K4RAH165VB-BIQK vs K4RAH165VB-BCQK 比較
詳細並排比較 K4RAH165VB-BIQK 由 Samsung Electronics 與 K4RAH165VB-BCQK 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4RAH165VB-BIQK | K4RAH165VB-BCQK |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gb | — |
| 組織 | 1G x 16 | — |
| 資料速率 | 4800 Mbps (MT/s) | 4800 Mbps |
| Supply Voltage (VDD) | 1.1 V | 1.1 V |
| On-Die ECC | Yes | — |
| Auto Self-Refresh | Yes | — |
| Asynchronous Reset | Yes | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| DLL Enabled Mode | Yes (spec mode per datasheet) | — |
| 封裝 | [DATA_NEEDED: exact package ball count / FBGA designation] | 106-ball FBGA |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| 品牌 | Samsung Semiconductor | — |
| 記憶體容量 | — | 16 Gb |
| Memory Organization | — | 1G x 16 |
| Memory Interface | — | Parallel |
| Error Correction | — | On-die ECC |
| 功能特色 | — | Auto self-refresh, asynchronous reset, on-chip ECC, write leveling, CRC, ZQ calibration |
| 安裝類型 | — | Surface Mount |
| Memory Format | — | DRAM (volatile) |
| Packaging | — | Tray |
| 生命週期狀態 | — | Active |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS status] |
| Unit Price | — | [DATA_NEEDED: unit price] |