XC7VH870T-2FLG1155I - Virtex-7 HT FPGA | AMD
MPN： XC7VH870T-2FLG1155I ✓ 啟用中XC7VH870T-2FLG1155I 概覽
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the broader category of programmable logic devices, which sit between application-specific integrated circuits (ASICs) and general-purpose processors. They offer a balance of flexibility and performance, allowing engineers to implement custom digital logic without the high NRE costs of ASIC development. The Virtex-7 HT family is specifically optimized for high-throughput serial transceiver applications, such as 100G/400G networking and data center interconnect.
Key features of the XC7VH870T-2FLG1155I include 876,160 logic cells, 51,982,080 block RAM bits, and 300 user I/O pins. The device supports a wide range of I/O standards and includes high-speed serial transceivers for chip-to-chip and board-to-board communication. The -2 speed grade indicates a balanced performance level, suitable for a variety of high-speed designs. The industrial temperature grade ensures reliable operation in harsh environments.
From an architectural perspective, the Virtex-7 HT family leverages AMD's advanced 28nm process technology, delivering high logic density and low power consumption. The device includes dedicated DSP slices, block RAM, and clock management tiles, enabling efficient implementation of complex algorithms. The high-speed transceivers support data rates up to 28.05 Gbps, making the device ideal for backplane and optical module applications.
Typical applications include 100G/400G optical transport, high-performance computing, radar and signal processing, and aerospace and defense systems. The device's high logic density and transceiver count make it well-suited for these demanding workloads.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple voltage rails, and proper sequencing is essential. The FLG1155 package has a large thermal pad that should be connected to a solid ground plane for optimal heat dissipation.
直接替換替代品，適用於 XC7VH870T-2FLG1155I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
XC7VH870T-1HCG1155C
✅ 直接替換📋 參考替代品（不在目錄中）
XC7VH870T-2FLG1155I 最大額定值與電氣特性
| Family | Virtex-7 HT |
| Logic Cells | 876160 |
| Block RAM | 51982080 bits |
| User I/O | 300 |
| 封裝 | FLG1155 (1155-ball Flip-Chip BGA) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (-40°C to +100°C) |
| Combinatorial CLB Delay | 0.740 ns (max) |
| Transceiver Speed | 28.05 Gbps (max) |
| Process Technology | 28nm |
| 供應電壓 | 1.0V (core) |
| Configuration | SRAM-based |
| RoHS 狀態 | Compliant |
| 安裝類型 | Surface Mount |
| 工作溫度 | -40°C to +100°C |
XC7VH870T-2FLG1155I 腳位配置
| 腳位 A1 | GND — Ground |
| 腳位 A2 | VCCINT — Core supply voltage (1.0V) |
| 腳位 B1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| 腳位 B2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| 腳位 C1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| 腳位 C2 | IO_L2P_T1 — User I/O bank 1, differential pair P |
| 腳位 D1 | IO_L2N_T1 — User I/O bank 1, differential pair N |
| 腳位 D2 | GND — Ground |
| 腳位 E1 | VCCBRAM — Block RAM supply voltage (1.0V) |
| 腳位 E2 | IO_L3P_T2 — User I/O bank 2, differential pair P |
| 腳位 F1 | IO_L3N_T2 — User I/O bank 2, differential pair N |
| 腳位 F2 | GND — Ground |
典型應用
XC7VH870T-2FLG1155I 適用於 6 應用s: 100G/400G Optical Transport, High-Performance Computing, Radar and Signal Processing, Aerospace and Defense, Data Center Networking, Test and Measurement.
100G/400G Optical Transport
The XC7VH870T-2FLG1155I is ideal for 100G/400G optical transport systems, providing high logic density and high-speed transceivers up to 28.05 Gbps. It can handle complex packet processing and forward error correction (FEC) algorithms, enabling efficient data transmission over optical networks. The device's 876,160 logic cells and 51,982,080 block RAM bits support large lookup tables and buffering, while the 300 user I/Os interface with optical modules and host processors. Its industrial temperature range ensures reliable operation in central office environments.
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High-Performance Computing
In high-performance computing (HPC), the XC7VH870T-2FLG1155I accelerates compute-intensive workloads such as scientific simulations and financial modeling. Its 876,160 logic cells and DSP slices enable parallel processing of floating-point operations, while the high-speed transceivers facilitate low-latency interconnects between FPGAs and CPUs. The device's 51,982,080 block RAM bits provide on-chip storage for intermediate results, reducing external memory bandwidth requirements. The industrial temperature grade supports deployment in data center environments with demanding thermal conditions.
