LPC1833JBD144 vs LPC18S30FET256 比較
詳細並排比較 LPC1833JBD144 由 NXP Semiconductors 與 LPC18S30FET256 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
LPC1833JBD144 - 180MHz Cortex-M3 MCU, 512KB Flash, LQFP-144 | NXP
LPC1833JBD144 ✓ 啟用中NXP Semiconductors
LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP
LPC18S30FET256 ✓ 啟用中規格比較
| 參數 | LPC1833JBD144 | LPC18S30FET256 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core | ARM Cortex-M3 | — |
| Core Architecture | 32-bit | ARM Cortex-M3 |
| Maximum CPU Frequency | 180 MHz | — |
| Program Flash | 512 kB | — |
| SRAM | 136 kB | — |
| High-Speed USB 2.0 OTG | 2 (one with on-chip HS PHY) | — |
| Ethernet | 10/100 MAC (MII/RMII) | — |
| LCD Controller | Yes (STN/TFT) | — |
| External Memory Controller | Yes (up to 4 MB address space) | — |
| 供應電壓 | 2.4 V to 3.6 V | — |
| 工作溫度 | -40 C to +105 C | -40 C to +85 C |
| 封裝 | LQFP-144 (20 x 20 mm, 0.5 mm pitch) | 256-LBGA (17x17 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL 等級 | 3 (168 hours) | 3 |
| RoHS 狀態 | Compliant | Compliant |
| Core Width | — | 32-bit |
| 最大時脈頻率 | — | 180 MHz |
| On-chip SRAM | — | 200 kB |
| On-chip EEPROM | — | 4 kB |
| On-chip Flash | — | ROMless (external memory required) |
| Operating Voltage | — | 2.4 V to 3.6 V |
| HS-USB Controllers | — | 2 (one Host/Peripheral, one Host-only) |
| Ethernet MAC | — | 10/100 Mbps with MII/RMII |
| External Memory Controller (EMC) | — | Yes (SRAM/SDRAM/NOR/NAND) |
| SPIFI (Quad-SPI Flash Interface) | — | Yes |
| Hardware AES Decryption | — | Yes |
| GPIO Count | — | Up to 165 |
| UART / I2C / CAN / SSP | — | 4 / 3 / 2 / 2 |
| ADC | — | 10-bit, 8 channels |