H5ANAG8NBJR-RDC vs H5ANAG8NAMR-UHC 比較
詳細並排比較 H5ANAG8NBJR-RDC 由 SK hynix 與 H5ANAG8NAMR-UHC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | H5ANAG8NBJR-RDC | H5ANAG8NAMR-UHC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 類別 | DRAM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gbit |
| 組織 | 2G x 8 | 2G x 8 |
| Supply Voltage (VDD) | 1.2 V | — |
| I/O Voltage (VDDQ) | 1.2 V | — |
| 介面 | SSTL12 | Parallel, DDR4 |
| Speed Grade (suffix R) | DDR4-2666 class | — |
| 封裝 | 78-ball FBGA | FBGA-78 |
| 安裝類型 | Surface Mount | Surface Mount |
| Refresh | Self-refresh and auto-refresh (8K/64ms class per family datasheet) | Self-refresh and auto-refresh (DDR4) |
| Bank Groups | 4 (per 16Gb DDR4 family datasheet) | — |
| Data Strobe | DQS with read/write training | — |
| Data Bus Inversion | Supported (DBI) | — |
| CAS 延遲 | [DATA_NEEDED: CAS Latency] | — |
| 工作溫度 | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| RoHS 狀態 | Compliant (lead-free PBGA per family product data) | Compliant (lead-free FBGA package) |
| 生命週期狀態 | Active | — |
| Manufacturer | — | SK Hynix |
| 資料速率 | — | DDR4-2400 (2400 MT/s) |
| 供應電壓 | — | 1.2 V |
| Bank Group Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |
| Applications | — | Data storage, firmware boot, industrial controllers, computing modules |