EP2AGZ300FH29I4G vs EP2AGZ300FH29I3G 比較
詳細並排比較 EP2AGZ300FH29I4G 由 Intel 與 EP2AGZ300FH29I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGZ300FH29I4G | EP2AGZ300FH29I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria II GZ (AGZ) | Arria II GZ |
| Logic Elements (LE) | 300,000 (approx., per family member) | 300,000 |
| Number of I/O | 281 | — |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | — |
| Package Code | FH29 (29x29 mm) | — |
| 工作溫度範圍 | -40C to +100C (industrial, I-grade) | — |
| Speed Grade | I4 | -3 |
| Process Node | 40 nm TSMC | 40 nm TSMC |
| Supply Voltage (Core) | 0.9 V (typical) | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | — |
| Transceivers | Embedded multi-gigabit transceivers (per family) | — |
| DSP Blocks | Yes (variable-precision, per family) | — |
| Block RAM | Embedded M9K / M144K blocks | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | [DATA_NEEDED: MSL rating] | — |
| Lead-Free | Yes (per RoHS) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Embedded Memory | — | 18,520 Kbits |
| DSP Blocks (18x18 multipliers) | — | 720 |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Number of Transceivers | — | 24 |
| 封裝 | — | 780-pin FineLine BGA (FH29), 29x29 mm |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Operating Voltage (Core) | — | 0.9 V |
| External Memory Interface | — | DDR3 up to 800 MHz |