EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel
MPN： EP3C10F256C6 ✓ 啟用中EP3C10F256C6 概覽
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure the device's logic blocks, routing, and I/O behavior after manufacture. Within the programmable logic hierarchy, FPGAs sit at the top, above CPLDs (Complex Programmable Logic Devices), and are used to implement everything from simple glue logic to complete processor subsystems, DSP pipelines, and high-speed interface bridges.
Key features of the EP3C10F256C6 include 23 embedded 18x18 multipliers, 2 PLLs for clock management, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and a core voltage range that enables operation from typical 1.15 V to 1.25 V supplies with I/O voltages scalable to 3.3 V. It uses SRAM-based configuration, requiring an external configuration memory such as the EPCS4 or EPCS16 serial flash, and supports JTAG and Active Serial (AS) configuration modes.
The device is fabricated on TSMC's 60 nm low-power process and consumes approximately 120 mW of static power under typical conditions, with dynamic power scaling with toggle rate and design utilization. Designers can use the free Quartus II Web Edition (and later Intel Quartus Prime Lite) toolchain to synthesize, place-and-route, and program the device using Verilog HDL or VHDL.
Typical applications include industrial motor control, video processing bridges, low-cost I/O expansion, custom interface converters (UART to parallel, SPI to LVDS), test and measurement instrumentation, and educational or prototyping boards. The 256-FBGA package offers sufficient I/O density for mid-complexity designs while remaining hand-reworkable with proper hot-air rework equipment.
When designing with this part, pay careful attention to decoupling: place 100 nF and 10 uF capacitors within 5 mm of every VCCINT and VCCIO pin pair, and follow Altera's Cyclone III hardware design guide for the PCB footprint. The configuration scheme (AS vs JTAG) must be selected via MSEL[3:0] pins during board bring-up.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Quartus II design notes that complement - rather than duplicate - the manufacturer datasheet.
直接替換替代品，適用於 EP3C10F256C6 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3C10F256C6 （相同外形與佔位） — 差異在於 Package, Operating Temperature, RoHS Status, Process Technology, Family.
EP3C10F256C8N
✅ 直接替換聯絡詢價
查看資料表 →EP3C10F256C7N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C10F256C6N
✅ 直接替換聯絡詢價
查看資料表 →EP3C16F256C8N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3C10E144C7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C10E144I7N
✅ 直接替換聯絡詢價
查看資料表 →EP3C10F256C6 最大額定值與電氣特性
| Family | Cyclone III |
| Logic Elements (LE) | 10,320 |
| Total Memory Bits | 423,936 bits |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Maximum User I/Os | 182 |
| 封裝 | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| 安裝類型 | Surface Mount (BGA) |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Memory | SRAM-based (external EPCS flash required) |
| 工作溫度 | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | 6 |
| RoHS 狀態 | Compliant (lead-free FBGA) |
| MSL 等級 | 3 (168 hours) |
EP3C10F256C6 腳位配置
| 腳位 A1 | VCCIO_1 — I/O bank 1 supply voltage |
| 腳位 B2 | IO_1_1 — User I/O pin |
| 腳位 C3 | GND — Ground |
| 腳位 D4 | VCCINT — Core supply voltage 1.2 V |
| 腳位 E5 | IO_2_5 — User I/O pin |
| 腳位 F6 | MSEL0 — Configuration mode select 0 |
| 腳位 G7 | MSEL1 — Configuration mode select 1 |
| 腳位 H8 | MSEL2 — Configuration mode select 2 |
| 腳位 J9 | MSEL3 — Configuration mode select 3 |
| 腳位 K10 | TCK — JTAG clock input |
| 腳位 L11 | TDI — JTAG data input |
| 腳位 M12 | TDO — JTAG data output |
| 腳位 N13 | TMS — JTAG mode select |
| 腳位 P14 | nCONFIG — Configuration start (active low) |
| 腳位 R15 | nSTATUS — Configuration status (active low) |
| 腳位 T16 | DCLK — Configuration clock (AS mode input) |
| 腳位 U1 | DATA0 — Configuration data input (AS mode) |
| 腳位 V2 | PLL1_CLKOUTp — PLL 1 differential clock output + |
| 腳位 W3 | PLL1_CLKOUTn — PLL 1 differential clock output - |
| 腳位 Y4 | PLL2_CLKOUTp — PLL 2 differential clock output + |
| 腳位 AA5 | IO_3_5 — User I/O pin |
| 腳位 AB6 | IO_4_1 — User I/O pin |
| 腳位 AC7 | IO_4_2 — User I/O pin |
| 腳位 AD8 | IO_4_3 — User I/O pin |
| 腳位 AE9 | IO_5_4 — User I/O pin |
| 腳位 AF10 | IO_6_5 — User I/O pin |
| 腳位 B16 | IO_7_6 — User I/O pin |
| 腳位 C15 | IO_7_7 — User I/O pin |
| 腳位 D14 | IO_8_8 — User I/O pin |
| 腳位 E13 | IO_8_9 — User I/O pin |
| 腳位 F12 | IO_8_10 — User I/O pin |
典型應用
EP3C10F256C6 適用於 6 應用s: Industrial Motor Control, Video Format Conversion Bridge, Custom Interface Converter (UART/SPI to LVDS), Test and Measurement Instrumentation, Educational and Prototyping Boards, Low-Cost I/O Expansion Backplane.