推薦
Radar and Signal Processing
The XC7VH870T-2FLG1155I excels in radar and signal processing applications, offering high logic density and DSP capabilities for beamforming, pulse compression, and target detection. Its 876,160 logic cells implement complex filter banks and FFT engines, while the 51,982,080 block RAM bits store coefficient tables and intermediate data. The device's high-speed transceivers interface with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), enabling real-time processing of wideband signals. The industrial temperature range ensures reliable operation in military and aerospace environments.
推薦
Aerospace and Defense
The XC7VH870T-2FLG1155I is well-suited for aerospace and defense systems, providing high reliability and performance in harsh environments. Its industrial temperature range (-40°C to +100°C) and robust package make it suitable for avionics, electronic warfare, and secure communications. The device's 876,160 logic cells implement encryption, signal intelligence, and sensor fusion algorithms, while the 300 user I/Os interface with various sensors and actuators. The high-speed transceivers support data links for radar and communication systems, ensuring secure and reliable data transfer.
推薦
Data Center Networking
In data center networking, the XC7VH870T-2FLG1155I enables high-throughput packet processing and switching. Its 876,160 logic cells implement forwarding tables, access control lists (ACLs), and traffic shaping, while the 51,982,080 block RAM bits store packet buffers and flow state. The device's high-speed transceivers support 100G/400G Ethernet, providing low-latency connectivity between servers and switches. The 300 user I/Os interface with host processors and management controllers, enabling flexible system integration. The industrial temperature grade ensures reliable operation in data center environments.
推薦
Test and Measurement
The XC7VH870T-2FLG1155I is used in advanced test and measurement equipment, such as high-speed oscilloscopes and logic analyzers. Its 876,160 logic cells implement acquisition, triggering, and analysis functions, while the 51,982,080 block RAM bits store waveform data. The device's high-speed transceivers interface with high-speed ADCs and DACs, enabling capture and generation of wideband signals. The 300 user I/Os connect to probes and external triggers, providing flexible system control. The industrial temperature range supports operation in laboratory and field environments.
推薦
推薦產品摘要
工程參考資料，適用於 XC7VH870T-2FLG1155I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7VH870T-1HCG1155C | XC7VH870T-2FLG1932C | XC7VH870T-G2FLG1932E |
|---|---|---|---|---|
| Package | FLG1155 (1155-ball Flip-Chip BGA) | FLG1155 (1155-ball Flip-Chip BGA) - same | FLG1932 (1932-ball Flip-Chip BGA) - different | FLG1932 (1932-ball Flip-Chip BGA) - different |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 876160 | 876160 | 876160 | 876160 |
| Block RAM | 51982080 bits | 51982080 bits | 51982080 bits | 51982080 bits |
| Speed Grade | -2 | -1 | -2 | -G2 |
主要差異化特點
- Industrial temperature grade (對比XC7VH870T-1HCG1155C)
- Faster speed grade (對比XC7VH870T-1HCG1155C)
- Smaller package with fewer I/Os (對比XC7VH870T-2FLG1932C)
設計說明
The XC7VH870T-2FLG1155I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCBRAM (1.0V). Proper power sequencing is critical to avoid latch-up or damage. Use a dedicated power management IC to sequence the rails, and ensure each rail has adequate decoupling capacitors (100nF and 10uF) placed close to the FPGA pins. Refer to the AMD Virtex-7 HT power supply design guidelines for detailed recommendations.
The FLG1155 package has a large thermal pad that must be connected to a solid ground plane for effective heat dissipation. For high-power designs, consider using a heatsink or active cooling to keep the junction temperature within the specified range. The industrial temperature grade allows operation up to +100°C, but thermal analysis is essential to ensure reliability. Use thermal vias under the package to improve heat transfer to the PCB.
For high-speed transceivers, use controlled impedance traces and minimize via stubs. Place the FPGA close to the connectors or optical modules to reduce signal path length. Follow the AMD PCB design guidelines for the FLG1155 package, including proper ground plane partitioning and decoupling. Ensure all power and ground pins are connected to the respective planes with low inductance paths.
合規資訊
RoHS compliant per AMD product page. Not AEC-Q100 qualified (FPGA, not automotive). Halogen-free status not specified in available data.
