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產品（38,000+)

XC7K70T-1FBG676C - Kintex-7 FPGA 65,600 Cells | AMD
XC7K70T-1FBG676C

XC7K70T-1FBG676C - Kintex-7 FPGA 65,600 Cells | AMD

The AMD XC7K70T-1FBG676C is a Kintex-7 Field Programmable Gate Array (FPGA) from the 7 series family, built on 28nm process technology. It features 65,600 logic cells, 300 user I/Os, and 4,976,640 bits of block RAM, packaged in a 676-ball lidless FCBGA (FBG676) package. This device operates at a core voltage of 1V and is supplied in tray packaging. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit within the programmable logic device (PLD) hierarchy, above CPLDs, and are used for parallel processing, high-speed interfacing, and rapid prototyping. The Kintex-7 family balances cost, performance, and power for mid-range applications. Key features include 300 user I/Os supporting various I/O standards, 4,976,640 bits of block RAM for data buffering, and 65,600 logic cells for implementing complex digital designs. The 28nm process enables high performance with reasonable power consumption. The lidless FCBGA package provides excellent thermal performance for high-density designs. Technically, the XC7K70T-1FBG676C includes MMCM (Mixed-Mode Clock Manager) and PLL (Phase-Locked Loop) blocks for clock generation and management, supporting a wide range of clock frequencies. The device supports configuration via JTAG, SPI, and BPI interfaces, allowing flexible programming options. The 1V core voltage reduces dynamic power compared to older families. Typical applications include software-defined radio, medical imaging, industrial automation, and aerospace/defense systems where high-speed signal processing and reconfigurability are required. The 300 I/Os enable interfacing with high-speed ADCs, DACs, and memory devices. When designing with this FPGA, ensure adequate decoupling capacitors on all power pins and follow AMD's power-on sequencing guidelines. The lidless package requires careful thermal management; use a heatsink or forced airflow for high utilization designs.

USD $36.59 聯絡我們
XC7K70T-2FB484I - Kintex-7 65k LC FPGA, 484-FCBGA | AMD Xilinx
XC7K70T-2FB484I

XC7K70T-2FB484I - Kintex-7 65k LC FPGA, 484-FCBGA | AMD Xilinx

The AMD Xilinx XC7K70T-2FB484I is a Kintex-7 Field-Programmable Gate Array (FPGA) housed in a 484-ball Flip-Chip Ball Grid Array (FCBGA) package with 0.97 V to 1.03 V core supply, 65,640 logic cells (LCs), 285 user I/Os, and a -2 speed grade rating with industrial temperature qualification. Built on a 28 nm HPL (high-performance, low-power) process, the Kintex-7 family targets the optimal balance of price, performance per watt, and high DSP throughput for cost-sensitive mid-range designs. An FPGA is a semiconductor device whose digital logic, interconnects, and I/O behavior are defined by the user's configuration bitstream rather than by the fab mask set. Within the broader silicon taxonomy, the XC7K70T sits in the Kintex-7 sub-family of Xilinx's 7-series programmable logic, between the lower-cost Artix-7 family and the higher-capacity Virtex-7 family. Kintex-7 specifically adds high-speed serial transceivers (GTX) and a generous DSP count that the cheaper Artix-7 lacks, while omitting the Virtex-7's ultra-high-speed GTZ transceivers. Key features include 65,640 logic cells, ~4.9 Mb of block RAM, 240 DSP48E1 slices, four integrated GTX transceivers running up to 6.6 Gb/s, a PCIe Gen2 hard block, and 285 user I/Os. The -2 speed grade delivers roughly 30% higher internal performance than the -1 grade, while the 'I' suffix indicates the industrial temperature range (-40 C to +100 C ambient operating). Integrated on-die clock management (MMCM and PLL tiles) and the XADC analog-to-digital converter block eliminate external timing and monitoring ICs. This device is well suited to wireless baseband and remote-radio-head processing, broadcast and pro-AV video over IP pipelines, high-speed serial backplane aggregation, and industrial imaging or radar pre-processing. The integrated PCIe Gen2 endpoint saves BOM cost in machine-vision and digitizer cards where host-side CPU communication matters. When designing with the XC7K70T-2FB484I, treat the FCBGA substrate as a BGA with controlled-collapse reflow requirements (no-clean flux, X-ray inspection). Decouple every GTP/GTX power rail with the values listed in UG470/UG471, and provide a known-good 1.0 V core supply that respects the inrush profile during configuration. The Kintex-7 supports Vivado design flow with the Webpack toolchain.

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XC7K70T-2FBG676I - Kintex-7 FPGA 65600 Cells | AMD
XC7K70T-2FBG676I

XC7K70T-2FBG676I - Kintex-7 FPGA 65600 Cells | AMD

The AMD XC7K70T-2FBG676I is a Kintex-7 Field Programmable Gate Array (FPGA) from the 7 series family, built on 28nm technology. It features 65,600 logic cells, 300 user I/Os, and 4,976,640 bits of block RAM, all housed in a 676-pin lidless FCBGA package. Operating at a core voltage of 1V, this FPGA delivers high performance and low power for a wide range of applications. What is an FPGA? An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. FPGAs are part of the broader category of programmable logic devices (PLDs), which also includes CPLDs. They are essential in applications requiring rapid prototyping, hardware acceleration, and flexible digital design. Key features of the XC7K70T-2FBG676I include 300 I/O pins, 5 clock management tiles (CMTs) with MMCM and PLL, and support for various I/O standards. The device also includes 240 DSP48E1 slices for high-speed digital signal processing. The lidless FCBGA package allows for improved thermal performance, making it suitable for high-density designs. Technically, the Kintex-7 family is optimized for cost-sensitive applications that require high performance. The 28nm process technology enables a balance of speed and power efficiency. The device supports configuration through JTAG, SelectMAP, and SPI interfaces, and is compatible with AMD's Vivado Design Suite for development. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-performance computing. The XC7K70T is particularly suited for designs that need moderate logic density with high I/O count and DSP capabilities. When designing with this FPGA, consider power supply decoupling and thermal management. The lidless package requires careful heatsink attachment. Use the provided pinout files from AMD for accurate PCB layout.

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XC7K70T-3FBG484E - 65.6K Kintex-7 FPGA | AMD Xilinx
XC7K70T-3FBG484E

XC7K70T-3FBG484E - 65.6K Kintex-7 FPGA | AMD Xilinx

AMD Xilinx XC7K70T-3FBG484E is a Kintex-7 field-programmable gate array with 65,600 logic cells, 285 user I/O, a -3 performance grade, and an FBG484 flip-chip BGA package. The device belongs to the Kintex-7 FPGA family, combining programmable logic, block RAM, DSP resources, programmable I/O, and high-speed connectivity in a single 484-pin package. A field-programmable gate array is a semiconductor whose digital functions are configured after manufacture through a programmable logic array. Within the FPGA hierarchy, the Kintex-7 family provides a balance of logic density, signal-processing capability, I/O availability, and performance for communications, industrial, instrumentation, aerospace, and defense systems. An FPGA can accelerate parallel algorithms, implement protocol bridges, perform real-time signal processing, and combine multiple fixed-function functions on one board. The XC7K70T-3FBG484E provides 65,600 logic cells organized as 10,250 adaptive logic modules and includes 4.75 Mbit of embedded memory. Its 285 I/O expand the connection to external memory, transceivers, clocks, data converters, and interface devices. The Kintex-7 family is manufactured on a 28 nm process and uses a 1 V core supply, supporting high-density programmable systems while maintaining a broad ecosystem of design tools, intellectual property, and development hardware. The -3 suffix identifies the device performance grade, while FBG484 identifies the 484-pin FBG package. The E suffix denotes the extended-temperature product configuration used in industrial and extended operating environments. These suffixes affect qualification, speed, temperature, and ordering rather than the basic Kintex-7 architecture. Package ball assignments, configuration requirements, power sequencing, and design constraints must be checked against the package pinout files and device documentation before a board is released. Typical applications include industrial Ethernet and network equipment, high-speed test and measurement systems, radar and signal-processing equipment, scientific instrumentation, embedded control, video infrastructure, and communications infrastructure. The 285-I/O package is particularly useful where the design requires numerous parallel digital connections in addition to high-speed serial links, while the 4.75 Mbit of embedded memory supports buffering, packet storage, and data-retention functions. The primary design consideration is package complexity. A 484-ball BGA demands careful PCB escape routing, power-plane design, decoupling, thermal planning, and assembly-process control. Use the package-specific ball map and recommended power architecture rather than inferring connectivity from another FPGA package. Verify signal integrity on every high-speed interface and preserve the specified configuration and power-supply sequencing behavior. This product analysis consolidates the device identity, package details, capacity data, source links, drop-in family alternatives, and practical design considerations into one engineering-focused reference. It is intended to help designers assess whether the XC7K70T-3FBG484E provides the required Kintex-7 resources before beginning schematic capture, PCB layout, and Vivado implementation.

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XC7K70T-3FBG676E - Kintex-7 FPGA 65600 Cells | AMD
XC7K70T-3FBG676E

XC7K70T-3FBG676E - Kintex-7 FPGA 65600 Cells | AMD

The AMD XC7K70T-3FBG676E is a Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology, operating at a nominal core voltage of 1V. It is housed in a 676-pin lidless FCBGA (Flip-Chip Ball Grid Array) package, offering 300 user I/O pins. This device provides 65,600 logic cells, 4,977,664 bits of block RAM, and is designed for a wide range of high-performance applications. What is an FPGA? A Field Programmable Gate Array is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the blocks to be wired together in different configurations. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware reconfiguration. In the system hierarchy, an FPGA sits between fixed-function ASICs and general-purpose processors, offering parallel processing capabilities and hardware-level customization. Key features of the XC7K70T-3FBG676E include 65,600 logic cells, 300 I/O pins, and 4,977,664 bits of block RAM. The -3 speed grade indicates the fastest performance tier in the Kintex-7 family, enabling higher clock frequencies and faster data processing. The lidless FCBGA package provides excellent thermal performance and is suitable for high-density PCB designs. The device supports various I/O standards including LVCMOS, LVDS, and HSTL, making it versatile for different interface requirements. Technically, the Kintex-7 family is built on AMD's (formerly Xilinx) 28nm high-performance, low-power (HPL) process, balancing performance with power efficiency. The device includes hardened memory controllers, DSP slices, and high-speed transceivers (though the specific transceiver count for this variant is [DATA_NEEDED]). The FPGA supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the device. Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-performance computing. The 300 I/O pins and 65,600 logic cells make it suitable for mid-range logic density requirements, while the -3 speed grade supports demanding timing constraints. When designing with this device, ensure proper power supply decoupling with multiple 100nF and 10uF capacitors near the FPGA power pins. The lidless FCBGA package requires careful thermal management; consider a heatsink or forced airflow for high utilization designs.

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XC7S15-1FTGB196C - Spartan-7 FPGA, 12.8K LC, 196-CSBGA | AMD
XC7S15-1FTGB196C

XC7S15-1FTGB196C - Spartan-7 FPGA, 12.8K LC, 196-CSBGA | AMD

The AMD (Xilinx) XC7S15-1FTGB196C is a Spartan-7 Field-Programmable Gate Array (FPGA) with 12,800 logic cells, 360 Kbit block RAM, and 100 user I/Os, housed in a 196-ball Chip-Scale BGA (FTGB196) package. It belongs to the cost-optimized Spartan-7 family, delivering the lowest cost per I/O and best performance-per-watt in the Xilinx 7-series for volume applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs) connected via programmable routing. FPGAs are positioned in the programmable-logic hierarchy above CPLDs and below Application-Specific Integrated Circuits (ASICs): they offer higher density and richer DSP/memory resources than CPLDs while providing faster time-to-market and lower NRE cost than ASICs. Within AMD's portfolio, Spartan-7 occupies the cost-optimized node, with Artix-7 (mid-range) and Kintex-7/Virtex-7 (high-performance) above it. Key specifications of the XC7S15-1FTGB196C include 12,800 logic cells, 360 Kbit of block RAM (18 Kb blocks), 20 DSP slices, 1.0V core voltage, and 100 user I/Os with LVCMOS, LVDS, and LVTTL support. The device is rated commercial temperature (0C to +85C junction) and uses the FTGB196 CSBGA package measuring 15x15 mm with 1.0 mm ball pitch, suited for compact, high-density PCB layouts. Architecturally, Spartan-7 uses a 28 nm low-power process, dual 12-bit XADC, hardened memory controllers, and AMD's Vivado Design Suite for synthesis, place-and-route, and bitstream generation. Compared with Spartan-6, it provides roughly 2x logic density at lower power, while remaining pin-compatible with the same CSBGA footprint for many package options. Typical applications include industrial motor control and sensor fusion, cost-sensitive IoT edge nodes, low-cost video bridging/display controllers, and serial preboot/IEC8254-style communication bridges. The combination of small form factor, low unit price, and AMD toolchain maturity makes it common in education kits and prototyping boards. Designers should note that the FTGB196 package shares footprints with other Spartan-7 densities (XC7S25, XC7S50 in the same package), enabling density scaling without PCB rework. The -1 speed grade is the slowest of three, trading Fmax for cost savings. This page synthesizes distributor pricing, drop-in alternatives within the same FTGB196 footprint, and design notes not found in the AMD datasheet, giving engineers a faster path from part selection to working hardware.

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XC7S25-1FTGB196C - Spartan-7 FPGA 25K Logic Cells | AMD Xilinx
XC7S25-1FTGB196C

XC7S25-1FTGB196C - Spartan-7 FPGA 25K Logic Cells | AMD Xilinx

The AMD Xilinx XC7S25-1FTGB196C is a Spartan-7 family Field Programmable Gate Array (FPGA) housed in a 196-ball Fine-pitch Thin Ball Grid Array (FTGB196) chip-scale BGA package. Built on a 28 nm low-power process, the device integrates 23,360 logic cells (approximately 25K), 1,658,880 bits of block RAM, and 80 DSP48 slices, balancing logic density, on-chip memory, and signal-processing throughput for cost-sensitive high-volume designs. A field programmable gate array (FPGA) is a reprogrammable semiconductor device whose logic fabric, interconnect, and I/O can be configured by the customer after PCB assembly. FPGAs sit at the parallel-programmable tier of the digital IC hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit. They are used to implement custom data paths, glue logic, hardware accelerators, and deterministic interfaces that ASICs or microcontrollers cannot address efficiently. The Spartan-7 family is positioned below Artix-7 and Kintex-7 in the AMD/Xilinx 7-series, targeting industrial, automotive, and consumer applications where Artix-7 capability is not required. Key features include up to 150 user I/O pins, 3.65K logic slices distributed across the fabric, six clock-management tiles (CMTs) with integrated PLLs, and support for common low-voltage I/O standards including LVCMOS 1.2V-3.3V and LVDS. The device operates from a 1.0 V core supply with separate HR/HP bank supplies; the -1 speed grade is the slowest of the three Spartan-7 grades, optimizing cost over frequency. Architecture-wise, Spartan-7 combines Configurable Logic Blocks (CLBs) with 6-input LUTs, dedicated 36 Kbit block RAM blocks, DSP48E1 slices supporting 25 × 18 multipliers at up to 466 MHz, and high-speed serial transceivers are not present — designers use PLLs and SelectIO for high-speed parallel I/O instead. Bitstream encryption and SHA-256 authentication protect IP. Configuration uses SPI, BPI, JTAG, or Master/Slave Serial modes. Typical applications include industrial motor control and sensor fusion, low-cost machine-vision pre-processing, embedded IoT gateways, legacy interface bridging, and cost-optimized communications line cards. The compact FTGB196 package suits handheld and space-constrained designs. Compared to larger Spartan-7 devices such as the XC7S50 and XC7S75, the XC7S25 offers the smallest logic capacity in a compatible 196-ball footprint, enabling easy upward migration. When designing with this part, ensure the FTGB196 PCB footprint provides adequate via-in-pad escape routing. Decoupling requires 0402-size 0.1 µF MLCCs placed adjacent to every VCC/VCCO bank with bulk 47 µF tantalum or polymer capacitors on each supply plane. Engineers should generate bitstreams using Vivado Design Suite 2018.3 or later with the Spartan-7 device support package installed. This page synthesizes distributor pricing, drop-in Spartan-7 alternatives, and practical design notes that are not consolidated in any single manufacturer datasheet.

USD $41.58 有庫存
XC7S50-1CSGA324C - Spartan-7 FPGA 52K Logic Cells, 324-BGA | AMD
XC7S50-1CSGA324C

XC7S50-1CSGA324C - Spartan-7 FPGA 52K Logic Cells, 324-BGA | AMD

The AMD XC7S50-1CSGA324C is a Spartan-7 family Field Programmable Gate Array (FPGA) built on a 28nm high-k metal gate (HKMG) process, delivering 52,160 logic cells, 2,764,800 bits of block RAM, and 210 user I/O pins in a 324-ball CSBGA package measuring 15x15mm. It operates from a 1.0V core voltage and is rated for commercial temperature (0C to +85C), targeting cost-sensitive, high-volume applications. A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic function is configured by the end user after manufacturing, hence "field-programmable." FPGAs consist of an array of programmable logic blocks, programmable interconnects, and configurable I/O tiles that together implement arbitrary digital logic. They sit within the programmable logic device (PLD) hierarchy, offering rapid prototyping and post-silicon flexibility that fixed-function ASICs cannot match, at the cost of higher unit price and lower maximum frequency than custom silicon. Key features of the XC7S50-1CSGA324C include 52,160 logic cells, 8 DSP slices for hardware-accelerated arithmetic, 2,764,800 bits of dual-port block RAM with built-in FIFO logic, 4 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and support for memory interfaces including DDR3. The CSBGA-324 package integrates 210 user I/Os across multiple I/O banks supporting LVCMOS, LVDS, SSTL, and HSTL standards. The Spartan-7 architecture shares the proven 28nm HKMG process node of the larger Artix-7 and Kintex-7 families, inheriting their 6-input look-up tables (LUTs), dedicated carry chains, and high-speed serial support (up to 6.6 Gb/s transceivers in higher Spartan-7 densities; this 50K-cell variant is primarily general-purpose logic with select GTP capability at higher speeds depending on configuration). The 28nm process reduces both static leakage and dynamic power compared to legacy 45nm and 65nm Spartan-6 devices. Typical applications include industrial motor control, factory automation controllers, medical imaging front-ends, video processing pipelines, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. Designers migrating from end-of-life Spartan-6 designs use the Spartan-7 as a pin-compatible upgrade path with higher logic density and lower power per LUT. When designing with this FPGA, pay close attention to the multi-rail power architecture (VCCINT, VCCAUX, VCCO, MGTAVCC) and required power-on sequencing. Refer to the Spartan-7 FPGA Data Sheet for DC and AC switching characteristics and UG475 for package pinout details. This page synthesizes distributor pricing, drop-in same-package alternatives, application guidance, and PCB-level design notes that go beyond the manufacturer datasheet, helping engineers accelerate Spartan-7 evaluation and BOM risk mitigation.

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XC7S50-1CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD Xilinx
XC7S50-1CSGA324I

XC7S50-1CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD Xilinx

The AMD Xilinx XC7S50-1CSGA324I is a Spartan-7 field-programmable gate array (FPGA) fabricated on a 28 nm low-power process, providing 52,160 logic cells and 2,764,800 system gates in a 324-ball CSBGA package. Operating from a 0.95 V to 1.05 V core supply with industrial-grade -40C to +100C support, this device integrates 210 user I/Os, embedded DSP48 slices, 36 Kb block RAM blocks, and clock-management tiles (CMTs) that combine PLLs and MMCMs for flexible clock synthesis. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and serializer/deserializer channels. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs, and below ASICs in performance-per-watt terms; they are typically chosen when time-to-market, post-production flexibility, or in-field upgradability are required. The Spartan-7 family specifically targets the lowest-power, lowest-cost end of the AMD/Xilinx 28 nm FPGA portfolio while retaining high I/O count and DSP capability. Key features include 75 DSP slices for fixed- and floating-point signal processing, 270 Kb of distributed RAM within the CLB fabric, 1.8 Mb of block RAM, four CMTs, and integrated hard IP such as a Configuration Security Unit and a built-in PCIe Gen2 capable block on larger family members. The -1 commercial speed grade and the I-grade industrial temperature suffix suit design teams needing predictable performance and broad environmental tolerance without paying for a higher speed/power bin. The architecture pairs a 6-input LUT-based logic fabric with high-speed SelectIO technology, supporting DDR3-800 memory interfaces and LVDS rates up to 800 Mb/s. Hardened IP for memory controllers, security, and SerDes reduces soft-logic overhead, allowing more of the device to be devoted to application logic. Typical applications include industrial motor control and machine vision, automotive driver-assistance subsystems, consumer video processing, and portable wireless baseband signal chains. The 324-ball CSBGA package balances high connectivity with a board footprint acceptable for medium-density designs. For design planning, treat the core supply as a split-rail design with separate 1.0 V VCCINT, 1.8 V VCCAUX, and user-bank VCCO rails, and allocate at least four decoupling values (1uF, 0.1uF, 0.01uF, 10nF) within each power-supply decoupling region. This page synthesizes AMD-verified electrical characteristics, current distributor inventory, drop-in same-package alternatives, and practical decoupling/thermal guidance not consolidated in any single distributor listing.

