EPF10K100GC503-3 vs EPF10K100BFC256-3 比較
詳細並排比較 EPF10K100GC503-3 由 Intel 與 EPF10K100BFC256-3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K100GC503-3 - FLEX 10K 100K Gates FPGA 503-Pin CPGA | Intel (Altera)
EPF10K100GC503-3 Obsolete規格比較
| 參數 | EPF10K100GC503-3 | EPF10K100BFC256-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | FLEX 10K | FLEX 10KE |
| Series | FLEX 10KA | — |
| Typical Gate Count | 100,000 gates | — |
| Logic Cells / Logic Elements | 4,992 cells | — |
| Maximum Operating Frequency | 125 MHz | 200 MHz |
| Process Technology | 0.42 um CMOS | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 3.3 V | 2.5 V (range 2.3 V to 2.7 V) |
| I/O Supply Voltage | 5 V tolerant | — |
| Package Type | 503-pin CPGA (Ceramic Pin Grid Array) | — |
| User I/O Pins | [DATA_NEEDED: exact user I/O count per datasheet pinout] | — |
| Embedded Array Blocks (EABs) | 12 EABs per row | 12 |
| EAB Memory Size | 2,048 bits per EAB | — |
| Logic Array Blocks (LABs) | 16 LEs per LAB | — |
| Configuration Method | Passive Serial / Passive Parallel / Active Serial, JTAG IEEE 1149.1 | SRAM, requires external config device |
| 工作溫度 | -40C to +85C (industrial) | — |
| RoHS 狀態 | Non-Compliant (CPGA, military/legacy) | [DATA_NEEDED: RoHS status] |
| Speed Grade | -3 | -3 |
| Typical Gates | — | 100,000 |
| Logic Elements (LEs) | — | 4,992 |
| Total RAM Bits | — | 24,576 |
| 封裝 | — | 256-pin FineLine BGA (FBGA) |
| User I/O Pins (max) | — | [DATA_NEEDED: exact user I/O count for BFC256 package] |
| 工作溫度範圍 | — | 0 °C to 70 °C |
| JTAG Boundary Scan | — | IEEE Std. 1149.1-1990 compliant |
| PCI Compliance | — | PCI Local Bus Spec Rev. 2.2 (3.3 V, -3 speed grade) |
| 安裝類型 | — | Surface Mount (BGA) |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |