LPC55S26JBD64E - 150MHz Cortex-M33 MCU 256KB Flash | NXP
MPN： LPC55S26JBD64E ✓ 啟用中LPC55S26JBD64E 概覽
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals onto one die, sitting at the center of embedded system hierarchies: microcontroller -> embedded processor -> system-on-chip -> semiconductor device. The LPC552x/S2x family belongs to the broader LPC5500 MCU series within NXP's EdgeVerse edge computing platform, and was the world's first general-purpose Cortex-M33-based MCU series, offered on a cost-effective 40-nm NVM process technology.
Key features of the LPC55S26 include the Arm Cortex-M33 core (r0p3) with a Memory Protection Unit (MPU), a built-in Nested Vectored Interrupt Controller (NVIC), and a non-maskable interrupt (NMI) input with selectable sources. The device integrates CASPER hardware cryptography co-processor, USB high-speed (USB HS), FlexComm serial interfaces, SDIO, 32-bit counter/timers, SCTimer/PWM, a Programmable Logic Unit (PLU), a 16-bit 1.0 Msamples/sec ADC, analog comparators, and an on-chip temperature sensor. Security is addressed through AES, PUF, SHA, CRC, and a true random number generator (RNG).
Architecturally, the FlexComm concept lets each serial block be configured as USART, SPI, I2C, or I2S, maximizing pin flexibility on the 64-pin package. The PLU allows combinational-logic custom peripherals without CPU load, a distinctive advantage over conventional MCUs.
Typical applications include industrial IoT nodes, general embedded control, secure connected devices, and motor-control or sensing front ends that leverage the 1 Msps ADC and PWM timers.
Design consideration: verify power sequencing and configure the FlexComm muxes early in firmware, since pin functions default per the UM at reset and the secure boot chain (PUF/AES) must be provisioned before locking the flash.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 LPC55S26JBD64E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LPC55S26JBD64E （相同外形與佔位） — 差異在於 Core Processor, Interrupt Controller, Package, Flash Memory, RoHS Status.
LPC55S28JBD64E
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →LPC5526JBD64
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC5528JBD64
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC55S16JBD64
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC55S06JBD64
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC55S26JBD64E 最大額定值與電氣特性
| Core Processor | ARM Cortex-M33 (r0p3) |
| Core Size | 32-bit |
| 最大時脈頻率 | 150 MHz |
| Flash Memory | 256 KB |
| SRAM | 256 KB |
| Connectivity | USB HS, I2C, SPI, UART/USART, I2S, SDIO |
| Peripherals | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor |
| ADC Resolution | 16 bit |
| ADC Conversion Rate | 1.0 Msamples/sec |
| Security Features | AES, PUF, SHA, CRC, RNG |
| Interrupt Controller | NVIC with NMI input (selectable sources) |
| Memory Protection | MPU (Memory Protection Unit) |
| 封裝 | 64-HTQFP (10 x 10 mm) |
| 安裝類型 | Surface Mount |
| Process Technology | 40 nm NVM |
| Peak Reflow Temperature | 260 C |
| 濕度敏感等級 (MSL) | 3 |
| Terminal Finish | Tin (JESD-609 code e3) |
LPC55S26JBD64E 64-htqfp (10 x 10 mm) 腳位配置指南
LPC55S26JBD64E（64-htqfp (10 x 10 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LPC55S26JBD64E.
請參閱 資料表 以查看完整腳位配置。
典型應用
LPC55S26JBD64E 適用於 6 應用s: Industrial IoT Nodes, Secure Connected Devices, USB High-Speed Peripherals, Motor Control and Power Conversion, Data Logging with SD Card Storage, General Embedded Control.
Industrial IoT Nodes
The LPC55S26JBD64E fits industrial IoT edge nodes because its 150 MHz Cortex-M33 core handles protocol stacks and local analytics while the PUF, AES, SHA, and RNG hardware establish device identity without a separate secure element, cutting bill-of-materials cost. The 256 KB flash / 256 KB SRAM balance accommodates MQTT or OPC UA clients plus buffers, and the FlexComm interface muxes adapt each serial port to the fieldbus in use. Power consumption can be managed through low-power modes for battery-backed sensors, while the 1.0 Msps 16-bit ADC captures analog process signals directly. Nodes benefit from OTA update capability secured by the on-chip crypto chain.
推薦
Secure Connected Devices
Security-centric products such as smart locks, payment accessories, and authenticated sensors exploit the LPC55S26's hardware trust anchor. The Physically Unclonable Function (PUF) generates device-unique keys without storing them in flash, AES and SHA accelerators encrypt communications, and the CASPER co-processor offloads asymmetric operations from the 150 MHz Cortex-M33, keeping latency low. The true random number generator supplies entropy for key generation and secure boot. With 256 KB flash, firmware plus crypto libraries fit comfortably, and the NXP secure boot workflow provisions keys before flash locking. This eliminates an external TPM in many designs, reducing PCB area and cost.
