M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
MPN： M7AFS600-2FGG256I ✓ 啟用中M7AFS600-2FGG256I 概覽
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks connected by programmable interconnects that designers reconfigure after manufacturing. The Fusion family extends this concept into the mixed-signal domain by integrating programmable analog peripherals and flash-based configuration memory onto one die, positioning it above simple CPLDs and alongside full SoC solutions in the programmable-logic hierarchy.
Key features include nonvolatile flash-based configuration that retains the program when powered off and enables Live at Power-Up (LAPU) operation, a 130-nm seven-layer-metal flash-based CMOS process, and single-chip integration that removes external configuration PROMs from the bill of materials. The device supports 350 MHz system performance and can host the ARM CoreMP7 soft processor for embedded control.
Architecturally, the Fusion fabric combines flash switch technology with programmable analog blocks such as voltage, temperature, and current monitoring channels, allowing analog supervisory functions and digital logic to reside on one die. This reduces board area and improves system reliability versus discrete MCU-plus-CPLD solutions.
Typical applications include industrial automation and motor control, power-supply supervision and telemetry, portable instrumentation, and aerospace/defense systems requiring instant-on, high-reliability programmable logic.
A key design consideration is the 1.5 V core supply: sequence the power rails and provide adequate decoupling near the FBGA balls, since flash-programming and core currents concentrate on dedicated power balls.
This page synthesizes distributor pricing, same-family drop-in speed-grade and temperature-grade alternatives, and practical design notes not consolidated in the manufacturer datasheet.
直接替換替代品，適用於 M7AFS600-2FGG256I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： M7AFS600-2FGG256I （相同外形與佔位） — 差異在於 Package, Process Technology, Family, System Gates, Operating Temperature.
M7AFS600-2FGG256
✅ 直接替換聯絡詢價
查看資料表 →M7AFS600-1FGG256I
✅ 直接替換聯絡詢價
查看資料表 →M7AFS600-FGG256I
✅ 直接替換聯絡詢價
查看資料表 →M7AFS600-1FG256I
✅ 直接替換聯絡詢價
查看資料表 →M7AFS600-2FG256
✅ 直接替換聯絡詢價
查看資料表 →M7AFS600-2FGG256I 最大額定值與電氣特性
| Family | Fusion Mixed-Signal FPGA (Actel/Microchip) |
| System Gates | 600000 |
| User I/O | 119 |
| Flash Memory Blocks | 110592 bits |
| Processor Support | ARM CoreMP7 |
| Process Technology | 130 nm, 7-layer metal, flash-based CMOS |
| System Performance | 350 MHz |
| 供應電壓 | 1.5 V (core) |
| Logic Family | CMOS |
| Configuration | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) |
| 封裝 | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Number of Pins/Balls | 256 |
| 工作溫度 | 0 to 70 C |
| Speed Grade | -2 |
| 安裝類型 | Surface Mount |
| Packaging | Tray |
M7AFS600-2FGG256I 256-lbga (fbga-256), 1.0 mm ball pitch 腳位配置指南
M7AFS600-2FGG256I（256-lbga (fbga-256), 1.0 mm ball pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： M7AFS600-2FGG256I.
請參閱 資料表 以查看完整腳位配置。
典型應用
M7AFS600-2FGG256I 適用於 6 應用s: Industrial Automation and Motor Control, Power Supply Supervision and Telemetry, Aerospace and Defense Systems, Portable Instrumentation, Medical Diagnostic Equipment, Embedded Communication and Networking Nodes.
Industrial Automation and Motor Control
The M7AFS600-2FGG256I fits industrial control because its 600K system gates integrate sequencer, PWM, and communication logic while the ARM CoreMP7 soft processor handles protocol stacks. Fusion's integrated analog monitoring channels track motor current and voltage in real time without an external ADC supervisor, and the nonvolatile flash configuration means the controller is Live at Power-Up - no boot delay for safety-interlocked machinery. The industrial-grade I suffix supports harsh factory-floor temperatures. Placed as the single-chip control element, it removes a discrete microcontroller plus CPLD pair, saving board area; the trade-off is 1.5 V core rail sequencing care in noisy inverter environments.
推薦
Power Supply Supervision and Telemetry
Fusion's defining feature is on-die programmable analog: voltage, temperature, and current monitoring gates that make the M7AFS600-2FGG256I a natural power-system supervisor. It can watch multiple rails with built-in comparators and thresholds, log faults into flash, and shut down systems via its 119 user I/O - all in one chip. Because configuration is nonvolatile with LAPU, supervision is active before an external microcontroller finishes booting, closing the classic cold-start protection gap. The 350 MHz fabric performance handles fast fault-response logic. Design consideration: analog channel accuracy depends on clean reference decoupling at the FBGA power balls.
推薦
Aerospace and Defense Systems
Flash-based FPGAs are favored in aerospace because they are inherently single-chip, configuration-store-free, and resistant to configuration upsets compared with SRAM fabrics. The M7AFS600-2FGG256I's 600K gates handle glue logic, bus interfaces, and payload processing, while the ARM CoreMP7 hosts mission control software. Live-at-Power-Up operation suits time-critical avionics startup sequences, and the compact 256-ball FBGA (1.0 mm pitch) saves board area in conformally-cooled modules. Engineers should derate for radiation and temperature per program requirements and confirm screening levels, since standard commercial screening differs from MIL-flow parts.
推薦
Portable Instrumentation
Battery-powered instruments benefit from the M7AFS600-2FGG256I's nonvolatile architecture: no configuration current or boot energy is spent at turn-on, and flash retains calibration data and firmware through power cycles. The integrated analog channels replace a discrete supervisory ADC, while 600K gates implement DSP pre-processing for sensor arrays. The 256-ball FBGA at 1.0 mm pitch fits dense handheld PCBs. A key advantage over SRAM FPGAs is the elimination of the configuration PROM's standby draw; the consideration is that the 1.5 V core plus I/O rails should be generated by high-efficiency step-down converters to maximize battery life.
推薦
Medical Diagnostic Equipment
In medical devices such as bedside monitors and portable diagnostics, the M7AFS600-2FGG256I combines sensor-front-end logic, ARM CoreMP7 control, and on-die voltage/temperature supervision to meet single-chip reliability goals. Live-at-Power-Up configuration guarantees the device is functional the moment power appears - important for alarm-path integrity. Flash retention preserves patient calibration data across power events, and the mixed-signal fabric digitizes analog health parameters without an external converter for basic monitoring. Compliance-focused designs should verify the exact RoHS/material certificates for this suffix and follow the manufacturer's clinical-grade design guidance in the Fusion datasheet.
推薦
Embedded Communication and Networking Nodes
The 350 MHz fabric performance and CoreMP7 processor let the M7AFS600-2FGG256I implement UART/SPI/I2C concentrates, industrial Ethernet pre-processing, and backplane glue logic in compact networked nodes. Nonvolatile configuration eliminates the boot-time window during which an SRAM FPGA is offline - valuable in redundant systems requiring instant failover. The 119 user I/O cover multi-bank mixed-voltage interfacing on a single 256-ball FBGA. Design consideration: implement clean I/O bank power islands at 1.0 mm pitch breakout, and use the on-die flash to store node addresses and configuration for field re-provisioning via the JTAG or programming interface.
推薦
推薦產品摘要
工程參考資料，適用於 M7AFS600-2FGG256I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | M7AFS600-2FGG256 | M7AFS600-1FGG256I | M7AFS600-FGG256I | M7AFS600-1FG256I |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-LBGA (FGG256), 1.0 mm pitch | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FG256) - same footprint, Pb-free ball |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | -2 (fastest) | -2 | -1 | Standard | -1 |
| Temperature Grade | Industrial (I suffix) | Commercial | Industrial | Industrial | Industrial |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Processor Support | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
| Configuration | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU | Nonvolatile flash, LAPU |
主要差異化特點
- Fastest -2 speed grade in the FGG256 industrial family (對比M7AFS600-1FGG256I)
- Nonvolatile flash configuration with Live at Power-Up (對比SRAM FPGAs (e.g. Spartan-6 class))
- Industrial temperature qualification (對比M7AFS600-2FGG256)
- Single-chip mixed-signal integration (對比Any cross-brand FPGA)
設計說明
The M7AFS600-2FGG256I core runs from 1.5 V; estimated rail sequencing should bring core and I/O supplies up per the Fusion datasheet power-up guidance to avoid latch-up during flash read at power-on. Because configuration is nonvolatile, no external PROM rail is needed, simplifying the power tree. Estimated: budget core current from the datasheet power calculator in Libero SoC using your actual toggle rates rather than worst-case family numbers, which can overestimate by 2x.
The 1.0 mm ball pitch FBGA-256 requires via-in-pad or dog-bone breakout; plan a 4+ layer stack with dedicated 1.5 V core and I/O bank planes. Place 0.1 uF ceramic decoupling capacitors within 2 mm of power balls, one per power pair, plus bulk 10 uF per rail. Fan out signal balls on 4-mil trace/4-mil space to escape the array without wasting layers.
Do not substitute across speed grades (-1 vs -2) without re-running static timing analysis in Libero SoC - the Fabric timing closure that passes at -2 may fail at -1. Also, analog monitoring channel accuracy on Fusion depends on reference decoupling; omitting the recommended reference capacitor network degrades voltage-monitor accuracy. Finally, confirm the temperature grade suffix matches your environment: the commercial-grade FG256 parts are not characterized for industrial extremes.
合規資訊
RoHS/lead-free status for this exact suffix was not stated in the provided verified data; Microchip legacy FG vs FGG suffix conventions differ within the Fusion family. Obtain the material declaration from the Microchip product page or distributor compliance certificate.
