EP3CLS200F780C8N vs EP3CLS100F780C8N 比較

詳細並排比較 EP3CLS200F780C8N 由 Intel 與 EP3CLS100F780C8N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3CLS200F780C8N EP3CLS100F780C8N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III LS —
Logic Elements 198,464 —
Embedded Memory Bits 8,211,456 bits (approximately 1008 Kbytes) —
Maximum User I/O Pins 413 —
Number of PLLs 4 4
Number of Global Clock Networks 20 —
Process Technology 65 nm CMOS 65 nm low-power CMOS
Core Supply Voltage (VCCINT) 1.2 V (typical) 1.2 V
Speed Grade C8 (commercial, 8 ns) —
工作溫度範圍 0C to +85C (commercial) —
封裝 780-ball FBGA (FineLine BGA) 780-ball FBGA (FineLine BGA)
安裝類型 Surface Mount Surface Mount (BGA)
MSL 等級 3 (per JEDEC J-STD-020) —
RoHS 狀態 Compliant (lead-free FBGA) Compliant
Bitstream Encryption AES-128 (Cyclone III LS feature) —
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) —
Multipliers (18x18) 396 (Cyclone III LS family characteristic) —
Device Family — Cyclone III LS
Logic Elements (LE) — 100,448
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Logic Array Blocks (LAB) — 6,278
Maximum User I/O — 429
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

資料表與資源

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