EPF10K250EFI672-3 vs EPF10K250EFC672-3 比較
詳細並排比較 EPF10K250EFI672-3 由 Intel 與 EPF10K250EFC672-3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPF10K250EFI672-3 | EPF10K250EFC672-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 250,000 | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| User I/O Pins | 470 | 470 |
| Embedded Array Blocks (EABs) | 12 | — |
| EAB Dual-Port Width | Up to 16-bit | — |
| Maximum EAB Memory | [DATA_NEEDED: bits per EAB] | — |
| Propagation Delay (tpd) | 0.4 ns (typical, -3 speed grade) | — |
| Core Supply Voltage | 2.5 V | 2.5 V |
| I/O Supply Voltage | 2.5 V / 3.3 V (multiVolt I/O) | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 封裝 | 672-ball FineLine BGA, 1.27 mm pitch | 672-ball FineLine BGA (FC) |
| Process Technology | CMOS, SRAM-based configuration | 0.25 um CMOS, 5-layer metal |
| Configuration Interface | JTAG / ByteBlaster (EPC2/EPC8 PROM) | — |
| 工作溫度 | 0 °C to 70 °C (commercial) | — |
| Design Entry | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog | — |
| RoHS 狀態 | Unknown (legacy Altera non-RoHS device) | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Commercial (0C to +70C) |
| Ball Pitch | — | 1.0 mm |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| 安裝類型 | — | Surface Mount |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |