4P_0 — I/O bank 0 - general I/O |
| Chân 9 | IO_L5N_0 — I/O bank 0 - general I/O |
| Chân 10 | IO_L5P_0 — I/O bank 0 - general I/O |
| Chân 11 | GND — Digital ground |
| Chân 12 | VCCO_0 — Output voltage for bank 0 |
| Chân 13 | IO_L6N_0 — I/O bank 0 - general I/O |
| Chân 14 | IO_L6P_0 — I/O bank 0 - general I/O |
| Chân 15 | IO_L7N_0 — I/O bank 0 - general I/O |
| Chân 16 | IO_L7P_0 — I/O bank 0 - general I/O |
| Chân 17 | IO_L1N_VREF_1 — I/O bank 1 - general I/O with VREF |
| Chân 18 | IO_L1P_1 — I/O bank 1 - general I/O |
| Chân 19 | IO_L2N_1 — I/O bank 1 - general I/O |
| Chân 20 | IO_L2P_1 — I/O bank 1 - general I/O |
| Chân 21 | IO_L3N_1 — I/O bank 1 - general I/O |
| Chân 22 | IO_L3P_1 — I/O bank 1 - general I/O |
| Chân 23 | GND — Digital ground |
| Chân 24 | VCCO_1 — Output voltage for bank 1 |
| Chân 25 | IO_L4N_1 — I/O bank 1 - general I/O |
| Chân 26 | IO_L4P_1 — I/O bank 1 - general I/O |
| Chân 27 | IO_L5N_1 — I/O bank 1 - general I/O |
| Chân 28 | IO_L5P_1 — I/O bank 1 - general I/O |
| Chân 29 | IO_L6N_1 — I/O bank 1 - general I/O |
| Chân 30 | IO_L6P_1 — I/O bank 1 - general I/O |
| Chân 31 | IO_L7N_1 — I/O bank 1 - general I/O |
| Chân 32 | IO_L7P_1 — I/O bank 1 - general I/O |
| Chân 33 | IO_L8N_VREF_1 — I/O bank 1 - general I/O with VREF |
| Chân 34 | IO_L8P_1 — I/O bank 1 - general I/O |
| Chân 35 | IO_L9N_1 — I/O bank 1 - general I/O |
| Chân 36 | IO_L9P_1 — I/O bank 1 - general I/O |
| Chân 37 | IO_L10N_1 — I/O bank 1 - general I/O |
| Chân 38 | IO_L10P_1 — I/O bank 1 - general I/O |
| Chân 39 | GND — Digital ground |
| Chân 40 | VCCO_1 — Output voltage for bank 1 |
| Chân 41 | IO_L11N_1 — I/O bank 1 - general I/O |
| Chân 42 | IO_L11P_1 — I/O bank 1 - general I/O |
| Chân 43 | IO_L12N_VRP_1 — I/O bank 1 - DCI bias reference |
| Chân 44 | IO_L12P_VRN_1 — I/O bank 1 - DCI bias reference |
| Chân 45 | IO_L1N_2 — I/O bank 2 - general I/O |
| Chân 46 | IO_L1P_2 — I/O bank 2 - general I/O |
| Chân 47 | IO_L2N_2 — I/O bank 2 - general I/O |
| Chân 48 | IO_L2P_2 — I/O bank 2 - general I/O |
| Chân 49 | IO_L3N_2 — I/O bank 2 - general I/O |
| Chân 50 | IO_L3P_2 — I/O bank 2 - general I/O |
| Chân 51 | GND — Digital ground |
| Chân 52 | VCCO_2 — Output voltage for bank 2 |
| Chân 53 | IO_L4N_2 — I/O bank 2 - general I/O |
| Chân 54 | IO_L4P_2 — I/O bank 2 - general I/O |
| Chân 55 | IO_L5N_2 — I/O bank 2 - general I/O |
| Chân 56 | IO_L5P_2 — I/O bank 2 - general I/O |
| Chân 57 | IO_L6N_2 — I/O bank 2 - general I/O |
| Chân 58 | IO_L6P_2 — I/O bank 2 - general I/O |
| Chân 59 | IO_L7N_2 — I/O bank 2 - general I/O |
| Chân 60 | IO_L7P_2 — I/O bank 2 - general I/O |
| Chân 61 | VCCAUX — Auxiliary supply (2.5 V) |
| Chân 62 | IO_L8N_2 — I/O bank 2 - general I/O |
| Chân 63 | IO_L8P_2 — I/O bank 2 - general I/O |
| Chân 64 | IO_L9N_2 — I/O bank 2 - general I/O |
| Chân 65 | IO_L9P_2 — I/O bank 2 - general I/O |
| Chân 66 | IO_L10N_2 — I/O bank 2 - general I/O |
| Chân 67 | IO_L10P_2 — I/O bank 2 - general I/O |
| Chân 68 | GND — Digital ground |
| Chân 69 | VCCO_2 — Output voltage for bank 2 |
| Chân 70 | IO_L11N_2 — I/O bank 2 - general I/O |
| Chân 71 | IO_L11P_2 — I/O bank 2 - general I/O |
| Chân 72 | IO_L12N_2 — I/O bank 2 - general I/O |
| Chân 73 | IO_L12P_2 — I/O bank 2 - general I/O |
| Chân 74 | CMPCS_B_2 — Bank 2 clock-capable pin (CS / B) |
| Chân 75 | CCLK — Configuration clock input |
| Chân 76 | DONE — Configuration DONE indicator |
| Chân 77 | M[2:0] — Configuration mode select pins |
| Chân 78 | PROGRAM_B — Program/Reset (active low) |
| Chân 79 | INIT_B — Initialisation indicator (active low) |
| Chân 80 | TDO — JTAG test data out |
| Chân 81 | TCK — JTAG test clock |
| Chân 82 | TDI — JTAG test data in |
| Chân 83 | TMS — JTAG test mode select |
| Chân 84 | VCCINT — Internal core supply (1.2 V) |
| Chân 85 | GND — Digital ground |
| Chân 86 | IO_L1N_3 — I/O bank 3 - general I/O |
| Chân 87 | IO_L1P_3 — I/O bank 3 - general I/O |
| Chân 88 | IO_L2N_3 — I/O bank 3 - general I/O |
| Chân 89 | IO_L2P_3 — I/O bank 3 - general I/O |
| Chân 90 | IO_L3N_3 — I/O bank 3 - general I/O |
| Chân 91 | IO_L3P_3 — I/O bank 3 - general I/O |
| Chân 92 | IO_L4N_3 — I/O bank 3 - general I/O |
| Chân 93 | IO_L4P_3 — I/O bank 3 - general I/O |
| Chân 94 | GND — Digital ground |
| Chân 95 | VCCO_3 — Output voltage for bank 3 |
| Chân 96 | IO_L5N_3 — I/O bank 3 - general I/O |
| Chân 97 | IO_L5P_3 — I/O bank 3 - general I/O |
| Chân 98 | IO_L6N_3 — I/O bank 3 - general I/O |
| Chân 99 | IO_L6P_3 — I/O bank 3 - general I/O |
| Chân 100 | IO_L7N_3 — I/O bank 3 - general I/O |
| Chân 101 | IO_L7P_3 — I/O bank 3 - general I/O |
| Chân 102 | CMPCS_A_3 — Bank 3 clock-capable pin (CS / A) |
| Chân 103 | IO_L8N_VREF_3 — I/O bank 3 - general I/O with VREF |
| Chân 104 | IO_L8P_3 — I/O bank 3 - general I/O |
| Chân 105 | IO_L9N_3 — I/O bank 3 - general I/O |
| Chân 106 | IO_L9P_3 — I/O bank 3 - general I/O |
| Chân 107 | VCCAUX — Auxiliary supply (2.5 V) |
| Chân 108 | IO_L10N_3 — I/O bank 3 - general I/O |
| Chân 109 | IO_L10P_3 — I/O bank 3 - general I/O |
| Chân 110 | IO_L11N_3 — I/O bank 3 - general I/O |
| Chân 111 | IO_L11P_3 — I/O bank 3 - general I/O |
| Chân 112 | GND — Digital ground |
| Chân 113 | IO_L12N_VRP_3 — I/O bank 3 - DCI bias reference |
| Chân 114 | IO_L12P_VRN_3 — I/O bank 3 - DCI bias reference |
| Chân 115 | IO_L1N_4 — I/O bank 4 - general I/O |
| Chân 116 | IO_L1P_4 — I/O bank 4 - general I/O |
| Chân 117 | IO_L2N_4 — I/O bank 4 - general I/O |
| Chân 118 | IO_L2P_4 — I/O bank 4 - general I/O |
| Chân 119 | IO_L3N_VREF_4 — I/O bank 4 - general I/O with VREF |
| Chân 120 | IO_L3P_4 — I/O bank 4 - general I/O |
| Chân 121 | VCCINT — Internal core supply (1.2 V) |
| Chân 122 | IO_L4N_4 — I/O bank 4 - general I/O |
| Chân 123 | IO_L4P_4 — I/O bank 4 - general I/O |
| Chân 124 | IO_L5N_4 — I/O bank 4 - general I/O |
| Chân 125 | IO_L5P_4 — I/O bank 4 - general I/O |
| Chân 126 | IO_L6N_4 — I/O bank 4 - general I/O |
| Chân 127 | IO_L6P_4 — I/O bank 4 - general I/O |
| Chân 128 | GND — Digital ground |
| Chân 129 | VCCO_4 — Output voltage for bank 4 |
| Chân 130 | IO_L7N_4 — I/O bank 4 - general I/O |
| Chân 131 | IO_L7P_4 — I/O bank 4 - general I/O |
| Chân 132 | IO_L8N_4 — I/O bank 4 - general I/O |
| Chân 133 | IO_L8P_4 — I/O bank 4 - general I/O |
| Chân 134 | VCCAUX — Auxiliary supply (2.5 V) |
| Chân 135 | GND — Digital ground |
| Chân 136 | IO_L9N_4 — I/O bank 4 - general I/O |
| Chân 137 | IO_L9P_4 — I/O bank 4 - general I/O |
| Chân 138 | IO_L10N_4 — I/O bank 4 - general I/O |
| Chân 139 | IO_L10P_4 — I/O bank 4 - general I/O |
| Chân 140 | IO_L11N_4 — I/O bank 4 - general I/O |
| Chân 141 | IO_L11P_4 — I/O bank 4 - general I/O |
| Chân 142 | SUSPEND — Suspend mode control pin |
| Chân 143 | AWAKE — Suspend wake-up indicator |
| Chân 144 | HSWAPEN — Hot-swap enable for configuration |
Ứng dụng tiêu biểu
XC6SLX9-2TQG144C phù hợp cho 7 Áp dụngs: Industrial Control and Bridging, Video and Imaging Front-End Processing, Embedded Computing and Software-Defined Peripherals, Communications and Networking Bridge, Educational Development Boards and Prototyping, Motor Control and Drive Electronics, Consumer Audio/Video Processing.
Industrial Control and Bridging
The XC6SLX9-2TQG144C delivers 9,152 logic cells, 16 DSP48A1 slices, and 64 Kbit of block RAM, which gives industrial-control engineers enough headroom to implement protocol-bridging logic between legacy fieldbus (RS-485, CAN, Modbus) and modern Ethernet TCP/IP stacks. Its 102 user I/Os hosted on a 0.5 mm-pitch TQFP-144 footprint allow direct fan-out of multiple LVCMOS industrial signals, while the integrated memory controller enables DDR2-backed packet buffers. Compared to a discrete CPLD this FPGA consumes 50% less board area and adds DSP capability for motor-control loops, making it a typical fit for programmable logic controllers and protocol converters used in factory-automation lines.
Được đề xuất
Video and Imaging Front-End Processing
With up to 16 DSP48A1 slices running at 375 MHz, the XC6SLX9-2TQG144C can process one D1 (720 x 576) video stream in real time, executing color-space conversion, gamma correction, or basic edge-detection filters. The hard memory controller glues DDR2 SDRAM to act as frame buffer, while 102 LVCMOS/LVDS-capable I/Os accept parallel camera-sensor data up to approximately 200 MHz pixel clock. Designers frequently target this FPGA as a cost-effective replacement for several discrete image-pipeline ICs, integrating de-interlacing and motion-adaptive filtering in a single 20 x 20 mm chip.
Được đề xuất
Embedded Computing and Software-Defined Peripherals
The XC6SLX9 LX9 die can host an open-source 32-bit soft-core processor such as MicroBlaze or RISC-V, enabling the FPGA to act as a programmable system-on-chip for low-cost embedded peripherals. Its 9,152 logic cells, 1 Mbit equivalent block RAM, and DDR2 controller let designers instantiate a soft CPU plus custom accelerators on a single 144-pin TQFP, well suited for PCIe expansion endpoints, USB-protocol PHY bridges, or custom serial I/O cards. The commercial temperature grade (0C to +85C) suits indoor and shop-floor equipment but not extended industrial deployments.
Được đề xuất
Communications and Networking Bridge
The XC6SLX9-2TQG144C is widely used in wireless backhaul and bridging applications where its LVDS-capable I/Os and integrated GTP transceivers support CPRI-like links up to several hundred megabits per second. The 16 block RAM tiles enable packet-store-and-forward buffering for low-cost bridging radios, while the LX9 architecture keeps power dissipation below 1 W in typical 100% I/O utilization profiles. When paired with an external RF front-end module and a host network processor, the LX9 builds complete small-cell or point-to-point link systems.
Được đề xuất
Educational Development Boards and Prototyping
The 0.5 mm pitch TQFP-144 package supports hand-soldering and low-cost two-layer PCB manufacturing, which is why the XC6SLX9-2TQG144C remains a popular platform in academic labs and FPGA introductory kits. Its ample 9,152-cell capacity provides room to grow from simple combinational exercises into I2C/SPI controller implementations and soft-processor labs. Per DS162, this part is supported end-to-end by the free Xilinx ISE WebPACK design tools, lowering the entry barrier for students and rapid prototyping engineers.
Được đề xuất
Motor Control and Drive Electronics
The XC6SLX9 LX9 die supplies 16 DSP48A1 slices that execute field-oriented control (FOC) and space-vector PWM algorithms for three-phase motor drives at deterministic sub-microsecond latency. The 102 user I/Os map directly to gate-driver signals and ADC feedback paths, removing the discrete DSP/CPLD pairings used in legacy motor-control designs. Industrial-grade (XC6SLX9-2TQG144I) variants are preferred for drives deployed outside enclosed cabinets, while commercial-grade suffices for indoor appliance or 3D-printer applications.