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XC7S50-1FGGA484C - Spartan-7 FPGA, 52K LC, 484-BGA | AMD/Xilinx
XC7S50-1FGGA484C

XC7S50-1FGGA484C - Spartan-7 FPGA, 52K LC, 484-BGA | AMD/Xilinx

The AMD/Xilinx XC7S50-1FGGA484C is a Spartan-7 Field Programmable Gate Array (FPGA) delivering 52,160 logic cells (4,075 CLBs / 8,150 slices), 2,700 Kb of block RAM, and 120 DSP48E1 slices in a 484-ball fine-pitch BGA (FGGA484, 23 x 23 mm, 1.00 mm pitch). It is the commercial-temperature, -1 speed-grade variant of the XC7S50 family and supports 250 user I/Os with internal supply voltages of 0.95 V to 1.05 V core, making it suitable for cost-sensitive, low-power, high-I/O designs. What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose logic fabric, interconnect, and I/O blocks can be reconfigured by the customer after manufacture. Within the broader semiconductor hierarchy, an FPGA sits under Programmable Logic > Logic IC > Integrated Circuit, while the Spartan-7 family targets the lowest-cost, lowest-power segment of AMD/Xilinx's 28 nm HPL (high-performance low-power) FPGAs, between the older Spartan-6 and the more capable Artix-7 lines. Key features of this device include 8,150 Configurable Logic Blocks (slices), 120 DSP48E1 slices for fixed-point arithmetic, 2.7 Mb of distributed/block RAM total, an MMCM/PLL clock-management tile set with peak operation near 464 MHz (per published digchip summary), and hard IP for memory controllers including DDR3. Built on the 28 nm HPL process, the Spartan-7 line emphasizes low static and dynamic power compared with the Artix-7 family at similar logic density. The architecture combines 6-input LUTs per slice, 32 x distributed RAM/LUTRAM per slice, dedicated 25 x 18 multipliers in each DSP48E1 slice, and high-performance SelectIO with support for LVDS, LVCMOS, SSTL, and HSTL I/O standards. Hard IP blocks for PCIe Gen1/Gen2 (in higher-density Spartan-7 parts) and 10/100/1000 Mbps Ethernet MAC are also available on selected packages. Typical applications for the XC7S50-1FGGA484C include industrial motor control and factory automation, automotive driver-assistance sub-systems (with the industrial/I-grade sibling), consumer display and video bridging, low-cost software-defined radio front-ends, and IoT edge gateways where moderate DSP, plentiful I/O, and low cost are required. Design considerations include careful SelectIO bank voltage planning (each bank has an independent VCCO reference), proper decoupling across VCCINT/VCCAUX/VCCO rails, and verifying IBIS models at the -1 speed grade corner before layout sign-off. This page synthesizes distributor pricing, drop-in same-package alternatives, comparison data, and practical design notes - offering an integrated view that complements AMD's product page and the UG475 package pinout user guide.

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XC7S50-2CSGA324C - Spartan-7 FPGA, 52K Logic Cells | AMD | BGA-324
XC7S50-2CSGA324C

XC7S50-2CSGA324C - Spartan-7 FPGA, 52K Logic Cells | AMD | BGA-324

The AMD (formerly Xilinx) XC7S50-2CSGA324C is a Spartan-7 family Field Programmable Gate Array (FPGA) offering 52,160 logic cells, 2,764,800 system gates equivalent, and 210 user I/Os, housed in a 324-ball Chip-Scale Package BGA (CSGA324) with 4,075 Configurable Logic Blocks (CLBs). FPGAs (Field Programmable Gate Arrays) are a class of programmable logic devices (PLDs) that allow designers to configure digital logic after manufacture using a hardware description language (HDL) and a toolchain. In the broader integrated circuit taxonomy, FPGAs sit within the semiconductor > programmable logic > PLD hierarchy and are widely used for parallel processing, custom I/O protocols, hardware prototyping, and glue logic. The Spartan-7 family is positioned by AMD for cost-sensitive, low-to-mid-density applications with an emphasis on low static and dynamic power versus older Spartan-6 parts. Key features of the XC7S50-2CSGA324C include 2.76 M equivalent system gates, 4,075 CLBs, 2,160 Kbits of block RAM, 60 DSP48 slices (for fixed/floating-point arithmetic), a -2 speed grade, and 4.6 Mbits of distributed RAM. Integrated peripherals include a 10/100/1000 Mb/s tri-speed Ethernet MAC, a USB 2.0 HS/FS/OTG controller, up to 1.2 Gb/s LVDS transceivers (SelectIO-based), and a hardened memory controller block. The 324-ball CSGA package provides a small footprint (~15x15 mm) suitable for space-constrained industrial designs while exposing 210 user I/Os. Architecturally, the Spartan-7 device is built on a 28 nm HPL (HPL = High Performance Low power) process node, leveraging hardened IP cores (PCIE Gen2, GbE MAC, memory controller) to deliver DSP capability while keeping power below 1 W in typical configurations. The LUT-based fabric runs on a separate analog supply (VCCAUX/VCCINT) with dedicated high-range and low-range I/O banks (HR/HP) supporting voltage standards from 1.2 V to 3.3 V. Typical applications include industrial motor control and factory automation, machine vision camera interfaces, low-cost PCIe endpoint cards, embedded vision, custom serial protocol bridging (UART/SPI/I2C to LVDS), and educational FPGA boards such as the Urbana Spartan-7 platform. For thermal management, ensure the PCB layout provides adequate copper pour on VCCINT/VCCAUX planes to dissipate the 0.5-1.0 W typical core power. SelectIO banks should each be properly decoupled with 0.1 uF + 10 uF capacitors placed close to the supply balls. This page synthesizes authorized distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, helping engineers select and source the XC7S50-2CSGA324C with confidence.

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XC7S50-2CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD
XC7S50-2CSGA324I

XC7S50-2CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD

The AMD/Xilinx XC7S50-2CSGA324I is a Spartan-7 field-programmable gate array (FPGA) IC integrating 52,160 logic cells, 120 DSP slices, and 75 of 36 Kb block RAM blocks in a 324-ball CSGA (chip-scale BGA) package. It exposes 210 high-range (HR) user I/Os, operates across the industrial temperature range of -40C to +100C, and is rated at speed grade -2. The CSGA324 package measures 15 x 15 mm with a 0.8 mm ball pitch, making the XC7S50-2CSGA324I a compact mid-density logic platform for cost-sensitive programmable designs. What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) surrounded by programmable routing and I/O cells. Unlike an ASIC, an FPGA can be reconfigured in the field via an HDL bitstream, which dramatically reduces non-recurring engineering cost for low- and mid-volume designs. The Spartan-7 family sits in AMD's low-power, low-cost segment below Artix-7, built on a 28 nm process node that lowers static and dynamic power versus the prior Spartan-6 generation while retaining a familiar 7-series tool flow (Vivado, IP catalog, AXI infrastructure). Key features include 52,160 logic cells, 75 36 Kb block RAMs, 120 DSP48 slices, six clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and integrated hard IP such as GTP serial transceivers on selected devices. The -2 speed grade improves Fmax versus the raw Geisinger -1, enabling tighter timing margins in pipelined DSP and video pipelines. On-chip security and bitstream encryption via AES-256, along with built-in configuration interfaces (SPI, BPI, JTAG, SelectMAP), accelerate system bring-up. Typical applications include industrial motor control and machine vision, automotive driver-assistance subsystems, low-cost video bridging, embedded vision edge nodes, and portable test and measurement. The 52K-cell capacity comfortably fits image-processing pipelines, real-time control loops, and mid-bandwidth protocol bridges. When designing with this board, validate signal integrity on the CSGA324 BGA escape with manufacturer pinout files (UG475), respect the 0.8 mm pitch BGA manufacturing rules, and verify configuration mode and bank voltage against UG470. Plan thermal dissipation against theta_JA from the package data sheet for industrial enclosures.

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XC7V2000T-1FLG1925CES9937 - Virtex-7 FPGA 1200 I/O | AMD
XC7V2000T-1FLG1925CES9937

XC7V2000T-1FLG1925CES9937 - Virtex-7 FPGA 1200 I/O | AMD

The AMD XC7V2000T-1FLG1925CES9937 is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 T family, designed for demanding applications requiring massive logic density and high-speed serial transceivers. It features 1,954,560 logic elements, 47,628,288 total RAM bits, and 1200 programmable I/O pins, all housed in a 1925-FCBGA (45x45 mm) package. The device operates with a core supply voltage of 0.97V to 1.03V, supporting high-speed designs with low power consumption. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs are part of the programmable logic device (PLD) family, which also includes CPLDs. They consist of an array of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing for highly parallel processing and custom hardware acceleration. FPGAs are widely used in applications such as telecommunications, data centers, aerospace, and defense, where flexibility and performance are critical. Key features of the XC7V2000T-1FLG1925CES9937 include 1,954,560 logic cells, 47,628,288 bits of block RAM, and 1200 user I/Os. It also integrates high-speed transceivers, DSP slices, and clock management tiles, making it suitable for high-bandwidth data processing and communication systems. The -1 speed grade indicates a balance between performance and power, while the 'CES9937' suffix denotes a specific configuration or ordering code. Technically, the Virtex-7 T series is built on a 28nm process technology, offering a significant leap in performance and power efficiency over previous generations. The device supports various I/O standards, including LVCMOS, LVDS, and HSTL, and includes hardened IP blocks for PCIe, Ethernet, and DDR3/DDR4 memory interfaces. This integration reduces system cost and design complexity. Typical applications include high-performance computing, wired and wireless communications, broadcast, and military/aerospace systems. The XC7V2000T is particularly suited for applications requiring high throughput and low latency, such as network processing, radar, and image processing. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails, and proper sequencing is essential. Additionally, the 1925-FCBGA package demands a well-designed PCB with adequate thermal vias and a robust power distribution network.

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XC7VH580T-2FLG1155C - Virtex-7 HT FPGA 580K Logic Cells | AMD
XC7VH580T-2FLG1155C

XC7VH580T-2FLG1155C - Virtex-7 HT FPGA 580K Logic Cells | AMD

The AMD XC7VH580T-2FLG1155C is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 HT family, designed for high-bandwidth and high-density applications. It features 580,480 logic cells, 34,652,160 block RAM bits, and 400 user I/O pins, all in a 1155-FCBGA (35x35 mm) package. Operating at a core voltage of 1V, this FPGA is built on 28nm technology, offering a balance of performance and power efficiency. An FPGA is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. It consists of programmable logic blocks, configurable interconnects, and I/O blocks, allowing for custom digital logic implementation. FPGAs are used in a wide range of applications, from prototyping ASICs to implementing complex digital systems in networking, aerospace, and defense. The Virtex-7 HT family specifically targets high-throughput applications with integrated serial transceivers and high-speed interfaces. Key features of the XC7VH580T-2FLG1155C include 400 user I/O pins, supporting various I/O standards, and a high-density logic fabric with 580,480 logic cells. The device operates within a junction temperature range of 0°C to 85°C, making it suitable for commercial environments. The 1155-FCBGA package provides excellent thermal and electrical performance, with a 35x35 mm footprint for surface mounting. Technically, the Virtex-7 HT series leverages AMD's advanced 28nm high-k metal gate (HKMG) process technology, enabling high logic density and low power consumption. The device includes dedicated DSP slices, block RAM, and high-speed transceivers, though the exact counts are not specified in the available data. The architecture supports partial reconfiguration and advanced clock management, making it a versatile choice for complex designs. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and broadcast infrastructure. The high I/O count and logic density make it ideal for implementing complex algorithms, protocol processing, and data aggregation. The 400 I/O pins allow for extensive connectivity to external memory, processors, and other peripherals. When designing with this FPGA, consider the power supply requirements: the core voltage is 1V, and the I/O voltage can vary depending on the bank configuration. Proper decoupling and power sequencing are essential for reliable operation. Additionally, the 1155-FCBGA package requires careful PCB layout to manage signal integrity and thermal dissipation.

