A3P600-1FGG144I vs A3P600-2FGG144 比較
詳細並排比較 A3P600-1FGG144I 由 Microchip Technology 與 A3P600-2FGG144 由 Microsemi. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | A3P600-1FGG144I | A3P600-2FGG144 |
|---|---|---|
| 品牌 | Microchip Technology | Microsemi |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | — |
| Logic Elements (LEs) | 13824 | — |
| D-Flip-Flops | 13824 | — |
| RAM Bits | 110592 | — |
| User I/Os | 97 | — |
| Number of PLLs | 1 | — |
| Core Supply Voltage | 1.5 V | — |
| I/O Standards Supported | 3.3V, 2.5V, 1.8V, 1.5V | — |
| Maximum System Performance | 272 MHz | — |
| Maximum Internal Clock Frequency | 350 MHz | — |
| 封裝 | 144-LBGA (13x13 mm, 0.8 mm pitch) | 144-Ball FBGA (FGG144) |
| 工作溫度範圍 | -40°C to +100°C (industrial) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Technology | 130nm Flash | — |
| Equivalent Gate Count | — | 600000 gates |
| Logic Cells (CLBs) | — | 13824 CLBs |
| User I/O | — | 97 I/O |
| System Performance | — | 310 MHz |
| Process Technology | — | 130 nm CMOS |
| Core Voltage | — | 1.5 V |
| Program Technology | — | Nonvolatile Flash |
| Ball Pitch | — | 1 mm |
| Packaging | — | Tray |
| Speed Grade | — | -2 |
| Configuration | — | Single-chip, Instant On, no external boot device |
| I/O Banks | — | 4 (independently supplied VCCIB banks) |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |