EP3SE50F484C3N vs EP3SE50F484C4LN 比較

詳細並排比較 EP3SE50F484C3N 由 Intel 與 EP3SE50F484C4LN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F484C3N EP3SE50F484C4LN
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete NRND
Family Stratix III E Stratix III E
Device Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) 18,750 —
Embedded Memory (Bits) 5,760,000 —
User I/Os 296 —
Maximum Internal Frequency 717 MHz (typical); 800 MHz per DigChip —
Process Technology TSMC 40 nm low-power CMOS —
封裝 484-ball FBGA (FCBGA), 1.0 mm pitch —
供應電壓 Core and I/O voltages per Stratix III E datasheet —
工作溫度 0C to +85 C (commercial, C suffix) 0C to +85C (commercial)
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 3 (per JEDEC J-STD-020 for FCBGA packages) —
RoHS 狀態 Lead-free (per DigiKey listing) —
Configuration Mode Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG —
Design Software Intel Quartus II (Stratix III support) —
生命週期狀態 Obsolete (per Worldway listing 2026-04-05) —
Logic Elements (LE) — 47,500
LABs/CLBs — 1900
Total RAM Bits — 2,344,448 (2286 Kbit)
Number of I/O — 296
Number of Multipliers (18x18) — 384
Voltage - Supply (Core) — 0.85 V to 1.1 V
Voltage - Supply (I/O) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
封裝 / 外殼 — 484-BBGA, FCBGA (FineLine BGA)
Lead Free / RoHS — Lead free / RoHS compliant
Process Node — 40 nm CMOS
Speed Grade — C4
Configuration — FPP / AS / JTAG

資料表與資源

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