推薦
USB High-Speed Peripherals
The integrated USB HS (480 Mbps) controller makes the LPC55S26JBD64E a strong host or device MCU for data-acquisition pods, debug probes, and industrial analyzers. Streaming at high speed requires buffer depth, and the 256 KB SRAM supports multi-packet FIFOs without external memory. The 1.0 Msps 16-bit ADC can feed USB isochronous streams directly, while the DMA engine offloads transfers from the 150 MHz core. Compared with designs that pair a fast MCU with a separate USB bridge chip, this single-chip approach reduces latency and board complexity. FlexComm ports then handle SPI/UART links to sensors or FPGAs under test.
推薦
Motor Control and Power Conversion
Motor-control applications leverage the SCTimer/PWM, which generates complex multi-channel PWM waveforms with hardware-level coordination, plus the 16-bit 1.0 Msamples/sec ADC for current- and voltage-sense sampling synchronized to the PWM cycle. The 150 MHz Cortex-M33 executes field-oriented control loops with headroom, and the analog comparators provide fast overcurrent trip paths independent of software. The PLU can implement custom gating between PWM and fault inputs without CPU intervention. For industrial drives, servo stages, and BLDC pumps, the LPC55S26 combines adequate DSP capability (M33F with FPU) with deterministic peripherals in a single 64-HTQFP package.
推薦
Data Logging with SD Card Storage
The native SDIO controller distinguishes the LPC55S26 from many competing Cortex-M33 MCUs, enabling direct SD-card interfacing without bit-banging on GPIO. Combined with the 256 KB SRAM, the device buffers multi-sector writes from the 1.0 Msps ADC or from FlexComm-connected sensors and flushes them at SD bus speed, sustaining reliable high-rate logging. The SCTimer can timestamp samples in hardware, and the CRC engine accelerates file-system integrity checks. Applications include energy meters, environmental monitors, and vehicle data recorders. The on-chip temperature sensor supports self-diagnostic logging, and secure storage can layer AES encryption over logged files.
推薦
General Embedded Control
For general-purpose embedded control products - HVAC controllers, vending machines, lighting systems, and test fixtures - the LPC55S26JBD64E offers a mainstream balance of performance and integration. The 150 MHz core outpaces legacy 32-bit MCUs while the FlexComm architecture provides up to eight serial ports configurable as UART, SPI, I2C, or I2S, matching heterogeneous peripheral mixes typical of commercial equipment. The PLU lets designers create small custom logic functions, replacing 74xx glue logic and reducing external component count. The 64-HTQFP's 10 x 10 mm footprint and 0.5 mm pitch support hand-solderable prototyping, and family pin compatibility eases future memory upgrades.
推薦
推薦產品摘要
工程參考資料，適用於 LPC55S26JBD64E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LPC55S28JBD64E | LPC5526JBD64 | LPC5528JBD64 | LPC55S16JBD64 | LPC55S06JBD64 |
|---|---|---|---|---|---|---|
| Package | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same | 64-HTQFP (10 x 10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Max Frequency | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz | Cortex-M33 / 150 MHz |
| Hardware Security (CASPER/PUF/AES/SHA/RNG) | Yes | Yes | No | No | Yes | Yes |
主要差異化特點
- Hardware security suite at mainstream price (對比LPC5526JBD64)
- Cost-optimized within the S2x secure family (對比LPC55S28JBD64E)
- Native SDIO controller (對比LPC55S16JBD64)
設計說明
The LPC55S26JBD64E requires regulated core and I/O supplies per the NXP power architecture in the LPC55S2x datasheet; follow the recommended decoupling network (bulk plus per-pin 100 nF ceramics placed at each VDD pair). Power-up sequencing between supply rails must match the datasheet order, or internal isolation diodes can conduct unintentionally. Use a low-noise 3.3 V LDO such as an XC6209-class part for clean ADC reference behavior, and add a dedicated LC filter toward VDDA if the 1.0 Msps ADC accuracy matters.
The 64-HTQFP (10 x 10 mm, 0.5 mm pitch) lands on a standard 64-QFP footprint; use a thermal pad-free layout with generous ground pour on both layers. Route the USB HS pair as 90-ohm differential impedance with length matching within 0.5 mm and place 100 nF at each FlexComm supply pin. Keep the SDIO bus under 50 mm and add 33-ohm series resistors if traces are long. Mark pin 1 clearly - the HTQFP uses the chamfered corner convention.
FlexComm pins are multiplexed and default to specific functions at reset; verify the pin function table before committing routes, since two peripherals cannot share a FlexComm instance. Also, security features (PUF/AES) require provisioning the CMPA (Customer Manufacturing Program Area) during production - locking flash before key provisioning permanently disables secure boot. Finally, the MSL 3 rating means the tray must be baked if exposed beyond its 168-hour floor-life before reflow (260 C peak).
合規資訊
JESD-609 terminal finish code e3 (tin), peak reflow 260 C, MSL 3 per distributor data (Vyrian). Formal REACH/conflict-minerals declarations available from NXP product page.
