EP3SE260F1517C2N vs EP3SE260F1517C3N 比較
詳細並排比較 EP3SE260F1517C2N 由 Intel 與 EP3SE260F1517C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517C2N | EP3SE260F1517C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 254,400 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Total Memory Bits | 16,672,768 | — |
| Maximum User I/Os | 976 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm TSMC low-power CMOS |
| Maximum Core Frequency | 600 MHz | — |
| 封裝 | 1517-ball FC-BGA | 1517-BBGA (FCBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Configuration Interface | Passive Serial, Fast Passive Parallel, JTAG, Active Serial | — |
| Lead Free | Yes | — |
| RoHS 狀態 | Compliant | Compliant |
| Speed Grade | C2 | C3 (commercial) |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| PLLs | — | 4 |
| Global Clock Networks | — | 16 |
| 工作接面溫度 | — | 0 C to +85 C (commercial) |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |