EP3SL200H780I4 vs EP3SL200H780I3 比較
詳細並排比較 EP3SL200H780I4 由 Intel 與 EP3SL200H780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL200H780I4 | EP3SL200H780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Series | Stratix III L | Stratix III L |
| Family | Stratix III | Stratix III |
| Logic Elements (LE) | 200,000 | — |
| Logic Array Blocks (LABs) | 8000 | — |
| Embedded Memory Bits | 10,901,504 | — |
| User I/O Count | 488 | 488 |
| DSP Multipliers (18x18) | 384 | — |
| Voltage - Core Supply | 1.1 V | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Package Type | 780-BBGA / FCBGA (FC-HFBGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Speed Grade | I4 (industrial) | — |
| 工作接面溫度 | -40C to +100C (industrial) | — |
| Configuration Memory | SRAM-based, volatile | — |
| RoHS 狀態 | Compliant | — |
| Design Tool | Quartus II (legacy) / Quartus Prime | — |
| Logic Elements | — | 200,000 |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| PLLs | — | 12 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 717 MHz |
| 工作溫度 | — | -40C to +100C (Industrial) |
| 封裝 | — | 780-BBGA, FCBGA (HBGA-780) |
| 安裝類型 | — | Surface Mount |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | — | Compliant (lead-free) |