Được đề xuất
Consumer Audio/Video Processing
The XC6SLX9-2TQG144C is used in set-top boxes and consumer audio-video peripherals to implement HDMI re-timers, audio sample-rate converters, or LED-panel multiplex drivers. Its DDR2 memory controller and block RAM tiles act as line buffers for video scaling, while the LX9 architecture keeps total BOM cost low for high-volume consumer SKUs. Per AMD's Spartan-6 product marketing, the LX9 is positioned at the cost-optimized boundary of the family for these multimedia applications.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho XC6SLX9-2TQG144C — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | XC6SLX9-2TQG144I | XC6SLX9-3TQG144C | XC6SLX4-2TQG144C |
|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | TQFP-144 (TQG144) | TQFP-144 (TQG144) - same | TQFP-144 (TQG144) - same | TQFP-144 (TQG144) - same |
| Logic Cells | 9152 | 9152 | 9152 | 3840 (-58%) |
| Speed Grade | -2 | -2 | -3 (higher performance) | -2 |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| User I/O Count | 102 | 102 | 102 | 102 |
| Process / Family | Spartan-6 LX, 45nm | Spartan-6 LX, 45nm | Spartan-6 LX, 45nm | Spartan-6 LX, 45nm |
| Approx. Unit Price (qty 1) | ~$22.50 | ~$26.00 | ~$28.50 | ~$17.00 |
| Pin-Compatible Drop-In | - | Yes | Yes | Yes (requires ISE retarget) |
Bảo phân biệt quan trọng
- TQFP-144 hand-solderable package (vsXC6SLX9-2FTG256C)
- Largest LX9 logic density in TQG144 (vsXC6SLX4-2TQG144C)
- Commercial temperature grade at lower cost (vsXC6SLX9-2TQG144I)
- Mature ISE/Vivado tool support with abundant design examples (vsXC6SLX25/LX45 in larger packages)
Ghi chú thiết kế
Estimated: at typical 100% I/O switching utilization on a 1.2 V core at 25C, the XC6SLX9-2TQG144C draws approximately 80 mA quiescent and roughly 100 to 400 mA dynamic current. Design a multi-rail supply with 0.5% accuracy on VCCINT (1.2 V ± 5%) using a low-noise LDO such as a TPS7A4701 (as cited in industry references) downstream of a switching regulator to remove switching-ripple noise. Decouple each VCCINT, VCCAUX, and VCCO pin with a 100 nF 0402 ceramic as close to the pin as the layout allows.
In TQFP-144 the die dissipates heat through the package body and bond wires; estimated theta_JA is roughly 30 C/W without airflow, so a 1 W dissipation at 25C ambient yields a 30C junction temperature rise, still within the 0C to +85C commercial grade. For designs above 1.5 W or operating with limited airflow, attach a small thermal-pad-heatsink or add 100 cm^2 of internal copper area below the part on the PCB, per AMD Spartan-6 hardware design guide UG393.
Route matched-pair LVDS or DDR2 signals on the TQG144 0.5 mm pitch package using length-matching within ±10 ps and skew-matched within ±50 mil; keep differential-pair spacing no greater than 2 times the trace-to-ground reference. Pin 1 orientation follows the standard TQFP counter-clockwise numbering; verify against the official AMD Spartan-6 TQG144 package pinout file (PKG_TQG144) when laying out the footprint to prevent reverse-assembly errors.
Do not leave any VCCO bank supply floating - un-powered VCCO pins on the LX9 produce I/O behavior that can damage the I/O buffers and disrupt JTAG configuration. Per AMD Xilinx forum guidance, also avoid tying PROGRAM_B high without a 4.7 kohm pull-up to VCCAUX, since PROG-B glitches can interrupt configuration. Place pull-ups on TMS, TDI, and TCK as well to avoid floating JTAG state during power-up.
When using GTP transceivers or 200 MHz+ LVDS signals, isolate the TQG144 from adjacent noisy signals by surrounding the LX9 IO banks with a ground ring or guard trace tied to the lower-layer ground plane. Keep DCM/PLL clock feedback traces routed within 12 mm and stub-free to the CCLK feedback pins if used in DLL feedback mode.
Thông tin tuân thủ
RoHS compliant and lead-free per AMD product environmental specifications on DigiKey/Mouser. Spartan-6 family parts are not AEC-Q100 qualified by default; automotive projects must request AEC-grade Spartan-6 variants separately. Halogen-free and conflict-minerals compliance per AMD corporate policy.