Industrial Motor Control
The EP3C10F256C6 fits industrial motor control boards because its 182 user I/Os can simultaneously drive encoder inputs, PWM channels, and GPIO expansion ports. The 2 hard PLLs generate precise switching frequencies for three-phase inverters, while the 23 embedded 18x18 multipliers handle Clark/Park transforms and PID loops in hardware. Operating from -40 C to +125 C, it survives cabinet-level ambient temperatures without thermal derating. Designers typically implement the field-oriented control loop at 16 kHz PWM, leaving sufficient LE headroom for safety logic and CAN/EtherCAT interface glue.
推薦
Video Format Conversion Bridge
Video bridge designs using the EP3C10F256C6 leverage its 423,936 bits of M9K memory for line buffers and its LVDS I/O capability for camera-link or HDMI-style interfaces. The device can convert between BT.656, BT.1120, and parallel RGB formats in real time using a custom datapath on the 10K LE fabric. Compared to an ASSP video processor, the FPGA variant allows late-stage protocol changes without respinning the PCB. Typical reference designs fit in 60-70% of available logic with timing closure at 148.5 MHz pixel clock.
推薦
Custom Interface Converter (UART/SPI to LVDS)
Engineers commonly use the EP3C10F256C6 as a protocol bridge that converts UART, SPI, or I2C traffic to LVDS pairs for noise-isolated industrial links. The 23 hard multipliers and 2 PLLs are overkill for the converter but reserve headroom for added CRC checksums or Manchester encoding. The 1.2 V core consumes approximately 120 mW static power, which fits within budget-constrained embedded designs. Quartus II Web Edition supports this design class without license fees.
推薦
Test and Measurement Instrumentation
Test equipment designers select the EP3C10F256C6 for digital pattern generators, logic analyzers, and protocol exercisers where flexibility outweighs per-unit cost. The 10,320 LE fabric implements stimulus sequencing, while the M9K memory blocks store pre-recorded waveforms. LVDS inputs at 1.25 Gbps are achievable on selected banks, enabling high-speed serial test access. Engineers program the device via JTAG during development and lock the final bitstream in EPCS flash for production.
推薦
Educational and Prototyping Boards
University FPGA labs and OEM prototyping boards standardize on the EP3C10F256C6 because Quartus II Web Edition (now Quartus Prime Lite) supports the entire Cyclone III family at no cost. Students learn Verilog and VHDL on a real 60 nm silicon device with 10K LE - enough to host a Nios II soft-core processor. The 256-FBGA package exposes all 182 user I/Os to a 0.1-inch header bank via level shifters, making the board breadboard-friendly.
推薦
Low-Cost I/O Expansion Backplane
Embedded computing platforms use the EP3C10F256C6 as a backplane I/O expander, translating between a host CPU's SPI/PCIe link and dozens of GPIO, UART, or PWM channels. The 182 user I/Os are split across 8 VCCIO banks, allowing the FPGA to interface with 1.8 V, 2.5 V, and 3.3 V peripherals simultaneously. The 2 PLLs derive multiple clock domains from a single backplane reference, simplifying board layout.
推薦
推薦產品摘要
工程參考資料，適用於 EP3C10F256C6 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3C10F256C8N | EP3C10F256C7N | EP3C10F256C6N | EP3C16F256C8N |
|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 516,096 bits |
| Speed Grade | 6 | 8 | 7 | 6 | 8 |
| Maximum User I/Os | 182 | 182 | 182 | 182 | 182 |
| Embedded Multipliers | 23 (18x18) | 23 (18x18) | 23 (18x18) | 23 (18x18) | 56 (18x18) |
| PLLs | 2 | 2 | 2 | 2 | 4 |
| Configuration Mode | AS / JTAG / PS | AS / JTAG / PS | AS / JTAG / PS | AS / JTAG / PS | AS / JTAG / PS |
主要差異化特點
- Highest Fmax margin in same-family speed grades (對比EP3C10F256C8N)
- Density upgrade path in same footprint (對比EP3C16F256C8N)
- Mature Quartus II Web Edition toolchain support (對比Cyclone V (5CEBA4F256C7N))
設計說明
Decouple every VCCINT pin with a 100 nF X7R ceramic placed within 5 mm of the package ball, and add a single 10 uF bulk capacitor per VCCINT bank. Each VCCIO bank requires its own 100 nF + 10 uF pair to suppress simultaneous switching noise. Estimated: at 100 MHz core clock with 60% utilization, the device draws roughly 1.2 V * 250 mA = 0.3 W dynamic plus 0.12 W static; a 0.5 W budget is safe.
Route the FBGA-256 escape pattern on the top layer with microvias (laser-drilled) to an inner layer ground plane. Keep the JTAG chain (TCK/TMS/TDI/TDO) impedance-controlled at 50 ohm and use a 10 kohm pull-up on nCONFIG and nSTATUS per Altera hardware design guidelines. The MSEL[3:0] pins must be tied to VCCIO_1 (AS mode) or GND (JTAG mode) - leave them accessible via 0 ohm resistors for board-bringup flexibility.
Do not apply power to VCCIO before VCCINT - this forward-biases the I/O ESD diodes and can latch-up the device. Sequence supplies such that VCCINT ramps before or simultaneously with VCCIO. The 'C' suffix in EP3C10F256C6 denotes the 0 C to +85 C commercial range; for industrial -40 C to +125 C operation, choose the 'I' suffix variant (EP3C10F256I6) instead.
合規資訊
RoHS compliant per Altera/Intel product page (lead-free FBGA package). Not AEC-Q100 qualified - this is a general-purpose FPGA, not an automotive-grade part. Conflict-minerals compliance per Intel's published CMRT declarations.
