LPC5526JBD64E vs LPC55S26JBD64E 比較
詳細並排比較 LPC5526JBD64E 由 NXP Semiconductors 與 LPC55S26JBD64E 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | LPC5526JBD64E | LPC55S26JBD64E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Processor | ARM Cortex-M33 (r0p3) | ARM Cortex-M33 (r0p3) |
| Core Size | 32-Bit | 32-bit |
| 最大時脈頻率 | 150 MHz | 150 MHz |
| Flash Memory | 256KB (256K x 8) | 256 KB |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Security Feature | ARM TrustZone | — |
| Memory Protection Unit | Yes (MPU) | — |
| Interrupt Controller | NVIC (built-in) | NVIC with NMI input (selectable sources) |
| NMI Input | Yes, with selection of sources | — |
| Process Technology | 40 nm NVM | 40 nm NVM |
| 供應電壓 | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| 工作溫度 | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| 封裝 | 64-HTQFP (10x10 mm) | 64-HTQFP (10 x 10 mm) |
| 安裝類型 | Surface Mount | Surface Mount |
| 濕度敏感等級 (MSL) | 3 | 3 |
| Peak Reflow Temperature | 260 C | 260 C |
| Max Time At Peak Reflow | 30 s | — |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| RoHS 狀態 | Compliant | — |
| 生命週期狀態 | Active | — |
| SRAM | — | 256 KB |
| Connectivity | — | USB HS, I2C, SPI, UART/USART, I2S, SDIO |
| Peripherals | — | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor |
| ADC Resolution | — | 16 bit |
| ADC Conversion Rate | — | 1.0 Msamples/sec |
| Security Features | — | AES, PUF, SHA, CRC, RNG |
| Memory Protection | — | MPU (Memory Protection Unit) |