LPC2368FBD100 vs LPC2364FET100 比較

詳細並排比較 LPC2368FBD100 由 NXP Semiconductors 與 LPC2364FET100 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
LPC2368FBD100 LPC2368FBD100 - ARM7 72MHz 512KB Flash MCU | NXP

LPC2368FBD100 - ARM7 72MHz 512KB Flash MCU | NXP

LPC2368FBD100 ✓ 啟用中
NXP Semiconductors
LPC2364FET100 LPC2364FET100 - ARM7 MCU 128kB Flash 72MHz | NXP TFBGA-100

LPC2364FET100 - ARM7 MCU 128kB Flash 72MHz | NXP TFBGA-100

LPC2364FET100 ✓ 啟用中

規格比較

參數 LPC2368FBD100 LPC2364FET100
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Architecture ARM7TDMI-S (16/32-bit) —
Maximum CPU Clock 72 MHz —
Flash Memory up to 512 kB —
SRAM up to 58 kB (32 kB battery-backed) —
Supply Voltage (Vdd) 3.0 V to 3.6 V —
I/O Voltage Tolerance 5 V tolerant —
Ethernet MAC 10/100 Mbps MII/RMII 10/100 Ethernet MAC integrated
USB Controller USB 2.0 Device/Host/OTG —
ADC 10-bit, 8-channel, 400 ksps 8 channels x 10-bit
DAC 10-bit 1 x 10-bit
CAN Channels 2 (CAN 2.0B) 2 (CAN 2.0B)
UART 4 4 (one with full modem control)
SSP/SPI 3 3
I2C 3 3
I2S 1 1
PWM 2 (Motor Control PWM) —
General-Purpose Timers 4 —
DMA Controller Yes (GPDMA) Yes (GPDMA)
External Memory Bus Yes (8/16/32-bit) —
封裝 LQFP-100 (14 x 14 mm, 0.5 mm pitch) 100-TFBGA (9x9 mm)
工作溫度 -40 C to +85 C -40 C to +85 C (industrial)
RoHS 狀態 Compliant Compliant
Core Processor — ARM7TDMI-S (16/32-bit)
最大時脈頻率 — 72 MHz
Program Memory Size — 128 kB (128K x 8) Flash
RAM Size — 34 kB SRAM
供應電壓 — 3.0 V to 3.6 V (3.3 V typ)
Number of I/O — 70
USB — USB 2.0 Full-Speed Device/Host/OTG
Timers — 4 general-purpose + 2 PWM
External Memory Controller — Yes (SRAM/Flash/ROM expansion)
安裝類型 — Surface Mount (BGA)

資料表與資源

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