K9F6408U0B vs K9PDG08U5M 比較

詳細並排比較 K9F6408U0B 由 Samsung Electronics 與 K9PDG08U5M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K9F6408U0B K9F6408U0B - 64Mbit 8M x8 NAND Flash 44-TSOP2 | Samsung

K9F6408U0B - 64Mbit 8M x8 NAND Flash 44-TSOP2 | Samsung

K9F6408U0B Obsolete
Samsung Electronics
K9PDG08U5M K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M - 4Gb x8 SLC NAND Flash 3.3V | Samsung Electronics

K9PDG08U5M ✗ 停產

規格比較

參數 K9F6408U0B K9PDG08U5M
品牌 Samsung Electronics Samsung Electronics
類別 Memory ICs EEPROM
生命週期狀態 Obsolete 停產終止
Memory Organization 8M x 8 bit (64Mbit) —
記憶體類型 NAND Flash NAND Flash (SLC)
Operating Voltage (VCC) 2.7 V to 3.6 V —
Access Time / Cycle Time 50 ns —
封裝 44-TSOP2 TSOP1-48
Page Size 528 bytes (512 data + 16 spare) [DATA_NEEDED: page size]
Block Size [DATA_NEEDED: block organization from datasheet] [DATA_NEEDED: block size]
Program/Erase Endurance 100K program/erase cycles —
介面 8-bit multiplexed command/address/data I/O —
Write Protect Yes (WP pin) —
Ready/Busy Output Yes (R/B open-drain) Yes (R/B, open-drain)
Operating Temperature (TCB0 grade) 0C to 70C —
Operating Temperature (TIB0 grade) -40C to 85C —
安裝類型 Surface Mount Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Production Status (per datasheet) Mass Production (legacy; now obsolete) —
Density — 4 Gbit
組織 — x8 (multiplexed I/O)
供應電壓 — [DATA_NEEDED: supply voltage range]
Page Read Time — [DATA_NEEDED: page read time]
Page Program Time — [DATA_NEEDED: page program time]
Block Erase Time — [DATA_NEEDED: block erase time]
Access Interface — Asynchronous multiplexed address/data, CLE/ALE control
Write Protect Pin — Yes (/WP)
工作溫度 — [DATA_NEEDED: operating temperature range]
Endurance — [DATA_NEEDED: program/erase cycles]

資料表與資源

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