K3KL5L50DM-BGCU vs K3LK4L40DM-BGCT 比較

詳細並排比較 K3KL5L50DM-BGCU 由 Samsung Electronics 與 K3LK4L40DM-BGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K3KL5L50DM-BGCU K3KL5L50DM-BGCU - LPDDR5X 128Gb 8533Mbps DRAM | Samsung

K3KL5L50DM-BGCU - LPDDR5X 128Gb 8533Mbps DRAM | Samsung

K3KL5L50DM-BGCU ✓ 啟用中
Samsung Electronics
K3LK4L40DM-BGCT K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT - Samsung DRAM Memory IC | Samsung Electronics

K3LK4L40DM-BGCT ✓ 啟用中

規格比較

參數 K3KL5L50DM-BGCU K3LK4L40DM-BGCT
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs DRAM
生命週期狀態 啟用中 啟用中
記憶體類型 LPDDR5X SDRAM DRAM (SDRAM component)
Density 128 Gb (16 GB) [DATA_NEEDED: Density]
資料速率 8533 Mbps per pin [DATA_NEEDED: Data Rate]
組織 [DATA_NEEDED: organization (x)] —
Supply Voltage (VDD) [DATA_NEEDED: VDD voltage] —
封裝 [DATA_NEEDED: package ball count / FBGA code] —
安裝類型 Surface Mount (BGA) Surface Mount
工作溫度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: Operating Temperature Range]
介面 LPDDR5X (JEDEC low-power DRAM interface) —
Prefetch 16n (LPDDR5/5X architecture) —
Power Efficiency approx. 20% better than LPDDR5 (per Samsung LPDDR5X family page) —
CAS 延遲 [DATA_NEEDED: CAS latency] [DATA_NEEDED: CAS Latency]
Refresh [DATA_NEEDED: refresh scheme] —
RoHS 狀態 unknown [DATA_NEEDED: RoHS Status]
Production Status In production (in stock at distributors) —
MSL 等級 [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: Moisture Sensitivity Level]
Manufacturer — Samsung Electronics
Organization (x-width) — [DATA_NEEDED: Organization]
Supply Voltage Class — [DATA_NEEDED: Supply Voltage]
Package Type — BGA (per -BGC ordering-code suffix)
Package Ball Count — [DATA_NEEDED: Ball Count]
Refresh Rate — [DATA_NEEDED: Refresh Interval]
Lead Free — [DATA_NEEDED: Lead-Free Status]
Packaging — Tape & Reel (per -T-style suffix convention) [DATA_NEEDED: confirmed packaging]

資料表與資源

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