M1AFS1500-1FGG484 vs M1AFS1500-2FG676I 比較

詳細並排比較 M1AFS1500-1FGG484 由 Microchip Technology 與 M1AFS1500-2FG676I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M1AFS1500-1FGG484 M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip

M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip

M1AFS1500-1FGG484 ✓ 啟用中
Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ 啟用中

規格比較

參數 M1AFS1500-1FGG484 M1AFS1500-2FG676I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Fusion Mixed-Signal FPGA (M1 series) Fusion (Mixed-Signal Flash FPGA)
System Gates 1,500,000 1.5 M
Logic Cells 38,400 —
User I/O 223 —
Flash Memory 276,480 bits —
Embedded Processor ARM Cortex-M1 —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm flash-based 130 nm CMOS
最大時脈頻率 350 MHz —
封裝 484-ball FBGA (FGG484) 676-ball FBGA (FG676)
安裝類型 Surface Mount Surface Mount
Terminal Form Ball (BGA), square package —
Configuration Memory Non-volatile on-chip flash On-chip flash (non-volatile, instant-on)
Analog Blocks Configurable analog (ADC, voltage/current monitors) —
Clock Management CCC with integrated PLLs —
工作溫度 [DATA_NEEDED: operating temperature range] —
Packaging Tray —
RoHS 狀態 [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead)
Speed Grade — 2
工作溫度範圍 — Industrial (I suffix) -40C to +100C
Embedded Analog Features — On-chip ADC, clock conditioning circuit (CCC), power-on reset
External Configuration Device — Not required
Lead Free Status — Contains Lead
Packaging Method — Tray
Number of User I/O — [DATA_NEEDED: Number of User I/O]
Embedded SRAM — [DATA_NEEDED: Embedded SRAM capacity]
DLL/PLL Blocks — [DATA_NEEDED: Number of CCC blocks]

資料表與資源

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