XC7S50-2CSGA324I - Spartan-7 FPGA, 52K Logic Cells | AMD
MPN： XC7S50-2CSGA324I ✓ 啟用中XC7S50-2CSGA324I 概覽
What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) surrounded by programmable routing and I/O cells. Unlike an ASIC, an FPGA can be reconfigured in the field via an HDL bitstream, which dramatically reduces non-recurring engineering cost for low- and mid-volume designs. The Spartan-7 family sits in AMD's low-power, low-cost segment below Artix-7, built on a 28 nm process node that lowers static and dynamic power versus the prior Spartan-6 generation while retaining a familiar 7-series tool flow (Vivado, IP catalog, AXI infrastructure).
Key features include 52,160 logic cells, 75 36 Kb block RAMs, 120 DSP48 slices, six clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and PLLs, and integrated hard IP such as GTP serial transceivers on selected devices. The -2 speed grade improves Fmax versus the raw Geisinger -1, enabling tighter timing margins in pipelined DSP and video pipelines. On-chip security and bitstream encryption via AES-256, along with built-in configuration interfaces (SPI, BPI, JTAG, SelectMAP), accelerate system bring-up.
Typical applications include industrial motor control and machine vision, automotive driver-assistance subsystems, low-cost video bridging, embedded vision edge nodes, and portable test and measurement. The 52K-cell capacity comfortably fits image-processing pipelines, real-time control loops, and mid-bandwidth protocol bridges.
When designing with this board, validate signal integrity on the CSGA324 BGA escape with manufacturer pinout files (UG475), respect the 0.8 mm pitch BGA manufacturing rules, and verify configuration mode and bank voltage against UG470. Plan thermal dissipation against theta_JA from the package data sheet for industrial enclosures.
直接替換替代品，適用於 XC7S50-2CSGA324I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7S50-2CSGA324I （相同外形與佔位） — 差異在於 DSP Slices, Package, Speed Grade, Block RAM, Configuration Memory.
XC7S50-1CSGA324I
✅ 直接替換聯絡詢價
查看資料表 →XC7S50-2CSGA324C
✅ 直接替換聯絡詢價
查看資料表 →XC7S50-2CSG324I
✅ 直接替換📋 參考替代品（不在目錄中）
XC7S50-2CSGA324Q
✅ 直接替換📋 參考替代品（不在目錄中）
XC7S50-2CSGA324I 最大額定值與電氣特性
| Series | Spartan-7 |
| Manufacturer | AMD (formerly Xilinx) |
| Logic Cells | 52,160 |
| Block RAM (36 Kb blocks) | 75 |
| DSP Slices | 120 |
| User I/O Count | 210 |
| 封裝 | 324-LFBGA / CSGA324 (15 x 15 mm, 0.8 mm pitch) |
| 安裝類型 | Surface Mount (BGA) |
| Speed Grade | -2 |
| 工作溫度 | -40C to +100C (Industrial, I) |
| Process Node | 28 nm |
| Configuration Memory | SRAM-based, AES-256 bitstream encryption |
| Clock Management Tiles (CMTs) | 6 |
| Configuration Interfaces | SPI, BPI, JTAG, SelectMAP |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 |
| Part Status | Active |
XC7S50-2CSGA324I 324-lfbga / csga324 (15 x 15 mm, 0.8 mm pitch) 腳位配置指南
XC7S50-2CSGA324I（324-lfbga / csga324 (15 x 15 mm, 0.8 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC7S50-2CSGA324I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC7S50-2CSGA324I 適用於 6 應用s: Industrial Motor Control & Drive, Machine Vision & Image Processing, Automotive Driver-Assistance Subsystems, Portable Test & Measurement, Industrial IoT Edge Gateway, LED Video Wall & Display Bridging.
Industrial Motor Control & Drive
The XC7S50-2CSGA324I is well matched to multi-axis industrial motor drives where field-oriented control (FOC) and space-vector PWM are computed in real time. Its 120 DSP48 slices execute the fast inner current loop in a single cycle, while 52K logic cells absorb encoder interfaces, commutation state machines, and protective logic. The industrial -40C to +100C temperature grade handles under-hood or cabinet environments. Place the FPGA between the power section and the host controller with opto-isolated HR I/Os to PWM and analog feedback paths.
推薦
Machine Vision & Image Processing
The XC7S50-2CSGA324I supports mid-resolution machine-vision pipelines: MIPI CSI-2 bridge, Bayer demosaic, and basic defect classification. Its 120 DSP slices accelerate 2D convolution and Sobel filters, while 75 of 36 Kb block RAMs hold line buffers and small frame tiles. The 210 HR I/Os connect directly to CMOS image sensors and parallel LVDS serializers. Industrial temperature grade suits factory-line deployments. Stack with an external LPDDR4 memory controller and use a soft MIPI D-PHY in the HR I/O banks.
