EP3SL50F484C3G vs EP3SL50F484C4LG 比較

詳細並排比較 EP3SL50F484C3G 由 Intel 與 EP3SL50F484C4LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL50F484C3G EP3SL50F484C4LG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Stratix III L FPGA - Field Programmable Gate Array
Logic Elements (LE) 47,500 —
Embedded Memory Bits 2,184,192 —
User I/O Pins 296 —
封裝 484-FBGA (FCBGA), 23x23 mm 484-FBGA (23x23 mm)
Process Node 40 nm 40 nm
DSP Blocks (18x18 multipliers) 384 —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] —
PLLs [DATA_NEEDED: PLL count] —
PCIe Hard IP [DATA_NEEDED: PCIe hard IP version] —
Operating Temperature Grade Commercial (C3 speed grade, 0C to 85C) —
Speed Grade C3 C4 (commercial, slowest)
Supply Voltage Core [DATA_NEEDED: VCC/VCCINT nominal] —
安裝類型 Surface Mount (BGA) —
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
無鹵素 [DATA_NEEDED: halogen-free status] —
Series — Stratix III L
Number of Logic Elements (LE) — 47500
Number of LABs/CLBs — 1900
Adaptive Logic Modules (ALM) — 19000 ALM
Total Embedded Memory — 2184192 bit (2.08 Mbit)
Number of I/O — 296
供應電壓 — 0.86 V to 1.15 V (1.1 V typical)
工作溫度 — 0 C to +85 C (TJ)
安裝方式 — SMD/SMT
封裝 / 外殼 — 484-BBGA, FCBGA
Packaging — Tray
Supplier Device Package — 484-FBGA

資料表與資源

瀏覽所有產品 建立 BOM 索取報價