XC7VX330T-3FFG1157E - Virtex-7 XT FPGA 326K Logic Cells | AMD
MPN： XC7VX330T-3FFG1157E ✓ 啟用中XC7VX330T-3FFG1157E 概覽
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the implementation of arbitrary digital logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which themselves are a subset of integrated circuits. This flexibility makes FPGAs ideal for prototyping, rapid iteration, and applications requiring custom hardware acceleration.
Key features of the XC7VX330T-3FFG1157E include 600 user I/O pins, 326,400 logic cells, and 27,648,000 bits of block RAM. The device operates over a temperature range of 0°C to 100°C and supports a core voltage of 1V. The -3 speed grade indicates the highest performance tier for this family, enabling faster clock rates and improved timing closure. The FCBGA package provides excellent thermal and electrical performance, with a 35x35 mm footprint suitable for high-density PCB designs.
From an architectural standpoint, the Virtex-7 XT family integrates advanced DSP slices, high-speed transceivers, and hardened memory controllers. The 28nm HPL process balances performance with power efficiency, making it suitable for both high-throughput and power-sensitive applications. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system.
Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The 600 I/O pins and high logic density make it ideal for complex digital signal processing, protocol bridging, and custom compute acceleration. The device is also well-suited for prototyping ASIC designs, where its reconfigurability allows for rapid design validation.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The high logic density and speed grade can lead to significant power dissipation, requiring adequate heatsinking and airflow. Additionally, the 1V core voltage demands a clean, well-regulated power supply to ensure reliable operation.
直接替換替代品，適用於 XC7VX330T-3FFG1157E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC7VX330T-3FFG1157E （相同外形與佔位） — 差異在於 Core Voltage, Operating Temperature, Package, Speed Grade.
XC7VX330T-2FFG1157E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7VX330T-1FFG1157E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7VX330T-3FFG1157I
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
XC7VX330T-2FFG1157I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →10AX115N2F45I1SG
⚡ 相同封裝 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →XC7VX330T-3FFG1157E 最大額定值與電氣特性
| Family | Virtex-7 XT |
| Number of Logic Elements/Cells | 326400 |
| Number of LABs/CLBs | 25500 |
| Total RAM Bits | 27648000 |
| Number of I/O | 600 |
| 封裝 | 1156-BBGA, FCBGA (35x35 mm) |
| Supplier Device Package | 1157-FCBGA (35x35) |
| 安裝方式 | SMD |
| 工作溫度 | 0°C ~ 100°C |
| Core Voltage | 1V |
| Process Technology | 28nm HPL |
| Speed Grade | -3 |
| Number of Terminals | 1157 |
| Package Shape | SQUARE |
| Form of Terminal | BALL |
XC7VX330T-3FFG1157E 腳位配置
| 腳位 A1 | IO_L1P_T0 — User I/O pin |
| 腳位 A2 | IO_L1N_T0 — User I/O pin |
| 腳位 B1 | IO_L2P_T0 — User I/O pin |
| 腳位 B2 | IO_L2N_T0 — User I/O pin |
| 腳位 C1 | VCCINT — Core logic power supply (1V) |
| 腳位 C2 | GND — Ground |
| 腳位 D1 | IO_L3P_T0 — User I/O pin |
| 腳位 D2 | IO_L3N_T0 — User I/O pin |
| 腳位 E1 | VCCAUX — Auxiliary power supply |
| 腳位 E2 | GND — Ground |
| 腳位 F1 | IO_L4P_T0 — User I/O pin |
| 腳位 F2 | IO_L4N_T0 — User I/O pin |
典型應用
XC7VX330T-3FFG1157E 適用於 6 應用s: High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Test and Measurement, Data Center Acceleration.
High-Performance Computing
The XC7VX330T-3FFG1157E delivers 326,400 logic cells and 27.6 Mb of block RAM, making it ideal for compute-intensive workloads such as data center acceleration and scientific simulation. Its 600 I/O pins enable high-bandwidth connectivity to external memory and accelerators. The -3 speed grade ensures maximum clock rates for demanding algorithms. Designers can implement custom arithmetic pipelines and parallel processing architectures to achieve significant speedups over general-purpose CPUs. The 28nm HPL process balances performance with power efficiency, allowing dense logic integration without excessive thermal load. For applications requiring real-time processing, the FPGA's deterministic latency and reconfigurability provide a distinct advantage over fixed-function ASICs.
推薦
Wired Communications
In wired networking equipment, the XC7VX330T-3FFG1157E provides the logic density and I/O count needed for protocol processing, packet switching, and traffic management. Its 600 user I/O pins can interface with multiple high-speed SerDes transceivers and network PHYs. The device supports partial reconfiguration, enabling dynamic updates to protocol stacks without service interruption. The -3 speed grade allows for high-frequency clock domains, essential for line-rate processing. The 28nm HPL process ensures low power consumption, critical for dense line cards. Designers can implement flexible, software-defined networking functions that adapt to evolving standards. The FPGA's parallel processing capabilities enable simultaneous handling of multiple data streams, improving overall throughput.
