MPC860DPZQ66D4 vs MPC860PCVR66D4 比較
詳細並排比較 MPC860DPZQ66D4 由 NXP Semiconductors 與 MPC860PCVR66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC860DPZQ66D4 | MPC860PCVR66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 停產終止 |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | — |
| Core | 1 Core, 32-Bit PowerPC | — |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| 封裝 / 外殼 | 357-Ball PBGA, 25 x 25 mm | 357-BBGA (PBGA, 25x25 mm) |
| Packaging | Tray | — |
| Lead-Free Status | Contains Lead | — |
| RoHS 狀態 | Non-RoHS (legacy BGA, contains lead) | RoHS Compliant |
| 工作溫度 | 0C to +70C (commercial grade) | -40C to +95C |
| Part Status | Not For New Designs | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | MPC8xx PowerQUICC |
| Core Architecture | — | PowerPC |
| Core Count | — | 1 (plus CPM RISC engine) |
| 資料匯流排寬度 | — | 32-bit |
| 最大時脈頻率 | — | 66 MHz |
| 工作電源電壓 | — | 3.3 V nominal |
| 安裝類型 | — | Surface Mount (BGA) |
| MSL 等級 | — | 3 (168 hours) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Lead Free Status | — | Lead Free |
| REACH Status | — | REACH Unaffected |
| HTSUS | — | 8542.31.0001 |
| Lifecycle | — | End of Life (NXP product page marks EOL) |