MPC8543VTANGD vs MPC8547EVTATGD 比較

詳細並排比較 MPC8543VTANGD 由 NXP Semiconductors 與 MPC8547EVTATGD 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8543VTANGD MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD - PowerQUICC III SoC 800MHz | NXP | Embedded

MPC8543VTANGD ✓ 啟用中
NXP Semiconductors
MPC8547EVTATGD MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD - PowerPC e500 MPU 1.2GHz 783-FCPBGA | NXP

MPC8547EVTATGD Obsolete

規格比較

參數 MPC8543VTANGD MPC8547EVTATGD
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 Obsolete
Manufacturer NXP Semiconductors (Freescale) —
Series PowerQUICC III MPC85xx (PowerQUICC III)
Core Processor PowerPC e500 PowerPC e500
Number of Cores 1 1
Core Architecture Power Architecture, 7-stage pipeline, dual-issue superscalar —
Core Speed 800 MHz —
Bus Width 32-bit —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB [DATA_NEEDED: confirm from datasheet]
Memory Controller DDR2 SDRAM with ECC, up to 533 MHz data rate —
Ethernet MACs 4x Gigabit (SGMII/RGMII) —
PCI Express 2x PCIe interfaces —
Serial RapidIO 2x SRIO endpoints —
PCI/PCI-X 1x 32-bit PCI/PCI-X interface —
工作溫度 0 °C to +105 °C 0C to +105C (industrial grade per -TGD suffix)
Core Voltage 1.0 V (typical) 1.0 V (typ) [DATA_NEEDED: confirm from datasheet Vdd table]
I/O Voltages 1.8 V / 2.5 V / 3.3 V 1.8V / 2.5V / 3.3V
Process Technology 90 nm CMOS 0.09 um CMOS
Package Type FCBGA-783 (29x29 mm) —
安裝類型 Surface Mount (BGA) Surface Mount
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant [DATA_NEEDED: confirm via NXP product page]
Core Width — 32-Bit
Core Frequency — 1.2 GHz
Co-Processors / DSP — Signal Processing Engine (SPE); Security Engine (SEC 3.x)
L1 Cache (I/D) — 32 KB / 32 KB per core [DATA_NEEDED: per datasheet table]
RAM Controllers — DDR, DDR2, SDRAM
Graphics Acceleration — No
Display & Interface Controllers — None integrated
Ethernet — 4 x 10/100/1000 Mbps (GigE)
PCI / PCIe / SRIO — PCI, PCI-X, 2 x PCIe, 2 x Serial RapidIO
Other I/O — Local bus, I2C, DUART, GPIO, USB 2.0, SPI
Operating Temperature Range per DigiKey — -40C to +105C (DigiKey listing) [DATA_NEEDED: confirm]
封裝 / 外殼 — 783-BBGA, FCBGA (29 x 29 mm)
Part Status — Obsolete

資料表與資源

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