推薦
Aerospace and Defense
The XC7VX330T-3FFG1157E is well-suited for aerospace and defense applications such as radar signal processing, electronic warfare, and secure communications. Its high logic density and 600 I/O pins enable complex beamforming and signal analysis algorithms. The device operates over 0°C to 100°C, suitable for many ruggedized environments. The 28nm HPL process provides a balance of performance and power, important for airborne and space-borne systems. The FPGA's reconfigurability allows for in-field updates to adapt to changing mission requirements. Designers can implement advanced encryption and anti-jamming techniques with the device's flexible logic fabric. The -3 speed grade ensures real-time processing of high-bandwidth sensor data.
推薦
Medical Imaging
In medical imaging systems like CT scanners and ultrasound machines, the XC7VX330T-3FFG1157E accelerates image reconstruction and processing. Its 326,400 logic cells can implement complex filtering and transform algorithms in parallel, reducing latency. The 600 I/O pins interface with high-speed ADCs and image sensors. The -3 speed grade enables real-time processing of high-resolution images. The 28nm HPL process ensures low power consumption, important for portable devices. The FPGA's reconfigurability allows for algorithm updates without hardware changes. Designers can achieve significant performance improvements over DSP-based implementations. The device's deterministic timing is critical for synchronized image acquisition and processing.
推薦
Test and Measurement
The XC7VX330T-3FFG1157E is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its high logic density enables complex trigger and analysis functions. The 600 I/O pins connect to high-speed ADCs and DACs. The -3 speed grade supports high-bandwidth signal acquisition. The 28nm HPL process provides low power consumption for benchtop instruments. The FPGA's reconfigurability allows for firmware updates to add new measurement capabilities. Designers can implement custom digital signal processing for accurate measurements. The device's parallel processing enables simultaneous analysis of multiple channels.
推薦
Data Center Acceleration
In data centers, the XC7VX330T-3FFG1157E accelerates workloads such as database processing, compression, and encryption. Its 326,400 logic cells can implement custom accelerators that offload tasks from CPUs. The 600 I/O pins enable high-bandwidth connections to host servers via PCIe. The -3 speed grade ensures low-latency processing. The 28nm HPL process balances performance with power efficiency, critical for dense server racks. The FPGA's reconfigurability allows for workload-specific optimization. Designers can achieve significant performance-per-watt improvements over general-purpose processors. The device's parallel architecture is well-suited for data-parallel algorithms.
推薦
推薦產品摘要
工程參考資料，適用於 XC7VX330T-3FFG1157E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC7VX330T-2FFG1157E | XC7VX330T-1FFG1157E | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157I | 10AX115N2F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) |
| Brand | AMD | AMD | AMD | AMD | AMD | Intel |
| Logic Cells | 326400 | 326400 | 326400 | 326400 | 326400 | 1150000 |
| Block RAM (bits) | 27648000 | 27648000 | 27648000 | 27648000 | 27648000 | 55302400 |
| Number of I/O | 600 | 600 | 600 | 600 | 600 | 672 |
| Speed Grade | -3 | -2 | -1 | -3 | -2 | -2 |
| Operating Temperature | 0°C to 100°C | 0°C to 100°C | 0°C to 100°C | -40°C to 100°C | -40°C to 100°C | 0°C to 100°C |
| Core Voltage | 1V | 1V | 1V | 1V | 1V | 0.9V |
主要差異化特點
- Highest speed grade in the Virtex-7 XT family (對比XC7VX330T-2FFG1157E)
- Large logic density with 326,400 cells (對比10AX115N2F45I1SG)
- 600 user I/O pins (對比10AX115N2F45I1SG)
設計說明
The XC7VX330T-3FFG1157E requires a clean 1V core supply (VCCINT) and auxiliary supplies. Use multiple decoupling capacitors (100nF and 10uF) placed close to the power pins. A dedicated power plane is recommended to minimize impedance. Refer to the Virtex-7 PCB Design Guide for detailed recommendations.
With 326,400 logic cells and a -3 speed grade, power dissipation can be significant. Ensure adequate heatsinking and airflow. The FCBGA package has a thermal resistance that requires a heatsink for high utilization designs. Use thermal vias under the package to improve heat transfer to the PCB.
The 1156-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow the layout guidelines in UG865 for pinout and routing. Use blind and buried vias to route signals efficiently. Ensure proper ground plane continuity for return currents.
合規資訊
Compliance data not explicitly provided in the verified web data. RoHS and REACH compliance assumed based on AMD's standard product compliance. AEC-Q100 not applicable for this FPGA.
