MPC8572CLVTAULD vs MPC8572ECPXAULD 比較
詳細並排比較 MPC8572CLVTAULD 由 NXP Semiconductors 與 MPC8572ECPXAULD 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP
MPC8572ECPXAULD Nrnd規格比較
| 參數 | MPC8572CLVTAULD | MPC8572ECPXAULD |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | NRND |
| Core Architecture | PowerPC e500 (dual-core) | — |
| Maximum Core Frequency | 1.333 GHz | — |
| Data Width | 32-bit | — |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache (shared) | 1 MB | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Operating Voltage | 1.0V / 1.5V / 2.5V / 3.3V | — |
| Ethernet Controllers | 4x eTSEC (Gigabit) | 4 x 10/100/1000 Mbps tri-speed MACs with SerDes |
| Memory Controller | DDR2/DDR3 | DDR2 / DDR3 with ECC |
| High-Speed Serial Interfaces | PCI Express, RapidIO, Serial RapidIO | — |
| QUICC Engine | Yes (protocol offload) | — |
| Security Engine | Integrated (IPsec, SEC 2.0) | — |
| 封裝 | 1023-ball FCBGA (33x33 mm) | — |
| 工作溫度 | -40C to +105C (extended) | — |
| 安裝類型 | Surface Mount (BGA) | — |
| RoHS 狀態 | Compliant (per datasheet Rev 2.1 CSM PBFREE) | Compliant (data-needs verification at supplier page) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Family | — | PowerQUICC III (MPC85xx) |
| Processor Core | — | PowerPC e500 (dual-core) |
| Core Count | — | 2 |
| 資料匯流排寬度 | — | 32-bit |
| 最大時脈頻率 | — | 1.333 GHz |
| 工作電源電壓 | — | 1.1 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Package Type | — | 1023-ball FCBGA (33 x 33 mm) |
| 安裝方式 | — | Surface Mount (BGA) |
| Instruction Set | — | PowerISA 32-bit |
| L2 Cache | — | 512 KB (shared) |
| 工作溫度範圍 | — | Industrial (TBD) [DATA_NEEDED: exact -40C/+85C confirmation] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |