EPF10K200EBC600-2 vs EPF10K200EGC599-2 比較
詳細並排比較 EPF10K200EBC600-2 由 Intel 與 EPF10K200EGC599-2 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPF10K200EBC600-2 | EPF10K200EGC599-2 |
|---|---|---|
| 品牌 | Intel | Altera |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | FLEX-10KE | FLEX 10KE |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | — |
| 供應電壓 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作溫度 | 0°C to +70°C (Commercial) | — |
| 安裝類型 | Surface Mount | Through Hole |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 狀態 | unknown | Non-compliant (lead-bearing CPGA) |
| Family | — | FLEX 10KE |
| Logic Elements | — | 9984 |
| Total RAM Bits | — | 98304 |
| Number of I/O | — | 470 |
| Number of Logic Gates | — | 200000 |
| Supply Voltage - Core | — | 2.375 V to 2.625 V |
| Pin-to-Pin Logic Delay | — | 0.6 ns |
| 封裝 / 外殼 | — | 599-BCPGA (62.48 x 62.48 mm) |
| Supplier Device Package | — | 599-CPGA |
| Operating Temperature Grade | — | Commercial |
| Technology / Process | — | CMOS, SRAM-based configuration |
| Programmability Type | — | SRAM (in-system reconfigurable) |
| Configuration Interface | — | JTAG (IEEE 1149.1) / EPC serial |