EP20K400FC784-3 vs EP20K400FI784-2 比較

詳細並排比較 EP20K400FC784-3 由 Intel 與 EP20K400FI784-2 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP20K400FC784-3 EP20K400FI784-2
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Family APEX 20K (MultiCore) —
Typical Gates 400,000 400,000
Maximum System Gates 1,052,000 —
Logic Elements 21,168 —
Maximum RAM Bits 212,992 —
Embedded System Blocks (ESBs) 100 [DATA_NEEDED: ESB count]
PLLs 4 —
User I/O Pins 488 —
封裝 784-ball FineLine BGA (FC) —
Speed Grade -3 -2
工作溫度 Commercial (0°C to +85°C) —
I/O Standards MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V —
Core Voltage [DATA_NEEDED: core voltage] —
Process Technology 0.18 µm CMOS [DATA_NEEDED: process node]
Configuration Method Serial or parallel, SRAM-based —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
MSL 等級 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Lead-Free [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Device Family — APEX 20K
Logic Elements (LEs) — [DATA_NEEDED: logic elements count]
Maximum User I/O Pins — [DATA_NEEDED: user I/O count]
Dedicated Inputs — 4
Nominal Core Supply Voltage (VCCINT) — 2.5 V
VCCINT Range — 2.375 V to 2.625 V
工作溫度範圍 — -40 °C to +100 °C
Package Type — S-PBGA-B784 (FineLine BGA)
Package Pin Count — 784 balls
Ball Pitch — 1.000 mm
安裝類型 — Surface Mount
Device Form Factor — Loadable PLD
Configuration Memory — SRAM-based (volatile)

資料表與資源

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