MC9S12XDT256CAG vs MC9S12XDT256MAA 比較

詳細並排比較 MC9S12XDT256CAG 由 NXP Semiconductors 與 MC9S12XDT256MAA 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12XDT256CAG MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG - 16-bit HCS12X MCU, 256KB Flash, 144-LQFP | NXP

MC9S12XDT256CAG ⚠ 最後購買機會
NXP Semiconductors
MC9S12XDT256MAA MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256MAA Nrnd

規格比較

參數 MC9S12XDT256CAG MC9S12XDT256MAA
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 NRND
Core HCS12X (16-bit CISC with XGATE co-processor) —
Program Memory 256 KB Flash —
RAM 16 KB —
EEPROM 4 KB —
Maximum CPU Frequency 80 MHz —
Supply Voltage - Core 2.35 V to 2.75 V —
Supply Voltage - I/O 4.5 V to 5.5 V —
I/O Pins 119 —
工作溫度 -40C to +85C —
封裝 144-pin LQFP (20x20 mm) 80-QFP (14x14 mm)
CAN Controllers (MSCAN) 5 (CAN 2.0 A/B) —
SCI / SPI Yes —
ADC 16-channel, 10-bit —
PWM Channels 8 —
Timers ECT (Enhanced Capture Timer) —
安裝類型 Surface Mount Surface Mount
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Debug Interface BDM (Background Debug Mode) —
生命週期狀態 No Longer Manufactured (per NXP product page) —
Core Processor — HCS12X
Core Size — 16-Bit
Core Architecture — CISC
Maximum Clock Speed — 80 MHz
Program Memory Size — 256KB (256K x 8)
Program Memory Type — FLASH
RAM Size — 16KB
供應電壓 — 2.5V/5V
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
Terminal Form — Gull Wing
Packaging — Tray
Temperature Grade — Automotive
Part Status — NRND (Not Recommended for New Designs)
工作溫度範圍 — [DATA_NEEDED: operating temperature range]

資料表與資源

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