推薦
Automotive Driver-Assistance Subsystems
The XC7S50-2CSGA324I handles surround-view stitching, rear-camera overlay, and ultrasonic sensor fusion in entry-level ADAS modules. Its 52K logic cells run multi-camera warp-blend pipelines, while 120 DSP slices perform perspective correction in real time. The CSGA324 BGA is automotive-friendly when paired with AEC-Q100 peripherals. Industrial temperature grade suits in-cabin environments; for under-hood ECUs consider the Q automotive variant.
推薦
Portable Test & Measurement
The XC7S50-2CSGA324I powers handheld oscilloscopes, logic analyzers, and protocol testers where low power and reconfigurability matter. Its 52K logic cells implement custom protocol decodes, while 75 of 36 Kb block RAMs serve deep acquisition buffers. The -2 speed grade supports 200+ MHz sample-clock logic with comfortable timing closure. Industrial temperature grade enables field use. Use the JTAG configuration interface for in-the-field firmware updates via the host MCU.
推薦
Industrial IoT Edge Gateway
The XC7S50-2CSGA324I serves as a protocol-conversion hub between legacy industrial fieldbuses (Modbus, Profibus, CAN) and modern OPC-UA / MQTT Ethernet. Its 52K logic cells implement multiple soft protocol cores concurrently, and the 210 HR I/Os handle RS-485, RS-232, and CAN transceivers. Industrial temperature grade ensures cabinet reliability. Pair with an external Ethernet MAC for industrial-Ethernet protocols and the soft Ethernet MAC for in-band management.
推薦
LED Video Wall & Display Bridging
The XC7S50-2CSGA324I bridges HDMI or DisplayPort inputs to proprietary LED video-wall protocols, performing color-space conversion and gamma correction in real time. Its 120 DSP slices accelerate 3x3 color-matrix multiplies, while 75 of 36 Kb block RAMs buffer scan-line data for multi-tile output. The 210 HR I/Os drive 24+ parallel LED data channels. Industrial temperature grade supports outdoor enclosures; use SelectMAP-free HR I/O bank configuration for high-speed LVDS data lanes.
推薦
推薦產品摘要
工程參考資料，適用於 XC7S50-2CSGA324I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7S50-1CSGA324I | XC7S50-2CSGA324C | XC7S50-2CSG324I | XC7S50-2CSGA324Q |
|---|---|---|---|---|---|
| Package | CSGA324 (324-LFBGA, 15x15 mm) | CSGA324 - same | CSGA324 - same | CSG324 - same footprint, alt stack | CSGA324 - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 52,160 | 52,160 | 52,160 | 52,160 | 52,160 |
| Speed Grade | -2 | -1 (lower Fmax) | -2 (same) | -2 (same) | -2 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Automotive (AEC-Q100) |
| DSP Slices | 120 | 120 | 120 | 120 | 120 |
| Block RAM (36 Kb) | 75 | 75 | 75 | 75 | 75 |
| User I/O | 210 HR I/Os | 210 HR I/Os | 210 HR I/Os | 210 HR I/Os | 210 HR I/Os |
主要差異化特點
- Industrial temperature grade (-40C to +100C) for harsh environments (對比XC7S50-2CSGA324C)
- Higher Fmax from the -2 speed grade versus -1 (對比XC7S50-1CSGA324I)
- Pin-compatible cross-brand option via Lattice ECP5 (對比LFE5U-45F-6BG256C)
設計說明
The CSGA324 is a 324-ball BGA at 0.8 mm pitch - escape routing requires high-density interconnect (HDI) PCB technology with microvias. Use AMD's pinout files from UG475 to plan ball escape and verify the SDIO, configuration, and transceiver banks against your schematic. Place decoupling caps on the bottom side directly under each power/ground ball pair.
Sequence the Spartan-7 rails in the order VCCINT (0.95 V core), VCCAUX (1.8 V), then VCCO (1.2 V-3.3 V I/O banks) to avoid in-rush current and latch-up. AMD specifies monotonic ramp-up and a maximum delta between rails; use a multi-rail PMIC or discrete supervisors. Hold POR low until all rails are stable.
Keep GTP/GTX reference clock traces at 100 ohm differential with length-matching within 5 mils. Use SelectMAP mode for fast parallel configuration when boot time matters; use SPI flash for smallest BOM. Maintain at least 8 mm of PCB-to-frame clearance under the BGA for thermal dissipation on industrial designs.
Do not use the -2 speed grade with a -1 rated voltage regulator - the dropout behavior shifts and may violate POR. Avoid mixing LVCMOS25 and LVDS25 in the same bank unless explicitly listed as compatible in UG471. Industrial-temperature (I) parts have tighter AC timing margins than commercial parts at the same speed grade.
合規資訊
RoHS and REACH compliant per AMD Spartan-7 family environmental certification. Standard industrial -I grade is not AEC-Q100 - select the Q variant for AEC-Q100. Lead-free BGA ball finish.
