EP3SE260F1517C3N vs EP3SE260F1517C3 比較

詳細並排比較 EP3SE260F1517C3N 由 Intel 與 EP3SE260F1517C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517C3N EP3SE260F1517C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 啟用中
Family Stratix III E —
Logic Elements 254,400 255,000
Embedded Memory 16,672,768 bits (16.7 Mbits) 16,672,768 bits (16.67 Mbit)
User I/Os 976 976
DSP Blocks (18x18 Multipliers) 816 —
M9K Memory Blocks 1,040 —
Maximum Transceiver Data Rate 600 Mbps —
PLLs 4 12
Global Clock Networks 16 —
封裝 1517-BBGA (FCBGA) 1517-BBGA, FCBGA (FineLine BGA)
Process Technology 65 nm TSMC low-power CMOS —
Speed Grade C3 (commercial) 3
工作接面溫度 0 C to +85 C (commercial) —
安裝類型 Surface Mount Surface Mount (BGA)
RoHS 狀態 Compliant Compliant
External Memory Interfaces DDR3, DDR2, QDRII+, RLDRAM2 —
Manufacturer — Intel (formerly Altera)
Series — Stratix III E
Logic Array Blocks (LABs) — 10,200
DSP Blocks (18x18 multipliers) — 768
Core Voltage — 0.9 V
Process Node — 65 nm (TSMC)
Package Pitch — 1.0 mm
Operating Temperature Grade — Commercial (C suffix)
Configuration — SRAM-based, requires external configuration device

資料表與資源

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