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XC7VH870T-1FLG1155C - Virtex-7 HT FPGA | AMD | 1155-Ball
XC7VH870T-1FLG1155C

XC7VH870T-1FLG1155C - Virtex-7 HT FPGA | AMD | 1155-Ball

The AMD XC7VH870T-1FLG1155C is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 HT family, designed for high-bandwidth and high-density applications. It is housed in a 1155-ball Flip-Chip Land Grid Array (FLG1155) package and operates within a commercial temperature range of 0°C to 85°C. This device is part of the 7 series FPGA portfolio, which is built on a 28nm high-k metal gate (HKMG) process technology, balancing performance, power, and cost. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs are a type of programmable logic device, which falls under the broader category of semiconductor devices. They are distinct from fixed-function ASICs because their logic blocks and interconnects can be reprogrammed, allowing for rapid prototyping and field upgrades. The Virtex-7 HT family specifically targets high-speed serial connectivity and high-bandwidth applications, integrating up to 32 high-speed transceivers. Key features of the XC7VH870T-1FLG1155C include a large logic density with 580,480 logic cells, 34,652,160 bits of block RAM, and 400 user I/O pins. The device supports a maximum combinatorial CLB delay of 0.740 ns, enabling high-speed logic operations. It also includes 32 GTZ transceivers capable of data rates up to 28.05 Gb/s, making it suitable for 100G and 400G optical networking applications. The -1 speed grade indicates a balanced performance level, while the C suffix denotes the commercial temperature range. From a technical depth perspective, the Virtex-7 HT FPGA architecture includes configurable logic blocks (CLBs), block RAM, DSP slices, and high-speed transceivers. The device is supported by AMD's Vivado Design Suite, which provides a comprehensive environment for synthesis, implementation, and verification. The FLG1155 package offers a high pin count for routing flexibility, and the flip-chip construction improves thermal and electrical performance. Typical applications for the XC7VH870T-1FLG1155C include high-end networking equipment, data center switches, and test and measurement instruments. Its high transceiver count and logic density make it ideal for implementing complex protocols like 100GbE and OTN. The device is also used in aerospace and defense systems requiring high-bandwidth signal processing. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate cooling is essential to maintain junction temperature within the specified range, especially when operating at high utilization and transceiver speeds.

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XC7VH870T-2FLG1155I - Virtex-7 HT FPGA | AMD
XC7VH870T-2FLG1155I

XC7VH870T-2FLG1155I - Virtex-7 HT FPGA | AMD

The AMD XC7VH870T-2FLG1155I is a high-performance Field Programmable Gate Array (FPGA) from the Virtex-7 HT family, designed for high-bandwidth, high-density applications. It is housed in a 1155-ball Flip-Chip BGA (FLG1155) package and operates over the industrial temperature range of -40°C to +100°C. This device integrates 876,160 logic cells, 51,982,080 block RAM bits, and 300 user I/O pins, making it suitable for complex digital designs. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the broader category of programmable logic devices, which sit between application-specific integrated circuits (ASICs) and general-purpose processors. They offer a balance of flexibility and performance, allowing engineers to implement custom digital logic without the high NRE costs of ASIC development. The Virtex-7 HT family is specifically optimized for high-throughput serial transceiver applications, such as 100G/400G networking and data center interconnect. Key features of the XC7VH870T-2FLG1155I include 876,160 logic cells, 51,982,080 block RAM bits, and 300 user I/O pins. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and board-to-board communication. The -2 speed grade indicates a balanced performance level, suitable for a variety of high-speed designs. The industrial temperature grade ensures reliable operation in harsh environments. From an architectural perspective, the Virtex-7 HT family leverages AMD's advanced 28nm process technology, delivering high logic density and low power consumption. The device includes dedicated DSP slices, block RAM, and clock management tiles, enabling efficient implementation of complex algorithms. The high-speed transceivers support data rates up to 28.05 Gbps, making the device ideal for backplane and optical module applications. Typical applications include 100G/400G optical transport, high-performance computing, radar and signal processing, and aerospace and defense systems. The device's high logic density and transceiver count make it well-suited for these demanding workloads. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails, and proper sequencing is essential. The FLG1155 package has a large thermal pad that should be connected to a solid ground plane for optimal heat dissipation.

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XC7VH870T-2FLG1932I - Virtex-7 HT FPGA, 876K Logic Cells | AMD
XC7VH870T-2FLG1932I

XC7VH870T-2FLG1932I - Virtex-7 HT FPGA, 876K Logic Cells | AMD

The AMD Xilinx XC7VH870T-2FLG1932I is a high-performance Virtex-7 HT Field Programmable Gate Array (FPGA) engineered for demanding, high-bandwidth applications. It delivers 876,160 logic cells, 68,450 configurable logic blocks (CLBs), and 51,978,240 total RAM bits, all housed in a 1932-ball FCBGA (45x45 mm) package. This industrial-temperature-grade device operates from a 0.97V to 1.03V core supply and provides 300 programmable I/O pins. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementation. FPGAs sit within the broader hierarchy of programmable logic devices, which are a subset of integrated circuits. They offer a unique balance of performance and flexibility, enabling rapid prototyping and hardware acceleration without the high non-recurring engineering costs of ASICs. The Virtex-7 HT family specifically targets high-throughput serial connectivity and signal processing. Key features of the XC7VH870T-2FLG1932I include its massive logic density, which supports complex algorithms and large-scale parallel processing. The 51.98 Mb of block RAM provides substantial on-chip data storage, reducing the need for external memory in many designs. The 300 user I/Os, combined with high-speed transceivers, enable high-bandwidth data movement. The -2 speed grade offers a balanced performance-power trade-off, while the industrial temperature range (-40C to +100C) ensures reliable operation in harsh environments. Technically, this device is built on AMD's advanced 28nm process technology, which contributes to its high logic density and power efficiency. The architecture includes dedicated DSP slices for high-speed arithmetic operations, and flexible clock management tiles for precise timing. The 1932-ball FCBGA package provides excellent thermal and electrical characteristics, supporting the high pin count and signal integrity required for complex system integration. Typical applications include high-performance computing, wired and wireless communications infrastructure, aerospace and defense systems, and advanced medical imaging. Its high transceiver count and logic capacity make it ideal for implementing massive MIMO base stations, high-end network switches, and radar signal processing. The industrial temperature grade also suits it for ruggedized computing platforms. When designing with this device, careful attention must be paid to power delivery and decoupling. The 0.97V to 1.03V core supply requires a robust power distribution network with multiple decoupling capacitors to maintain signal integrity and prevent voltage droop under high switching activity.

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XC7VX1140T-2FLG1928C - 1.14M Logic Cells Virtex-7 XT FPGA | AMD
XC7VX1140T-2FLG1928C

XC7VX1140T-2FLG1928C - 1.14M Logic Cells Virtex-7 XT FPGA | AMD

The AMD (Xilinx) XC7VX1140T-2FLG1928C is a high-end Virtex-7 XT family Field-Programmable Gate Array (FPGA) delivering 1,139,200 logic cells, 69,304,320 bits of block RAM, and 480 user I/O in a 1928-ball Flip-Chip BGA (FLG1928C) package. Built on a 28 nm HKMG HPL process at the -2 speed grade with commercial temperature screening, the device provides up to 1.4 Tb/s of I/O bandwidth and up to 4.7 TMACs/s of DSP performance, targeting bandwidth-hungry wired communications, signal intelligence, and high-performance computing systems. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that lets designers configure its logic fabric and routing after fabrication, sitting at the top of the programmable logic taxonomy: programmable logic device -> CPLD -> FPGA -> high-end FPGA with embedded transceivers and DSP blocks. Virtex-7 T and XT devices extend the 7 series with multi-gigabit transceivers (MGTs) and high-speed parallel I/O for line-rate processing in wired telecom, defense, and test-and-measurement systems where ASIC lead times and NRE costs are prohibitive. Key features of the XC7VX1140T-2FLG1928C include up to 36 GTX 13.1 Gb/s transceivers (family-level), up to 1,980 DSP48 slices, six PCIe Gen3 integrated blocks, advanced 28 Gb/s backplane support via the GTH/GTX mix, and hardened memory controllers. Programmable logic capacity of 1,139,200 cells and 89,000 CLBs makes it suitable for the largest signal-processing pipelines. The -2 commercial speed grade balances timing closure margin and throughput against quiescent power. Architecturally, the device uses stacked silicon interconnect (SSI) technology in higher-density Virtex-7 devices, combining multiple super-logic regions (SLRs) on a passive interposer. This delivers higher usable logic density per die without the yield penalty of a monolithic 28 nm die. Hardened IP blocks offload PCIe, memory controller, and high-speed serial functions from the fabric, freeing DSP slices for application compute. Typical applications include high-performance digital signal processing for radar and electronic warfare, 400G optical transport platforms, ASIC prototyping and emulation, high-frequency trading hardware, and medical imaging accelerators. The 480 user I/O in a 1928-ball FCBGA support dense parallel interfaces to external DDR4 memory and high-pin-count converters. When designing with this part, allocate PCB layers and via-in-pad escape routing for the FCBGA, then validate signal integrity on MGT channels with IBIS-AMI models before committing to layout. Designers should consult the AMD Virtex-7 T and XT datasheet and UG473 for configuration and pinout guidance. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not all available in any single manufacturer document.

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XC7VX330T-1FFG1157C - Virtex-7 XT FPGA 326K Logic Cells | AMD
XC7VX330T-1FFG1157C

XC7VX330T-1FFG1157C - Virtex-7 XT FPGA 326K Logic Cells | AMD

The AMD XC7VX330T-1FFG1157C is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 326,400 logic cells, 600 user I/Os, and 27,648 Kb of block RAM, packaged in a 1156-pin FCBGA (FFG1157) with a 1V core voltage. This device is designed for high-bandwidth, high-capacity applications requiring substantial logic density and serial transceiver capability. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that allow the hardware to be reprogrammed to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits used extensively in prototyping, signal processing, and high-speed networking. Key features of the XC7VX330T-1FFG1157C include 600 user I/Os, 27,648 Kb of block RAM, and support for multiple high-speed serial transceivers. The device operates from a 1V core supply and is available in a 1156-pin FCBGA package, offering excellent thermal and electrical performance for dense PCB designs. The Virtex-7 XT family is optimized for high-end applications requiring maximum logic capacity and I/O bandwidth. Technically, the Virtex-7 XT architecture integrates advanced clock management tiles (CMTs) with MMCM and PLL, high-speed serial transceivers, and hardened memory controllers. The 28nm HPL (High-Performance, Low-Power) process enables high logic density with manageable power dissipation. The device supports configuration via JTAG, SelectMAP, and SPI flash, providing flexible design integration. Typical applications include wired communications (100G/400G line cards), data center acceleration, aerospace and defense signal processing, and high-performance computing. The 600 I/Os and large block RAM make it suitable for wide parallel data paths and deep buffering. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The 1V core rail requires a robust power delivery network with multiple decoupling capacitors, and the FCBGA package needs adequate thermal vias and airflow for high-utilization designs.

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XC7VX330T-2FF1157I - Virtex-7 XT FPGA 600 I/O | AMD
XC7VX330T-2FF1157I

XC7VX330T-2FF1157I - Virtex-7 XT FPGA 600 I/O | AMD

The AMD XC7VX330T-2FF1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) with 326,400 logic cells and 600 user I/O pins, packaged in a 1156-ball FCBGA (FF1157) package. It operates with a core voltage of 1.0V and is designed for industrial temperature ranges (-40°C to +100°C). This device is part of the Virtex-7 family, which is built on the 28nm process technology and offers a balance of high logic density, DSP slices, and block RAM for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits between fixed-function ASICs and general-purpose processors. They contain a matrix of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks, allowing for highly parallel, custom hardware implementations. The Virtex-7 XT series is optimized for high-bandwidth, high-capacity applications such as data center acceleration, wired communications, and advanced signal processing. Key features of the XC7VX330T-2FF1157I include 326,400 logic cells, 600 user I/O pins, and 27,648 Kb (27.648 Mb) of block RAM. It also integrates 1,120 DSP slices for high-speed digital signal processing. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and features high-speed serial transceivers for chip-to-chip and backplane communication. The -2 speed grade indicates a balanced performance level, suitable for a wide range of applications. From a technical architecture perspective, the Virtex-7 XT family uses a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power consumption. The device includes hardened memory controllers, PCIe blocks, and high-speed transceivers, reducing the need for external components and simplifying system design. The FF1157 package provides a large number of I/O pins, making it suitable for high-pin-count applications. Typical applications for the XC7VX330T-2FF1157I include wired communications (e.g., 100G/400G switches), data center acceleration, radar and electronic warfare systems, and high-performance computing. Its high logic capacity and I/O count make it ideal for complex digital designs that require significant parallel processing. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Refer to the AMD Virtex-7 FPGA data sheet and power estimation tools for detailed guidance.

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XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD
XC7VX330T-2FFG1157I

XC7VX330T-2FFG1157I - Virtex-7 XT FPGA 326K Cells | AMD

The AMD XC7VX330T-2FFG1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) with 326,400 logic cells, 600 user I/O pins, and 27,648 Kb of block RAM, packaged in a 1156-ball FCBGA (FFG1157) with a 1.0V core voltage. It is built on the 28nm HPL (High-Performance, Low-Power) process technology, offering a balance of high logic density and power efficiency for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between application-specific integrated circuits (ASICs) and general-purpose processors in the semiconductor hierarchy. Unlike ASICs, FPGAs can be reprogrammed in the field, enabling rapid prototyping, hardware acceleration, and flexible system updates. The Virtex-7 XT family is AMD's high-end FPGA series, optimized for high-bandwidth, high-throughput applications. Key features of the XC7VX330T-2FFG1157I include 326,400 logic cells, 600 user I/O pins, 27,648 Kb of block RAM, and support for up to 16 high-speed transceivers (GTX) operating at up to 12.5 Gbps. The device also includes 1,920 DSP48E1 slices for high-performance digital signal processing, and supports PCIe Gen2 x8, 10/40/100Gb Ethernet, and DDR3/DDR4 memory interfaces. The -2 speed grade provides a balance between performance and power consumption. Architecturally, the Virtex-7 XT FPGA uses a 6-input look-up table (LUT) fabric with integrated block RAM, DSP slices, and clock management tiles (CMT). The device supports partial reconfiguration, allowing dynamic updates to specific regions of the FPGA without stopping the entire system. The 28nm HPL process reduces static power consumption while maintaining high performance, making it suitable for power-sensitive applications. Typical applications include high-performance computing (HPC) acceleration, wired and wireless communications infrastructure, aerospace and defense systems, and medical imaging equipment. The 600 user I/O pins and high-speed transceivers enable high-bandwidth data acquisition and processing. The device is also used in radar, electronic warfare, and secure communications systems where reliability and long-term supply are critical. When designing with this FPGA, careful attention must be paid to power supply decoupling, thermal management, and signal integrity. The 1156-ball FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Adequate cooling is essential, as the device can dissipate significant power under heavy utilization. Use AMD's Vivado Design Suite for configuration and implementation.

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XC7VX330T-3FFG1157E - Virtex-7 XT FPGA 326K Logic Cells | AMD
XC7VX330T-3FFG1157E

XC7VX330T-3FFG1157E - Virtex-7 XT FPGA 326K Logic Cells | AMD

The AMD XC7VX330T-3FFG1157E is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm HPL (High-Performance, Low-Power) process. It delivers 326,400 logic cells, 25,500 Configurable Logic Blocks (CLBs), and 27,648,000 bits of block RAM, making it a robust choice for compute-intensive applications. The device is offered in a 1156-ball FCBGA package (35x35 mm) with 600 user I/O pins, supporting a wide range of high-speed interfaces. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the implementation of arbitrary digital logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which themselves are a subset of integrated circuits. This flexibility makes FPGAs ideal for prototyping, rapid iteration, and applications requiring custom hardware acceleration. Key features of the XC7VX330T-3FFG1157E include 600 user I/O pins, 326,400 logic cells, and 27,648,000 bits of block RAM. The device operates over a temperature range of 0°C to 100°C and supports a core voltage of 1V. The -3 speed grade indicates the highest performance tier for this family, enabling faster clock rates and improved timing closure. The FCBGA package provides excellent thermal and electrical performance, with a 35x35 mm footprint suitable for high-density PCB designs. From an architectural standpoint, the Virtex-7 XT family integrates advanced DSP slices, high-speed transceivers, and hardened memory controllers. The 28nm HPL process balances performance with power efficiency, making it suitable for both high-throughput and power-sensitive applications. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system. Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The 600 I/O pins and high logic density make it ideal for complex digital signal processing, protocol bridging, and custom compute acceleration. The device is also well-suited for prototyping ASIC designs, where its reconfigurability allows for rapid design validation. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The high logic density and speed grade can lead to significant power dissipation, requiring adequate heatsinking and airflow. Additionally, the 1V core voltage demands a clean, well-regulated power supply to ensure reliable operation.

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XC7VX415T-1FFG1158I - 412K Logic Virtex-7 XT FPGA | AMD
XC7VX415T-1FFG1158I

XC7VX415T-1FFG1158I - 412K Logic Virtex-7 XT FPGA | AMD

The AMD XC7VX415T-1FFG1158I is a high-performance Virtex-7 XT field programmable gate array (FPGA) with 412,160 logic cells, 350 user I/O, and 32,440,320 total block RAM bits. It is supplied in a 1156-ball FCBGA package (FFG1158) and fabricated in 28nm technology. The device operates from a 1.0V core supply with a recommended range of 0.97V to 1.03V, and supports a maximum clock frequency of 1818 MHz. An FPGA is a semiconductor device containing programmable logic fabric, configurable I/O, and hardened blocks that can be reconfigured in the field to implement arbitrary digital circuits. FPGAs sit between fixed-function ASICs and general-purpose processors in the digital system hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. This reconfigurability makes Virtex-7 FPGAs the preferred implementation vehicle for advanced networking, aerospace, defense, and data center workloads where algorithm changes must be deployed without silicon respins. Key features of the XC7VX415T-1FFG1158I include 350 high-speed user I/O, 32.44 Mbit of on-chip block RAM, and 28nm high-performance low-power process technology. The industrial grade (I suffix) supports extended temperature environments, while the -1 speed grade provides a balanced operating point for high-throughput logic and memory interfaces. The 1156-ball flip-chip BGA package supports dense PCB integration and large pin count for high-bandwidth interconnects. Architecturally, the Virtex-7 XT family integrates high-bandwidth transceivers, dedicated DSP slices, clock management tiles, and hardened memory controllers. For this specific ordering code, verified parametric data confirms 412,160 logic cells, 350 I/O, and 32,440,320 block RAM bits; additional slice and transceiver counts are not available in the retrieved distributor snippets. Designers should consult the full Virtex-7 data sheet (DS183) and package pinout files (UG865) for complete resource and pin-by-pin information. Typical applications include high-end networking and packet processing, radar and signals intelligence, high-performance computing, broadcast video processing, medical imaging, and automated test equipment. The high I/O count and large block RAM support wide parallel datapaths and deep buffering in the same device, while the 28nm process and 1.0V core reduce power versus earlier 40nm FPGAs. When designing with the XC7VX415T-1FFG1158I, pay special attention to core supply decoupling and BGA thermal management. Use the AMD Vivado tool suite for pin planning and verify all pin assignments against the official package pinout file before layout.

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XC7VX415T-2FF1157I - Virtex-7 XT FPGA 412K Logic Cells | AMD
XC7VX415T-2FF1157I

XC7VX415T-2FF1157I - Virtex-7 XT FPGA 412K Logic Cells | AMD

The AMD XC7VX415T-2FF1157I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It delivers 412,160 logic cells, 32,440,320 total RAM bits, and 600 configurable I/O pins in a 1156-ball FCBGA (FF1157) package. This device is engineered for complex digital designs requiring high throughput, low latency, and advanced parallel processing. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of integrated circuits. Unlike fixed-function ASICs, FPGAs offer reconfigurability, enabling rapid prototyping, hardware acceleration, and in-field updates. The Virtex-7 XT family is optimized for high-bandwidth applications such as data center acceleration, wired communications, and advanced signal processing. Key features of the XC7VX415T-2FF1157I include 32,200 CLBs (configurable logic blocks), 600 user I/O pins, and 32,440,320 bits of block RAM. The device also integrates DSP slices for high-speed arithmetic operations, making it suitable for digital signal processing (DSP) tasks. The -2 speed grade indicates a balanced performance level, while the I suffix denotes an industrial temperature range (-40°C to +100°C). The FF1157 package provides a 1156-ball FCBGA footprint with a 35mm x 35mm body size. Architecturally, the Virtex-7 XT family leverages AMD's advanced 28nm HPL (high-performance, low-power) process, balancing performance with power efficiency. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and high-speed transceivers, enabling flexible system integration. The embedded block RAM and DSP48E1 slices allow efficient implementation of complex algorithms, from FFTs to FIR filters, without external components. Typical applications include wired communications (e.g., 100G/400G line cards), data center acceleration (e.g., smart NICs, storage controllers), and high-performance computing (HPC) for scientific simulations. The industrial temperature grade makes it suitable for rugged environments such as aerospace, defense, and industrial automation. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network (PDN) to ensure reliable operation at high clock frequencies. Use the AMD Vivado Design Suite for configuration and implementation.

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