EP3C5F256C6 vs EP3C5F256C8 比較
詳細並排比較 EP3C5F256C6 由 Intel 與 EP3C5F256C8 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3C5F256C6 | EP3C5F256C8 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone III | — |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | — |
| Total Memory Bits | 423,936 bits | 423,936 |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | — |
| User I/Os | 182 | — |
| PLLs | 4 | Yes (general-purpose PLLs) |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 65 nm CMOS, low-k | 65 nm low-power CMOS |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| 封裝 | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | — |
| RoHS 狀態 | Compliant (lead-free per FBGA package) | Lead Free, MS-034 |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Series | — | Cyclone III |
| Logic Elements | — | 5,136 |
| Number of LABs/CLBs | — | 321 |
| Number of Logic Elements/Cells | — | 5,136 |
| Maximum User I/O | — | 182 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| 工作溫度 | — | -40°C to +125°C |
| Package Type | — | 256-LBGA (FineLine BGA) |
| Package Code | — | FBGA-256 |
| 供應電壓 | — | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] |
| Configuration Memory | — | External flash via AS/PS/JTAG/FPP |
| Embedded Multipliers | — | Yes (18x18 hard multipliers) |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |