EP3SL200H780I4LN vs EP3SL200H780C2N 比較
詳細並排比較 EP3SL200H780I4LN 由 Altera 與 EP3SL200H780C2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL200H780I4LN | EP3SL200H780C2N |
|---|---|---|
| 品牌 | Altera | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Series | Stratix III L | — |
| Family | Stratix III L (Low-Power) | Stratix III L |
| Manufacturer | Intel / Altera (now Intel PSG) | — |
| Number of Logic Elements / Cells | 200,000 | — |
| Number of LABs / CLBs | 8,000 | — |
| Total RAM Bits | 10,901,504 (approximately 10.9 Mbit) | — |
| Number of I/O | 488 | — |
| Voltage - Supply | 0.9 V core (selectable Vcore) | — |
| 工作溫度 | -40C to +100C (industrial) | Commercial (0C to +85C) |
| 安裝類型 | Surface Mount | Surface Mount |
| 封裝 / 外殼 | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Speed Grade | I4 (Industrial, mid-speed grade) | C2 |
| RoHS 狀態 | RoHS Compliant (lead-free) | Compliant |
| MSL 等級 | MSL 3 (168 Hours, per JEDEC J-STD-020) | — |
| Roaming Pin Name Suffix | LN = lead-free, industrial temp, H780 780-ball package | — |
| Logic Elements | — | 200,000 |
| Adaptive Logic Modules (ALMs) | — | 80,000 |
| User I/O Count | — | 488 |
| Embedded Memory Bits | — | 10,901,504 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 800 MHz |
| Transceivers | — | Per family capability - not specified for this OPN |
| 封裝 | — | 780-ball HBGA / FCBGA |
| Package Code | — | PBGA780 / HBGA-780 |
| Lead Free | — | Yes |