H5AN8G8NCJR-RDC vs MT40A1G8AG-062E 比較

詳細並排比較 H5AN8G8NCJR-RDC 由 SK hynix 與 MT40A1G8AG-062E 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN8G8NCJR-RDC H5AN8G8NCJR-RDC - 8Gb DDR4 SDRAM x8 2666Mbps | SK Hynix

H5AN8G8NCJR-RDC - 8Gb DDR4 SDRAM x8 2666Mbps | SK Hynix

H5AN8G8NCJR-RDC ✓ 啟用中
Micron Technology
MT40A1G8AG-062E MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E ✓ 啟用中

規格比較

參數 H5AN8G8NCJR-RDC MT40A1G8AG-062E
品牌 SK hynix Micron Technology
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb (1 GB) —
組織 x8 1G x 8
資料速率 up to 2666 Mbps —
供應電壓 1.2 V (VDD) —
介面 DDR4 (JEDEC standard) Parallel
Bank Architecture 4 bank groups x 4 banks —
Burst Length BL8 —
封裝 78-ball FBGA 78-FBGA (7.5 x 11 mm)
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度 [DATA_NEEDED: operating temperature range for -RDC suffix] —
CAS 延遲 [DATA_NEEDED: CAS latency for -RDC speed grade] —
Generation C-die family (NCJR) —
Lead Free Yes —
無鹵素 Yes —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
記憶體容量 — 8 Gbit
Clock Frequency — 1.6 GHz (DDR4-3200, 3200 MT/s data rate)
Clock Cycle Time — 19 ns class (-062E speed grade)
Supply Voltage (VDD) — 1.2 V
Temperature Grade — Automotive (AUT)
Access Time (CAS Latency class) — DDR4-3200 timing class (tAA per datasheet)
Bank Group Architecture — Yes (DDR4 bank groups)
Termination — On-Die Termination (ODT)
CA Parity — Supported (DDR4 command/address parity)
Packaging Option — Tape and Reel (TR / :R suffix)
工作溫度範圍 — [DATA_NEEDED: operating temperature range]
Refresh Rate — [DATA_NEEDED: refresh rate]

資料表與資源

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